Abstract: According to one embodiment, coupling capacitance in a state in which a first heat radiation member is arranged between parallel flat plates of a first capacitor formed by a surface of a housing opposed to one surface of a printed circuit board and the printed circuit board is smaller than coupling capacitance in a state in which an integrally formed object having a relative dielectric constant of 5.8 is arranged between the first capacitor to cover a first radiating region containing the controller and the first nonvolatile semiconductor memories.

Abstract: According to one embodiment, coupling capacitance in a state in which a first heat radiation member is arranged between parallel flat plates of a first capacitor formed by a surface of a housing opposed to one surface of a printed circuit board and the printed circuit board is smaller than coupling capacitance in a state in which an integrally formed object having a relative dielectric constant of 5.8 is arranged between the first capacitor to cover a first radiating region containing the controller and the first nonvolatile semiconductor memories.

Abstract: According to one embodiment, coupling capacitance in a state in which a first heat radiation member is arranged between parallel flat plates of a first capacitor formed by a surface of a housing opposed to one surface of a printed circuit board and the printed circuit board is smaller than coupling capacitance in a state in which an integrally formed object having a relative dielectric constant of 5.8 is arranged between the first capacitor to cover a first radiating region containing the controller and the first nonvolatile semiconductor memories.

Abstract: According to one embodiment, coupling capacitance in a state in which a first heat radiation member is arranged between parallel flat plates of a first capacitor formed by a surface of a housing opposed to one surface of a printed circuit board and the printed circuit board is smaller than coupling capacitance in a state in which an object having a relative dielectric constant of 5.8 is arranged solid between the parallel flat plates of the first capacitor.

Abstract: A SSD apparatus includes a first memory module, a second memory module, a module controller which determines a method of controlling the first and second memory modules, a control board mounted with the module controller, a first connector which a module board of the first memory module and the control board are connected to, a second connector which a module board of the second memory module and the control board are connected to, and an interface device connected to the control board. A memory chip and a memory controller are mounted on one surface of the module board of each of the first and second memory modules. The other surface of the module board of the first memory module is faced to the other surface of the module board of the second memory module.

Abstract: A connector device has connection terminals set in a connector body, each having a contact section formed for inspection. Further, a drive device is such that the connector device is attached to a printed circuit board having a circuit unit configured to control an object to be controlled.

Abstract: Two magnetically sensitive poles are disposed on one chip with theoretically required dimensional accuracy. Therefore, the two magnetically sensitive poles can be disposed on a motor with high positional accuracy. Moreover, the simultaneous formation of the two magnetically sensitive poles in the same chip enables accurate matching of sensitivities between both magnetically sensitive poles when a magnetically sensitive film is printed on the chip.

Abstract: A connector device has connection terminals set in a connector body, each having a contact section formed for inspection. Further, a drive device is such that the connector device is attached to a printed circuit board having a circuit unit configured to control an object to be controlled.