Patents by Inventor Takakazu Fukumoto

Takakazu Fukumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked semiconductor device structure
    Patent number: 6777798
    Abstract: A stacked semiconductor device structure comprising: a plurality of semiconductor modules each of which includes a substrate and at least one semiconductor device mounted on the substrate; a stacking device for stacking the semiconductor modules on one another; and a surface mount device for surface mounting on a further substrate for a system appliance the semiconductor modules stacked on one another by the stacking device.
    Type: Grant
    Filed: March 4, 2003
    Date of Patent: August 17, 2004
    Assignee: Renesas Technology Corp.
    Inventors: Takakazu Fukumoto, Muneharu Tokunaga, Tetsuya Matsuura
  • Stacked layer type semiconductor device and its manufacturing method
    Publication number: 20040130017
    Abstract: A multi-layered substrate comprising a plurality of substrates stacked with an insulation layer in between. One or more semiconductor chips arranged within the insulation layer lying between a plurality of substrates. The substrates constitute the connection pads for the semiconductor chips, and connection pins to electrically connect the connection pads of the semiconductor chips.
    Type: Application
    Filed: December 19, 2003
    Publication date: July 8, 2004
    Applicant: RENESAS TECHNOLOGY CORP.
    Inventor: Takakazu Fukumoto
  • Clip-type lead frame for electrically connecting two substrates or devices
    Patent number: 6688892
    Abstract: A subject of the present invention is to provide a clip-type lead frame having flexibility against a board thickness variation caused by not only an uneven product quality but also several different thick type products. To this end, the provided clip-type lead frame has a height adjustable means at lead pins corresponding to upper or/and lower side connection pads of the semiconductor device or the sub-board.
    Type: Grant
    Filed: July 25, 2002
    Date of Patent: February 10, 2004
    Assignee: Renesas Technology Corp.
    Inventors: Takakazu Fukumoto, Hajime Maeda, Tetsuya Takeoka
  • Stacked semiconductor device structure
    Publication number: 20030127729
    Abstract: A stacked semiconductor device structure comprising: a plurality of semiconductor modules each of which includes a substrate and at least one semiconductor device mounted on the substrate; a stacking device for stacking the semiconductor modules on one another; and a surface mount device for surface mounting on a further substrate for a system appliance the semiconductor modules stacked on one another by the stacking device.
    Type: Application
    Filed: March 4, 2003
    Publication date: July 10, 2003
    Inventors: Takakazu Fukumoto, Muneharu Tokunaga, Tetsuya Matsuura
  • Clip-type lead frame for electrically connecting two substrates or devices
    Publication number: 20030119340
    Abstract: A subject of the present invention is to provide a clip-type lead frame having flexibility against a board thickness variation caused by not only an uneven product quality but also several different thick type products. To this end, the provided clip-type lead frame has a height adjustable means at lead pins corresponding to upper or/and lower side connection pads of the semiconductor device or the sub-board.
    Type: Application
    Filed: July 25, 2002
    Publication date: June 26, 2003
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takakazu Fukumoto, Hajime Maeda, Tetsuya Takeoka
  • Stacked semiconductor device structure
    Publication number: 20020105068
    Abstract: A stacked semiconductor device structure comprising: a plurality of semiconductor modules each of which includes a substrate and at least one semiconductor device mounted on the substrate; a stacking device for stacking the semiconductor modules on one another; and a surface mount device for surface mounting on a further substrate for a system appliance the semiconductor modules stacked on one another by the stacking device.
    Type: Application
    Filed: September 7, 2001
    Publication date: August 8, 2002
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Takakazu Fukumoto, Muneharu Tokunaga, Tetsuya Matsuura
  • Memory module
    Patent number: 6038132
    Abstract: A memory module capable of changing the generation of semiconductor memory devices by changing the design of a unit board without changing the design of a mother board.The mother board has connection terminals having an ability of connecting with first and second generation type unit boards, so that even when a connection terminal location is changed as a result of the generation change of the semiconductor memory devices, the next unit board can be connected to the mother board by selecting an appropriate terminal from connection terminals on the mother board.
    Type: Grant
    Filed: May 7, 1997
    Date of Patent: March 14, 2000
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Muneharu Tokunaga, Takakazu Fukumoto
  • Semiconductor device
    Patent number: D458234
    Type: Grant
    Filed: July 12, 2001
    Date of Patent: June 4, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takakazu Fukumoto, Muneharu Tokunaga, Tetsuya Matsuura
  • Semiconductor device
    Patent number: D459316
    Type: Grant
    Filed: July 12, 2001
    Date of Patent: June 25, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takakazu Fukumoto, Muneharu Tokunaga, Tetsuya Matsuura
  • Semiconductor device
    Patent number: D459317
    Type: Grant
    Filed: July 12, 2001
    Date of Patent: June 25, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takakazu Fukumoto, Muneharu Tokunaga, Tetsuya Matsuura
  • Semiconductor device
    Patent number: D460744
    Type: Grant
    Filed: July 10, 2001
    Date of Patent: July 23, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takakazu Fukumoto, Muneharu Tokunaga, Tetsuya Matsuura
  • Semiconductor device
    Patent number: D460951
    Type: Grant
    Filed: July 12, 2001
    Date of Patent: July 30, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takakazu Fukumoto, Muneharu Tokunaga, Tetsuya Matsuura
  • Semiconductor device
    Patent number: D461171
    Type: Grant
    Filed: July 11, 2001
    Date of Patent: August 6, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takakazu Fukumoto, Muneharu Tokunaga, Tetsuya Matsuura
  • Semiconductor device
    Patent number: D465773
    Type: Grant
    Filed: December 4, 2001
    Date of Patent: November 19, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takakazu Fukumoto, Muneharu Tokunaga, Tetsuya Matsuura