Patents by Inventor Takami Hikita

Takami Hikita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080285931
    Abstract: An optical waveguide having excellent resistance to moisture, which includes an under cladding layer 2a formed on a substrate 1, core portions 3 formed in a predetermined pattern on the above-mentioned under cladding layer 2a for propagating an optical signal, and an over cladding layer 2b formed so as to cover the above-mentioned core portions 3. At least either the above-mentioned cladding layers 2a and 2b or the core portions 3 are formed of a resin composition containing a polyfunctional oxetane compound having a dicyclopentadiene ring which is represented by the following general formula (1): wherein the groups R1 may be the same as or different from each other and each represent a hydrogen atom or an alkyl group having one to six carbon atoms, and n is 0 or a positive number ranging from 1 to 5.
    Type: Application
    Filed: May 16, 2008
    Publication date: November 20, 2008
    Applicant: NITTO DENKO CORPORATION
    Inventor: Takami HIKITA
  • Publication number: 20080221341
    Abstract: The present invention relates to a trisoxetane compound represented by the following formula (1): wherein each of R1 and R3's represents a hydrogen atom or an alkyl group having 1 to 6 carbon atom(s); R2 represents a divalent aliphatic chained organic group having 0 to 16 carbon atom(s); and A represents a carbon atom or a trivalent organic group derived from a cycloalkane having 3 to 12 carbon atoms; a process for producing the same; and an optical waveguide including the same.
    Type: Application
    Filed: March 5, 2007
    Publication date: September 11, 2008
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takami Hikita, Yusuke Shimizu, Kazunori Mune
  • Publication number: 20080166096
    Abstract: An optical waveguide for a touch panel which is arranged for prevention of breakage of bending portions thereof and reduction in light loss. The optical waveguide for a touch panel is configured in a band shape so as to be wrapped around a periphery of a display of the touch panel with a bending portion thereof being positioned at a corner of the periphery of the display, and comprises a core, an under-cladding layer and an over-cladding layer which cooperatively enclose the core, and a reinforcement layer provided at least on a surface portion of the under-cladding layer present on an outer side of the bending portion, wherein the over-cladding layer is absent on an inner side of the bending portion.
    Type: Application
    Filed: January 9, 2008
    Publication date: July 10, 2008
    Applicant: NITTO DENKO CORPORATION
    Inventor: Takami HIKITA
  • Publication number: 20070237963
    Abstract: The present invention relates to a trisoxetane compound represented by the following formula (1): wherein R1 and R3 to R8 are the same or different and each represents a hydrogen atom or an alkyl group having 1 to 6 carbon atom(s) with the proviso that at least one of R3 to R8 is an alkyl group having 1 to 6 carbon atom(s); R2 represents a divalent aliphatic chained organic group having 0 to 16 carbon atom(s); and R9's each represents a hydrogen atom or an alkyl group having 1 to 6 carbon atom(s), a process for producing the same, and an optical waveguide including the same.
    Type: Application
    Filed: April 6, 2007
    Publication date: October 11, 2007
    Applicant: NITTO DENKO CORPORATION
    Inventor: Takami Hikita
  • Patent number: 7074882
    Abstract: The present invention provides a polyimide resin for an electrical insulating material which comprises a polyimide resin having a repeating unit represented by general formula (I): wherein R1 represents a bivalent organic group.
    Type: Grant
    Filed: July 2, 2004
    Date of Patent: July 11, 2006
    Assignee: Nitto Denko Corporation
    Inventors: Takami Hikita, Hisae Sugihara, Amane Mochizuki
  • Publication number: 20050260391
    Abstract: A wired circuit board on which a highly reliable conductor pattern is formed, to allow an electronic component to be mounted on it with improved accuracy. An insulating layer 3 is formed on a metal supporting layer 2 having a degree of surface brilliancy of 150-500% in such a manner as to have a haze value of 20-50% and also a conductor pattern 4 is formed on the insulating layer 3, thereby producing a TAB tape carrier 1. In this TAB tape carrier 1, since the metal supporting layer 2 has a specified degree of surface brilliancy of 500% or less, the pattern design of the conductor pattern 4 is optically examined to determine whether it is good or bad with high accuracy.
    Type: Application
    Filed: May 19, 2005
    Publication date: November 24, 2005
    Applicant: Nitto Denko Corporation
    Inventors: Kei Nakamura, Hitoshi Ishizaka, Atsushi Yoshida, Takami Hikita
  • Publication number: 20050043502
    Abstract: The present invention provides a resin and a resin composition having low elasticity and being excellent in flexibility while being excellent in heat resistance, electric characteristics and adhesivity, a film-forming material comprising the resin or resin composition, and an adhesive for electronic parts. The resin of the present invention is a polyamideimide resin comprising a structural unit represented by the following general formula (1) and at least one of the structural unit represented by the following general formula (2) and the structural unit represented by the following general formula (3). The number k of the structural unit represented by the general formula (1), the number m of the structural unit represented by the general formula (2), and the number n of the structural unit represented by the general formula (3) contained in the polyamide resin satisfy the relation of 0<m/(k+m+n)?0.
    Type: Application
    Filed: July 6, 2004
    Publication date: February 24, 2005
    Inventors: Takami Hikita, Takashi Kondo, Amane Mochizuki
  • Patent number: 6842576
    Abstract: The present invention provides a polymer lightguide which has a waveguide layer comprising a polyimide having a repeating unit represented by general formula (I): wherein R represents a bivalent organic group.
    Type: Grant
    Filed: May 17, 2004
    Date of Patent: January 11, 2005
    Assignee: Nitto Denko Corporation
    Inventors: Kazunori Mune, Amane Mochizuki, Takami Hikita, Kenichi Tagawa
  • Publication number: 20050004323
    Abstract: The present invention provides a polyimide resin for an electrical insulating material which comprises a polyimide resin having a repeating unit represented by general formula (I): wherein R1 represents a bivalent organic group.
    Type: Application
    Filed: July 2, 2004
    Publication date: January 6, 2005
    Inventors: Takami Hikita, Hisae Sugihara, Amane Mochizuki
  • Publication number: 20040234228
    Abstract: The present invention provides a polymer lightguide which has a waveguide layer comprising a polyimide having a repeating unit represented by general formula (I): 1
    Type: Application
    Filed: May 17, 2004
    Publication date: November 25, 2004
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kazunori Mune, Amane Mochizuki, Takami Hikita, Kenichi Tagawa
  • Patent number: 6503427
    Abstract: A heat-resistant polymer foam is disclosed which has excellent heat resistance, a fine cellular structure, and a low apparent density. The heat-resistant polymer foam comprises a heat-resistant polymer having a glass transition point of 120° C. or higher, e.g., a polyimide or polyether imide, and has an average cell diameter of from 0.01 &mgr;m to less than 10 &mgr;m. This heat-resistant polymer foam can be produced by, for example, impregnating a heat-resistant polymer under pressure with an non-reactive gas such as carbon dioxide, which is in, e.g., a supercritical state, reducing the pressure, and then heating the polymer at a temperature exceeding 120° C. to foam the polymer.
    Type: Grant
    Filed: June 6, 2000
    Date of Patent: January 7, 2003
    Assignee: Nitto Denko Corporation
    Inventors: Takayuki Yamamoto, Amane Mochizuki, Takami Hikita, Tomohiro Taruno, Tomohide Banba, Mitsuhiro Kanada
  • Patent number: 6414105
    Abstract: An aromatic polycarbodiimide comprising a structural unit represented by the following formula (I): where R is an organic group having 3 or more carbon atoms, and n is an integer of 2 to 300, and a polycarbodiimide solution, a polycarbodiimide sheet, and an insulated coated electric wire which are prepared using the aromatic polycarbodiimide. The aromatic polycarbodiimide has high solubility in an organic solvent, satisfactory workability, and excellent heat resistance and humidity resistance. The insulated coated electric wire has excellent durability and is highly reliable under high pressure, high humidity conditions.
    Type: Grant
    Filed: March 1, 2001
    Date of Patent: July 2, 2002
    Assignee: Nitto Denko Corporation
    Inventors: Sadahito Misumi, Michie Sakamoto, Takami Hikita, Michio Satsuma, Amane Mochizuki
  • Publication number: 20010039326
    Abstract: An aromatic polycarbodiimide comprising a structural unit represented by the following formula (I): 1
    Type: Application
    Filed: March 1, 2001
    Publication date: November 8, 2001
    Inventors: Sadahito Misumi, Michie Sakamoto, Takami Hikita, Michio Satsuma, Amane Mochizuki
  • Publication number: 20010031794
    Abstract: A heat-resistant polymer foam is disclosed which has excellent heat resistance, a fine cellular structure, and a low apparent density. The heat-resistant polymer foam comprises a heat-resistant polymer having a glass transition point of 120° C. or higher, e.g., a polyimide or polyether imide, and has an average cell diameter of from 0.01 &mgr;m to less than 10 &mgr;m. This heat-resistant polymer foam can be produced by, for example, impregnating a heat-resistant polymer under pressure with an non-reactive gas such as carbon dioxide, which is in, e.g., a supercritical state, reducing the pressure, and then heating the polymer at a temperature exceeding 120° C. to foam the polymer.
    Type: Application
    Filed: April 6, 2001
    Publication date: October 18, 2001
    Inventors: Takayuki Yamamoto, Amane Mochizuki, Takami Hikita, Tomohiro Taruno, Tomohide Banba, Mitsuhiro Kanada
  • Patent number: 6228972
    Abstract: An aromatic polycarbodiimide comprising a structure represented by the following formula (1) has high solubility in organic solvents, good processability, excellent moisture resistance, and water repellency: wherein n is an integer of 2 to 300, and R represents an organic group.
    Type: Grant
    Filed: October 20, 1999
    Date of Patent: May 8, 2001
    Assignee: Nitto Denko Corporation
    Inventors: Takami Hikita, Michie Sakamoto, Sadahito Misumi, Amane Mochizuki, Takahiro Fukuoka