Patents by Inventor Takanori Uejima

Takanori Uejima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12262519
    Abstract: A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more lower notches extending upward from the lower side. The metal member further includes a plurality of foot portions. All of the plurality of foot portions extend backward from the lower side.
    Type: Grant
    Filed: February 9, 2023
    Date of Patent: March 25, 2025
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shota Hayashi, Nobuaki Ogawa, Yuki Asano, Akihiro Muranaka, Takanori Uejima, Hiromichi Kitajima, Takahiro Eguchi
  • Patent number: 12261351
    Abstract: The radio frequency module includes a module substrate, an electronic component disposed on a main surface, a resin member covering at least part of the main surface and at least part of a side surface of the electronic component, and a metal shield layer that is formed on a surface of the resin member and is set to a ground potential. The electronic component has a top surface in contact with the metal shield layer, a bottom surface facing the main surface, a circuit portion formed at a position closer to the bottom surface than to the top surface, and a metal layer formed between the metal shield layer and the circuit portion. The metal layer is a barrier metal.
    Type: Grant
    Filed: May 3, 2023
    Date of Patent: March 25, 2025
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takanori Uejima, Shogo Yanase, Yuto Aoki, Yukiya Yamaguchi
  • Patent number: 12250017
    Abstract: A radio frequency module includes a mounting substrate, a first electronic component, a second electronic component, a resin layer, and a shield layer. The resin layer covers outer peripheral surfaces of the first electronic component and the second electronic component. The first electronic component includes a first substrate having first and second main surfaces opposed to each other, and a first circuit section formed on the first main surface side of the first substrate. The second electronic component includes a second substrate having first and second main surfaces opposed to each other, and a second circuit section formed on the first main surface side of the second substrate. A material of the first substrate and a material of the second substrate are the same. The shield layer is in contact with the second main surface of the first substrate and the second main surface of the second substrate.
    Type: Grant
    Filed: September 9, 2022
    Date of Patent: March 11, 2025
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Dai Nakagawa, Takanori Uejima, Yuji Takematsu, Naoya Matsumoto, Ryohei Okabe, Hiromichi Kitajima
  • Patent number: 12207390
    Abstract: A module includes: a board having a first main surface; a first component mounted on the first main surface; a first conductor column group including a plurality of conductor columns arranged on the first main surface along at least a part of an outer periphery of the first component; a first ground conductor disposed inside the board; a first conductor via group including a plurality of via conductors that connect the first ground conductor and an end of each of the conductor columns, the end of each of the conductor columns being located close to the first main surface; and a shield film disposed to cover over the first component. When viewed in a cross section taken along a plane perpendicular to the first main surface, the first component is at least partially surrounded by the first conductor column group, the first conductor via group, and the first ground conductor.
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: January 21, 2025
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Takahiro Kitazume, Takanori Uejima
  • Patent number: 12177976
    Abstract: A module includes: a board having a first main surface; a first component mounted on the first main surface; a first wire group including a plurality of wires disposed to extend across the first component; a first ground conductor disposed inside the board; and a first conductor via group including a plurality of via conductors that connect each of the wires belonging to the first wire group and the first ground conductor. The first component is surrounded by the first wire group, the first conductor via group, and the first ground conductor.
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: December 24, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Takahiro Kitazume, Takanori Uejima
  • Publication number: 20240421845
    Abstract: A radio frequency module includes a substrate having a mounting surface, components for transmission and a component for transmission and reception that are disposed on the mounting surface, acoustic wave filters disposed between each of the components for transmission and the component for transmission and reception, and shield electrodes each formed on a corresponding one of side surfaces of the acoustic wave filters.
    Type: Application
    Filed: June 12, 2024
    Publication date: December 19, 2024
    Inventors: Shogo YANASE, Nanami YUMURA, Masaki TADA, Yuusuke KISHI, Ryoya SHIOMI, Takanori UEJIMA, Naru MORITO, Masaki KIMURA, Hiroyuki NAGAMORI, Mizuki KINOSHITA, Minoru IWANAGA, Takuma KUROYANAGI
  • Publication number: 20240356570
    Abstract: A radio frequency module includes: a module substrate having a main surface; a conductive member to partition the main surface into regions in a plan view of the main surface, and being set to ground electric potential; a switch disposed in one of the regions and connected to an antenna connection terminal; a power amplifier disposed in one of the regions and connected to the antenna connection terminal via the switch; and a low-noise amplifier disposed in one of the regions and connected to the antenna connection terminal via the switch.
    Type: Application
    Filed: July 3, 2024
    Publication date: October 24, 2024
    Inventors: Hiromichi KITAJIMA, Takanori UEJIMA, Naoya MATSUMOTO
  • Patent number: 12096552
    Abstract: A radio frequency module includes: a first mounting board having a first principal surface and a second principal surface; a second mounting board having a third principal surface facing the second principal surface and a fourth principal surface; a transmission filter having a first mounting surface facing the second principal surface and a first top surface; and a reception filter having a second mounting surface facing the third principal surface and a second top surface; wherein the transmission and reception filters overlap at least partially in a plan view of the first and second mounting boards, an output terminal of the transmission filter is arranged on the first top surface, an input terminal of the reception filter is arranged on the second top surface, and the output and input terminals are connected by a conductive member not routed through the first mounting board or the second mounting board.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: September 17, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yuji Takematsu, Takanori Uejima, Sho Matsumoto, Tetsuro Harada, Dai Nakagawa, Naoya Matsumoto, Yutaka Sasaki, Yuuki Fukuda
  • Patent number: 12068764
    Abstract: A radio frequency module includes: a module substrate having a main surface; a conductive member to partition the main surface into regions in a plan view of the main surface, and being set to ground electric potential; a switch disposed in one of the regions and connected to an antenna connection terminal; a power amplifier disposed in one of the regions and connected to the antenna connection terminal via the switch; and a low-noise amplifier disposed in one of the regions and connected to the antenna connection terminal via the switch.
    Type: Grant
    Filed: February 1, 2023
    Date of Patent: August 20, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiromichi Kitajima, Takanori Uejima, Naoya Matsumoto
  • Patent number: 12057865
    Abstract: A radio-frequency module includes, for example, a low-band circuit configured to transfer a first transmit-signal group and a first receive-signal group in a low-band group, a middle-band circuit configured to transfer a second transmit-signal group and a second receive-signal group in a middle-band group, antenna connection terminals, a transmit-signal input terminal coupled to an output terminal of a power amplifier configured to amplify the first transmit-signal group, and a transmit-signal input terminal coupled to an output terminal of a power amplifier configured to amplify the second transmit-signal group. The low-band circuit includes duplexers, a switch, and a switch. The middle-band circuit includes duplexers, a switch, and a switch.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: August 6, 2024
    Assignee: MURATA MANUFACTINRG CO., LTD.
    Inventor: Takanori Uejima
  • Publication number: 20240258973
    Abstract: A tracker module is provide that includes an integrated circuit on a main surface of a module laminate, and at least one capacitor included in a switched-capacitor circuit disposed on the other main surface of the module laminate. The switched-capacitor circuit generates, based on an input voltage, a plurality of discrete voltages. The integrated circuit includes at least one switch included in the switched-capacitor circuit, and at least one switch included in a supply modulator that selectively outputs, based on an envelope signal, at least one of the plurality of discrete voltages. The at least one capacitor overlaps the integrated circuit in a plan view of the module laminate.
    Type: Application
    Filed: April 5, 2024
    Publication date: August 1, 2024
    Inventors: Takeshi KOGURE, Takanori UEJIMA, Masanari MIURA
  • Patent number: 12046810
    Abstract: A radio-frequency module includes: a module substrate; a first circuit component and a second circuit component that are disposed inside the module substrate; and a metal shield plate set to a ground potential. The module substrate includes a dielectric part including a first dielectric material, and a dielectric part including a second dielectric material and located inward of the dielectric part, the second dielectric material having a relative permittivity different from that of the first dielectric material. The metal shield plate is disposed between the first circuit component and the second circuit component and in the dielectric part.
    Type: Grant
    Filed: March 1, 2023
    Date of Patent: July 23, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takanori Uejima, Hiromichi Kitajima
  • Patent number: 12047041
    Abstract: A semiconductor devices comprises a first member including a first circuit partially formed by an elemental semiconductor element at a surface layer, a first conductive raised portion at the first member, and a second member smaller than the first member in plan view joined to the first member. The second member includes a second circuit partially formed by a compound semiconductor element. A second conductive raised portion is at the second member. A power amplifier includes a first-stage amplifier circuit included in the first or second circuit and a second-stage amplifier circuit included in the second circuit. The first circuit includes a first switch for inputting to the first-stage amplifier circuit a radio-frequency signal inputted to a selected contact, a control circuit to control the first- and second-stage amplifier circuits, and a second switch for outputting from a selected contact a radio-frequency signal outputted by the second-stage amplifier circuit.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: July 23, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shunji Yoshimi, Yuji Takematsu, Yukiya Yamaguchi, Takanori Uejima, Satoshi Goto, Satoshi Arayashiki
  • Publication number: 20240243697
    Abstract: A tracker module is provided that includes a module laminate, an integrated circuit disposed on the module laminate, and a power inductor disposed on the module laminate. The integrated circuit includes at least one switch included in a pre-regulator circuit that converts an input voltage into a first voltage using the power inductor, at least one switch included in a switched-capacitor circuit that generates a plurality of discrete voltages from the first voltage, and at least one switch included in a supply modulator that selectively outputs, based on an envelope signal, at least one of the plurality of discrete voltages.
    Type: Application
    Filed: March 28, 2024
    Publication date: July 18, 2024
    Inventors: Takanori UEJIMA, Masanari MIURA, Takeshi KOGURE
  • Patent number: 12015433
    Abstract: A radio frequency module includes a module board, a transmission power amplifier, a first inductance element mounted on a first principal surface and connected to an output terminal of the transmission power amplifier, a reception low-noise amplifier, and a second inductance element mounted on a first principal surface connected to an input terminal of the reception low-noise amplifier. In a plan view of the module board, a conductive member mounted on the first principal surface is disposed between the first inductance element and the second inductance element.
    Type: Grant
    Filed: May 1, 2023
    Date of Patent: June 18, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takanori Uejima
  • Patent number: 11961830
    Abstract: A module includes: a board having a first surface; a first component and a second component mounted on the first surface; and a wire disposed to extend across the first component and having one end and the other end. The one end is connected to the second component. The wire is grounded.
    Type: Grant
    Filed: February 16, 2022
    Date of Patent: April 16, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Motohiko Kusunoki, Takanori Uejima
  • Publication number: 20240105628
    Abstract: A radio frequency module includes a mounting substrate, a first electronic component, a second electronic component, a connection terminal, and a wiring layer. The second electronic component is disposed on the second main surface of the mounting substrate. The connection terminal is disposed on the second main surface of the mounting substrate and is connected to the mounting substrate and the wiring layer. The wiring layer faces the second main surface of the mounting substrate with the second electronic component interposed therebetween and is in contact with the connection terminal. The wiring layer has a base material and an external connection electrode. The base material has a second conductive member connected to the first conductive member of the mounting substrate with the connection terminal interposed therebetween. The external connection electrode is connected to the second conductive member. The wiring layer is in contact with the second electronic component.
    Type: Application
    Filed: October 27, 2023
    Publication date: March 28, 2024
    Inventors: Hiromichi KITAJIMA, Takanori UEJIMA, Naoya MATSUMOTO
  • Publication number: 20240106468
    Abstract: An increase in cost can be suppressed. A high frequency module includes a mounting substrate, a first electronic component, a second electronic component, a resin layer, and a metal layer. The first electronic component and the second electronic component are disposed on a first main surface of the mounting substrate. The metal layer has a ground potential and covers a part of the resin layer. The metal layer overlaps a part of the first electronic component and overlaps a part of the second electronic component in plan view from a thickness direction of the mounting substrate. A height of the first electronic component is lower than a height of the second disposal condition in the thickness direction of the mounting substrate. A part of a main surface of the first electronic component that is far away from the mounting substrate is in contact with the metal layer.
    Type: Application
    Filed: December 7, 2023
    Publication date: March 28, 2024
    Inventors: Takanori UEJIMA, Hiromichi KITAJIMA
  • Publication number: 20240097719
    Abstract: A radio-frequency circuit includes an antenna connection terminal, switch circuits, a duplexer, a low-pass filter, and a high-pass filter. The switch circuit includes a port connected to the antenna connection terminal and ports. The switch circuit includes a single transmission port connected to the port, a simultaneous transmission port connected to ports. The duplexer is connected to the port. The low-pass filter is disposed on a signal path connecting the port and the simultaneous transmission port. The high-pass filter is connected to the port. No filter is disposed on a signal path connecting the port and the single transmission port.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 21, 2024
    Inventors: Takanori UEJIMA, Kenji TAHARA, Hiroyuki NAGAMORI, Takahiro KATAMATA
  • Publication number: 20240072838
    Abstract: A high-frequency module includes a mounting board, a first electronic component, a first resin layer, and a first ground electrode. The mounting board has a first principal surface and a second principal surface opposite to each other. The first electronic component is disposed on the first principal surface of the mounting board. The first resin layer is disposed on the first principal surface of the mounting board, and covers at least a part of an outer peripheral surface of the first electronic component. The first ground electrode covers at least a part of the first resin layer. A principal surface of the first electronic component opposite to the mounting board is in contact with the first ground electrode. The mounting board includes a second ground electrode inside the mounting board. The first ground electrode is not in contact with the second ground electrode.
    Type: Application
    Filed: October 18, 2023
    Publication date: February 29, 2024
    Inventors: Hiromichi KITAJIMA, Dai NAKAGAWA, Takanori UEJIMA