Abstract: A cylindrical secondary battery comprises an outer package can with a cylindrical cylinder part and an electrode body arranged within the cylinder part. A ratio of the minimum value of the outer diameters in the cylinder central part of the outer package can, the cylinder central part being positioned in the center in the axial direction, to the average value of the outer diameters in the cylinder bottom end part is 99.89% or more; and the ratio of the maximum value of the outer diameters in the cylinder central part to the average value of the outer diameters in the cylinder bottom end part is 100.80% or less. The outer diameters in the cylinder central part periodically change with respect to the angle of circumference; and the period in which the outer diameters in the cylinder central part change with respect to the angle of circumference is 0.4? to 1.0?.

Abstract: A cylindrical secondary battery comprises an external can that has a cylindrical tube part and an electrode body that is provided inside the tube part. The electrode body is obtained by winding a positive electrode plate and a negative electrode plate with a separator therebetween. In the external can, the ratio of the average value of the outer diameter of the middle of the tube part in the axial direction of the external can to the average value of the outer diameter of the bottom-side end of the tube part is 100.10-100.50%, and the standard deviation of the outer diameter of the middle of the tube part is 0.020-0.050 mm.

Abstract: A composite integrated film includes a base member thin film having a base member first surface and a base member second surface facing each other, one or more penetration parts penetrating the base member first surface and the base member second surface of the base member thin film, one or more electrodes each including an electrical path part formed between the base member first surface and the base member second surface via the penetration part and an electrode surface in a planar shape formed on the base member second surface's side, and one or more elements provided on the base member first surface of the base member thin film and electrically connected to the electrodes, wherein the electrode surface and the base member second surface form a same flat surface.

Abstract: A housing has a housing main body and an outlet port. The housing main body includes a cylindrical housing inner wall that defines an internal space therein. The outlet port fluidly connects the internal space and an outside of the housing main body to each other. The valve has a valve body rotatable about an rotation axis along a rotation axis of the cylindrical housing inner wall. The valve is configured to selectively open and close the outlet port depending on a rotation position of the valve. The housing inner wall is formed such that a distance between the housing inner wall and the axis of the housing inner wall varies in a circumferential direction.

Abstract: A manufacturing method of a substrate unit includes forming a semiconductor laminated body on a substrate; forming a sacrificial layer on the semiconductor laminated body; forming a semiconductor functional layer on the sacrificial layer; and forming a protective film that covers at least a back surface of the substrate different from a formation surface on which the semiconductor laminated body is formed, a side face of the substrate, and a side face of the semiconductor laminated body.

Abstract: A manufacturing method of an electronic structure includes forming a second sacrificial layer extending from a substrate to a function part of a layered substrate including the substrate, a first sacrificial layer formed on the substrate, and the function part formed on the first sacrificial layer. The manufacturing method further includes forming a cover layer extending from the substrate to the second sacrificial layer, and removing the first sacrificial layer and the second sacrificial layer.

Abstract: A housing has a housing main body and an outlet port. The housing main body includes a cylindrical housing inner wall that defines an internal space therein. The outlet port fluidly connects the internal space and an outside of the housing main body to each other. The valve has a valve body rotatable about an rotation axis along a rotation axis of the cylindrical housing inner wall. The valve is configured to selectively open and close the outlet port depending on a rotation position of the valve. The housing inner wall is formed such that a distance between the housing inner wall and the axis of the housing inner wall varies in a circumferential direction.

Abstract: The blood circulation circuit 1 includes: a blood removal line 2 that removes venous blood; a blood storage tank 4 that is connected to the blood removal line 2 and stores the blood that has flowed through the blood removal line 2; a negative pressure adjusting device 6 that adjusts a negative pressure inside the blood storage tank 4; a blood pump 5 that pumps the blood in the blood storage tank 4; an artificial lung 7 that performs gas exchange of the blood pumped from the blood pump 5; and a blood collecting line 3 that is connected to the blood storage tank 4 and sucks blood from a surgical site by the negative pressure in the blood storage tank 4.

Abstract: A manufacturing method of a semiconductor element includes forming a plurality of semiconductor layers on a sapphire substrate, each of the semiconductor layers having a first surface on the sapphire substrate side and a second surface on the opposite side, joining the second surfaces of the plurality of semiconductor layers to a retention member via an adhesive member, peeling off the plurality of semiconductor layers from the sapphire substrate by irradiating the first surfaces of the plurality of semiconductor layers with laser light, and polishing the first surfaces of the plurality of semiconductor layers. At least one semiconductor layer among the plurality of semiconductor layers includes a polishing indication part extending from the second surface toward the first surface. The polishing is executed until the polishing indication part is exposed to the polished surface.

Abstract: A manufacturing method of an electronic device includes forming a support layer that is provided to extend from a first surface of a functional layer formed on a first substrate via a first layer, as a surface on a side opposite to the first substrate, to the first substrate and supports the functional layer with respect to the first substrate, forming a thin film holding layer on at least one of the support layer and the first surface of the functional layer, removing the first layer, joining a transfer member to a surface of the thin film holding layer on a side opposite to the functional layer, separating the functional layer, the support layer and the thin film holding layer from the first substrate, transferring the functional layer, the support layer and the thin film holding layer to a different second substrate, and removing the thin film holding layer.

Abstract: A manufacturing method of a semiconductor element includes forming a plurality of islands, each including a semiconductor layer containing a nitride semiconductor and a support formed on the semiconductor layer, on a sapphire substrate, joining the support to a retention substrate via an adhesive member, peeling off the semiconductor layer from the sapphire substrate by irradiating the semiconductor layer with laser light, and polishing a surface of the semiconductor layers peeled off from the sapphire substrate.

Abstract: An actuator having good interlayer adhesion at a lamination interface, good conductivity of an electrode layer, and good smoothness of the electrode layer is provided. The actuator includes a plurality of elastomer layers and a plurality of electrode layers, and the elastomer layers and electrode layers are alternately laminated. The electrode layer contains carbon black, a content of the carbon black in the electrode layer is 10% by mass or more and 20% by mass or less, and a specific surface area of the carbon black is 380 g/m2 or more and 800 m2/g or less.

Abstract: In a clamping device, the number of components for an article detection means is reduced. In a stacker, a tire is placed on the carry surface. The first gripping member and the second gripping member grip a side of tire placed on the carry surface and include an abutment surface having a bent portion and are capable of abutting with the side of tire. The first sensor and the second sensor include a light axis in a direction along the article. The controller moves the first gripping member and the second gripping member close to each other to the first position where the tire is not gripped. When the tire is detected with the first sensor and second sensor, the controller moves the first gripping member and the second gripping member close to each other to the second position where the tire is gripped.

Abstract: A housing has a housing main body and an outlet port. The housing main body includes a cylindrical housing inner wall that defines an internal space therein. The outlet port fluidly connects the internal space and an outside of the housing main body to each other. The valve has a valve body rotatable about an rotation axis along a rotation axis of the cylindrical housing inner wall. The valve is configured to selectively open and close the outlet port depending on a rotation position of the valve. The housing inner wall is formed such that a distance between the housing inner wall and the axis of the housing inner wall varies in a circumferential direction.

Abstract: A housing has a housing main body and an outlet port. The housing main body includes a cylindrical housing inner wall that defines an internal space therein. The outlet port fluidly connects the internal space and an outside of the housing main body to each other. The valve has a valve body rotatable about an rotation axis along a rotation axis of the cylindrical housing inner wall. The valve is configured to selectively open and close the outlet port depending on a rotation position of the valve. The housing inner wall is formed such that a distance between the housing inner wall and the axis of the housing inner wall varies in a circumferential direction.

Abstract: A piezoelectric-body film joint substrate includes a substrate, a substrate electrode provided on the substrate, a first piezoelectric-body film stuck on the substrate electrode and including a first piezoelectric film and a first upper electrode film formed on the first piezoelectric film, and a second piezoelectric-body film stuck on the first upper electrode film and including a second piezoelectric film different from the first piezoelectric film and a second upper electrode film formed on the second piezoelectric film.

Abstract: A piezoelectric film integrated device includes a substrate; an electrode provided on the substrate; a first piezoelectric element that is provided on the electrode and includes a first monocrystalline piezoelectric film and a first electrode film superimposed on the first monocrystalline piezoelectric film; and a second piezoelectric element that is provided on the first piezoelectric element and includes a second monocrystalline piezoelectric film and a second electrode film superimposed on the second monocrystalline piezoelectric film.

Abstract: A piezoelectric-body film joint substrate includes a substrate, a first electrode provided on the substrate, a first piezoelectric-body film stuck on the first electrode and including a first piezoelectric film and a first upper electrode film formed on the first piezoelectric film, a second electrode provided on the substrate, and a second piezoelectric-body film stuck on the second electrode and including a second piezoelectric film different from the first piezoelectric film and a second upper electrode film formed on the second piezoelectric film, wherein a height from an upper surface of the substrate, on which the first electrode and the second electrode are formed, to a top of the first upper electrode film and a height from the upper surface of the substrate to a top of the second upper electrode film differ from each other.

Abstract: A piezoelectric film integrated device include a substrate; a first electrode provided on the substrate; a second electrode provided on the substrate; a first monocrystalline piezoelectric film provided on the first electrode; a second monocrystalline piezoelectric film provided on the second electrode and having a crystal structure different from a crystal structure of the first monocrystalline piezoelectric film; a third electrode provided on the first monocrystalline piezoelectric film; and a fourth electrode provided on the second monocrystalline piezoelectric film.

Abstract: An electronic structure includes: a substrate having a first surface; a functional element unit including a functional element having an electronic function, and a protector covering the functional element, the functional element unit having a second surface facing the first surface; a support disposed between the first surface and the second surface, the support supporting the second surface; and a projection disposed on a first surface side of the substrate, the projection projecting toward the functional element unit. The support has a third surface in contact with the second surface of the functional element unit, the third surface having an area smaller than an area of the second surface. The projection has a fourth surface in contact with or close to the functional element unit, the fourth surface having an area smaller than the area of the second surface, the projection being formed by a different material from the support.