Patents by Inventor Takanori Uejima

Takanori Uejima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11075547
    Abstract: A coil module is disposed inside an electronic apparatus and receives prescribed power. The coil module includes a loop coil, a plate-like magnetic body that is disposed on the loop coil, and a conductive member that has prescribed conductivity and is disposed parallel with the plate-like magnetic body and on a surface, opposite to a surface on which the loop coil is disposed, of the magnetic body. The conductive member projects outward relative to at least a portion of a circumferential surface of the magnetic body.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: July 27, 2021
    Assignee: Sovereign Peak Ventures, LLC
    Inventors: Takanori Hirobe, Yoshio Koyanagi, Hiroyuki Uejima
  • Publication number: 20210226652
    Abstract: A radio-frequency module includes a mounting substrate having a first main surface and a second main surface on opposite sides of the mounting substrate; an external connection terminal arranged on the first main surface; and a first transmission power amplifier arranged on the first main surface. The first transmission power amplifier includes an amplifier first main surface closest to the first main surface, an amplifier second main surface that faces away from the amplifier first main surface, a first input-output electrode arranged on the amplifier first main surface and through which a radio-frequency signal input into the first transmission power amplifier or a radio-frequency signal output from the first transmission power amplifier is transmitted, and a first ground electrode arranged on the amplifier second main surface.
    Type: Application
    Filed: April 7, 2021
    Publication date: July 22, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Sho MATSUMOTO, Takanori UEJIMA, Yuji TAKEMATSU, Tetsuro HARADA, Dai NAKAGAWA, Naoya MATSUMOTO, Yutaka SASAKI, Yuuki FUKUDA
  • Publication number: 20210219419
    Abstract: A radio frequency module includes: a first mounting board having a first principal surface and a second principal surface; a second mounting board having a third principal surface facing the second principal surface and a fourth principal surface; a transmission filter having a first mounting surface facing the second principal surface and a first top surface; and a reception filter having a second mounting surface facing the third principal surface and a second top surface; wherein the transmission and reception filters overlap at least partially in a plan view of the first and second mounting boards, an output terminal of the transmission filter is arranged on the first top surface, an input terminal of the reception filter is arranged on the second top surface, and the output and input terminals are connected by a conductive member not routed through the first mounting board or the second mounting board.
    Type: Application
    Filed: March 30, 2021
    Publication date: July 15, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Yuji TAKEMATSU, Takanori UEJIMA, Sho MATSUMOTO, Tetsuro HARADA, Dai NAKAGAWA, Naoya MATSUMOTO, Yutaka SASAKI, Yuuki FUKUDA
  • Publication number: 20210194530
    Abstract: A radio frequency module includes a first reception low-noise amplifier that amplifies a radio frequency reception signal of a first communication band, a second reception low-noise amplifier configured to amplify a radio frequency reception signal of a second communication band different from the first communication band, and a module board which includes a first principal surface and a second principal surface on opposite sides of the module board, and on which the first reception low-noise amplifier and the second reception low-noise amplifier are mounted. The first reception low-noise amplifier is disposed on the first principal surface, and the second reception low-noise amplifier is disposed on the second principal surface.
    Type: Application
    Filed: December 8, 2020
    Publication date: June 24, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Takanori UEJIMA
  • Publication number: 20210152195
    Abstract: A radio frequency module includes: a module board including first and second principal surfaces; a first transfer circuit that transfers a radio frequency signal of a low band group; a second transfer circuit that transfers a radio frequency signal of a middle band group; and a third transfer circuit that transfers a radio frequency signal of a high band group. The first transfer circuit includes: a first filter having the low band group as a passband; and a first circuit component disposed on a transmission path of the low band group. The second transfer circuit includes a second filter having the middle band group as a passband. The third transfer circuit includes a third filter having the high band group as a passband. The second filter and the third filter are disposed on the first principal surface, and the first circuit component is disposed on the second principal surface.
    Type: Application
    Filed: October 29, 2020
    Publication date: May 20, 2021
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Takanori UEJIMA
  • Publication number: 20210152210
    Abstract: A radio frequency module includes a module board, a transmission power amplifier, a first inductance element connected to an output terminal of the transmission power amplifier, a reception low-noise amplifier, and a second inductance element connected to an input terminal of the reception low-noise amplifier. The first inductance element is mounted on a first principal surface of the module board, and the second inductance element is mounted on a second principal surface of the module board.
    Type: Application
    Filed: December 8, 2020
    Publication date: May 20, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Takanori UEJIMA
  • Publication number: 20210153138
    Abstract: A radio frequency module includes a first transmission power amplifier configured to amplify a radio frequency signal of a first communication band, a second transmission power amplifier configured to amplify a radio frequency signal of a second communication band, and a module board which includes a first principal surface and a second principal surface on opposite sides of the module board, and on which the first transmission power amplifier and the second transmission power amplifier are mounted. The first transmission power amplifier is disposed on the first principal surface, and the second transmission power amplifier is disposed on the second principal surface.
    Type: Application
    Filed: December 8, 2020
    Publication date: May 20, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Takanori UEJIMA
  • Publication number: 20210152202
    Abstract: A radio frequency module includes a module board, a transmission power amplifier, a first inductance element mounted on a first principal surface and connected to an output terminal of the transmission power amplifier, a reception low-noise amplifier, and a second inductance element mounted on a first principal surface connected to an input terminal of the reception low-noise amplifier. In a plan view of the module board, a conductive member mounted on the first principal surface is disposed between the first inductance element and the second inductance element.
    Type: Application
    Filed: December 8, 2020
    Publication date: May 20, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Takanori UEJIMA
  • Publication number: 20210135695
    Abstract: A radio frequency module includes a module board, a transmission power amplifier, a first inductance element mounted on the module board and connected to an output terminal of the transmission power amplifier, a reception low noise amplifier, a first inductance element mounted on the module board and connected to an input terminal of the reception low noise amplifier, and a wall body made of plated metal and disposed on the module board. The wall body is disposed between the first inductance element and the second inductance element.
    Type: Application
    Filed: October 23, 2020
    Publication date: May 6, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Takanori UEJIMA
  • Patent number: 10971466
    Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to the transmission power amplifier, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view of the mounting board, a board main part placed outside the via conductor, and an insulating part placed inside the via conductor, and the bump electrode and the via conductor are connected while at least partially overlapping each other in the foregoing plan view, and the board main part and the insulating part are each composed of an insulating material of the same kind.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: April 6, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Katsunari Nakazawa, Takanori Uejima, Motoji Tsuda, Yuji Takematsu, Dai Nakagawa, Tetsuro Harada, Masahide Takebe, Naoya Matsumoto, Yoshiaki Sukemori, Mitsunori Samata, Yutaka Sasaki, Yuuki Fukuda
  • Publication number: 20210099190
    Abstract: A radio frequency module includes: a transmission power amplifier that includes a plurality of amplifying elements that are cascaded; and a module board on which the transmission power amplifier is mounted, the module board including a first principal surface and a second principal surface on opposite sides of the module board. The plurality of amplifying elements include: a first amplifying element mounted on the first principal surface; and a second amplifying element mounted on the second principal surface and disposed upstream on a signal path from the first amplifying element.
    Type: Application
    Filed: December 11, 2020
    Publication date: April 1, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Takanori UEJIMA
  • Publication number: 20210099191
    Abstract: A radio frequency module includes: a transmission power amplifier that includes a plurality of amplifying elements that are cascaded; a reception low noise amplifier; and a module board on which the transmission power amplifier and the reception low noise amplifier are mounted. The plurality of amplifying elements include: an amplifying element disposed most downstream; and an amplifying element disposed upstream of the amplifying element, and in a plan view of the module board, a conductive member is physically disposed between the amplifying element and the reception low noise amplifier.
    Type: Application
    Filed: December 14, 2020
    Publication date: April 1, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Takanori UEJIMA
  • Patent number: 10964657
    Abstract: A radio-frequency module includes: a transmission power amplifier that includes first and second amplification transistors that are cascade connected to each other; and a mounting substrate that has first and second main surface that face each other, the transmission power amplifier being mounted on the first main surface. The first amplification transistor is arranged in a final stage and has a first emitter terminal. The second amplification transistor is arranged in a stage preceding the first amplification transistor and has a second emitter terminal. The mounting substrate has first to fourth ground electrode layers in order of proximity to the first main surface. The first emitter terminal and the second emitter terminal are not electrically connected to each other via an electrode on the first main surface and are not electrically connected to each other via the first ground electrode layer.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: March 30, 2021
    Assignee: MURATA MANUFACTURING CO.. LTD.
    Inventors: Katsunari Nakazawa, Takanori Uejima, Motoji Tsuda, Yuji Takematsu, Dai Nakagawa, Tetsuro Harada, Masahide Takebe, Naoya Matsumoto, Yoshiaki Sukemori, Mitsunori Samata, Yutaka Sasaki, Yuki Fukuda
  • Patent number: 10950569
    Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to a principal surface of the transmission power amplifier and having an elongated shape in a plan view of the principal surface, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view, the length direction of the bump electrode and the length direction of the via conductor are aligned in the plan view, and the bump electrode and the via conductor are connected in an overlapping area where the bump electrode and the via conductor overlap at least partially in the plan view, and the overlapping area is an area elongated in the length direction.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: March 16, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Katsunari Nakazawa, Takanori Uejima, Motoji Tsuda, Yuji Takematsu, Dai Nakagawa, Tetsuro Harada, Masahide Takebe, Naoya Matsumoto, Yoshiaki Sukemori, Mitsunori Samata, Yutaka Sasaki, Yuki Fukuda
  • Publication number: 20200251459
    Abstract: A high-frequency module includes a mounting substrate having main surfaces 30a and 30b, a first circuit component mounted on the main surface 30a, a second circuit component mounted on the main surface 30b, an external connection terminal arranged on the main surface 30b side relative to the main surface 30a with respect to the mounting substrate, a long via conductor connected to the first circuit component, passing through the mounting substrate, and having a substantially long shape when the mounting substrate is viewed in a plan view, and a metal block arranged on the main surface 30b side relative to the main surface 30a with respect to the mounting substrate and connecting the long via conductor and the external connection terminal. When the mounting substrate is viewed in a plan view, the first circuit component overlaps the long via conductor and the metal block overlaps the long via conductor.
    Type: Application
    Filed: February 3, 2020
    Publication date: August 6, 2020
    Inventors: Motoji TSUDA, Takanori UEJIMA, Yuji TAKEMATSU, Katsunari NAKAZAWA, Masahide TAKEBE, Shou MATSUMOTO, Naoya MATSUMOTO, Yutaka SASAKI, Yuuki FUKUDA
  • Patent number: 10709045
    Abstract: A high frequency module includes an insulating substrate, a mountable element, and a shield conductor. The mountable element is mounted to a surface of the insulating substrate and includes a first mounting terminal. The shield conductor covers the mountable element in a spaced relationship to the mountable element. An exposing portion in which at least the first terminal is exposed is provided in the shield conductor, and a linear distance from the first terminal to the exposing portion is shorter than a linear distance from the first terminal to the shield conductor.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: July 7, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takanori Uejima
  • Publication number: 20200211998
    Abstract: A radio-frequency module includes: a transmitting circuit disposed on a mounting substrate to process a radio-frequency signal input from a transmission terminal and to output a resultant signal to a common terminal; a receiving circuit disposed on the mounting substrate to process a radio-frequency signal input from the common terminal and to output a resultant signal to a reception terminal; a first inductor included in a first transmitting circuit; and a bonding wire connected to the ground and bridging over the first inductor.
    Type: Application
    Filed: December 26, 2019
    Publication date: July 2, 2020
    Inventors: Takanori UEJIMA, Yuji TAKEMATSU, Naoya MATSUMOTO, Shou MATSUMOTO, Tetsuro HARADA, Dai NAKAGAWA, Yutaka SASAKI, Yuuki FUKUDA
  • Publication number: 20200203291
    Abstract: A radio frequency module includes a mounting substrate, a low-noise amplifier including an amplifying element and amplifying a radio frequency signal, and an impedance matching circuit including an integrated first inductor, in which the first inductor is connected to an input terminal of the low-noise amplifier, the low-noise amplifier and the impedance matching circuit are laminated in a direction perpendicular to a main surface of the mounting substrate, and a first multilayer body on which the low-noise amplifier and the impedance matching circuit are laminated is mounted on the main surface.
    Type: Application
    Filed: September 13, 2019
    Publication date: June 25, 2020
    Inventor: Takanori Uejima
  • Publication number: 20200051941
    Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to a principal surface of the transmission power amplifier and having an elongated shape in a plan view of the principal surface, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view, the length direction of the bump electrode and the length direction of the via conductor are aligned in the plan view, and the bump electrode and the via conductor are connected in an overlapping area where the bump electrode and the via conductor overlap at least partially in the plan view, and the overlapping area is an area elongated in the length direction.
    Type: Application
    Filed: July 15, 2019
    Publication date: February 13, 2020
    Inventors: Katsunari NAKAZAWA, Takanori UEJIMA, Motoji TSUDA, Yuji TAKEMATSU, Dai NAKAGAWA, Tetsuro HARADA, Masahide TAKEBE, Naoya MATSUMOTO, Yoshiaki SUKEMORI, Mitsunori SAMATA, Yutaka SASAKI, Yuki FUKUDA
  • Publication number: 20200051943
    Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to the transmission power amplifier, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view of the mounting board, a board main part placed outside the via conductor, and an insulating part placed inside the via conductor, and the bump electrode and the via conductor are connected while at least partially overlapping each other in the foregoing plan view, and the board main part and the insulating part are each composed of an insulating material of the same kind.
    Type: Application
    Filed: August 7, 2019
    Publication date: February 13, 2020
    Inventors: Katsunari NAKAZAWA, Takanori UEJIMA, Motoji TSUDA, Yuji TAKEMATSU, Dai NAKAGAWA, Tetsuro HARADA, Masahide TAKEBE, Naoya MATSUMOTO, Yoshiaki SUKEMORI, Mitsunori SAMATA, Yutaka SASAKI, Yuuki FUKUDA