Abstract: A high-frequency front-end circuit includes first and second switching circuits, first, second, and third splitters, and first and second lines. The first line is connected to the second splitter. The second line is connected to the third splitter. An adjustment circuit is connected between the first and second lines. The frequency of a harmonic signal of a transmission signal transmitted through the first line has a frequency band that is close to or overlaps the frequency of a reception signal transmitted through the second line. The impedance of the adjustment circuit is set such that a harmonic signal transmitted from the adjustment circuit to the second line and a harmonic signal transmitted from the third splitter to the second line are not in same phase with each other at the connection point between the adjustment circuit and the second line.

Abstract: A high-frequency front-end circuit (10) includes a band switch (20), duplexers (31, 32, and 33), and a main switch (40). The band switch (20) includes a common terminal (PC20) and selection terminals (PS21, PS22, and PS23). The main switch (40) includes a common terminal (PC40) and selection terminals (PS41, PS42, PS43). The duplexers (31, 32, and 33) are connected between the selection terminals (PS21 and PS41), between the selection terminals (PS22 and PS42), and between the selection terminals (PS23 and PS43), respectively. The selection terminal (PS23) is connected between the selection terminals (PS21 and PS22) and the selection terminal (PS43) is connected between the selection terminals (PS41 and PS42). First and second communication bands the frequency bands of which are close to or overlapped with each other are transmitted and received through the duplexers (31 and 32).

Abstract: An interlayer connection conductor penetrates through first layers of a multilayer body and projects from an upper surface. In a component mounting substrate, the projection length of the interlayer connection conductor from the upper surface in the lamination direction is adjusted such that a difference between a connection position of the interlayer connection conductor and a conductive bonding portion and a connection position of a connection electrode and a conductive bonding portion in the lamination direction is a difference. A difference between the length of the conductive bonding portion and the length of the conductive bonding portion in the lamination direction is canceled by the difference. As a result, the upper surface and a lower surface are parallel with each other to prevent a high-frequency component from tilting with respect to a mounting substrate, thereby preventing electric connection failure and lowering of bonding strength due to the tilt.

Abstract: In a high-frequency module, SAW duplexers are connected to a selection target terminal. A phase circuit is connected between a first SAW duplexer and the selection target terminal and a phase circuit is connected between a second SAW duplexer and the selection target terminal. The phase circuits make the second SAW duplexer side, when seen from the selection target terminal side, be in a substantially open state at a high frequency in the frequency bands of fundamental waves of first communication signals and make the first SAW duplexer side be in a substantially open state in the frequency bands of fundamental waves of second communication signals. The phase circuit is a band elimination filter having an attenuation pole near a third harmonic frequency band of the first transmission signal.

Abstract: A high-frequency switch module (10) includes a switch element (20) and an inductor (30). The switch element (20) includes a Hi band common terminal (P10), a Low band common terminal (P20), a plurality of selection target terminals (P11 to P14) that are selectively connected to the common terminal (P10), and a plurality of selection target terminals (P21 to P24) that are selectively connected to the common terminal (P20). The inductor (30) is connected between a first selection target terminal (P14) of the selection target terminals (P11 to P14) and a selection target terminal (P21) of the selection target terminals (P21 to P24). The selection target terminal (P14) and the selection target terminal (P21) are simultaneously used terminals that are used for electric paths through which transmission or reception using a plurality of communication bands is performed at the same time.

Abstract: A high frequency switch module (10) includes a switch device (20), a first inductor (30), and a filter device (40). The switch device (20) includes a shared terminal (P00) and selection target terminals (P02, P03) that are selectively connected to the shared terminal. The filter device (40) includes SAW filters (41, 42) connected to the selection target terminal (P02) and the selection target terminal (P03), respectively. A terminal of the SAW filters (41, 42) on the opposite side to the selection target terminals (P02, P03) is shared and connected to a front-end terminal (Pfe). The first inductor (30) is connected between the selection target terminal (P02) and the selection target terminal (P03).

Abstract: A high-frequency switch module (10) includes a switch element (20) and LC parallel resonant circuits (31 and 32). The switch element (20) includes selection target terminals (P14 and P21) used to transmit communication signals using different frequencies. The LC parallel resonant circuits (31 and 32) are connected between a connection conductor (901) connected to the selection target terminal (P14) and a connection conductor (902) connected to the selection target terminal (P21). The LC parallel resonant circuits (31 and 32) are connected in series between the connection conductors (901 and 902). The LC parallel resonant circuits (31 and 32) have different attenuation pole frequencies.

Abstract: A high-frequency switch module includes a switch element, a filter element, an inductor, and first and second transmission conductors. The switch element includes a common terminal and first and second selected terminals selectively connected to the common terminal. The first transmission conductor connects the first selected terminal and a SAW filter of the filter element. The second transmission conductor connects the second selected terminal and a SAW filter of the filter element. The inductor is connected between the first and second transmission conductors. A separation distance between at least a portion of the first transmission conductor and a portion of the second transmission conductor is shorter than a separation distance between a land conductor of the first selected terminal and a land conductor of the second selected terminal, and the transmission conductors are capacitively coupled.

Abstract: A multilayer substrate includes a component mounting electrode, an external mounting electrode, and a heat dissipating unit. The component mounting electrode is connected to an electronic component that is connected to an external structure. The heat dissipating unit is constituted by a plurality of via-conductors partially superposed each other in a stacking direction of the multilayer substrate and disposed continuously between the component mounting electrode and the external mounting electrode. The heat dissipating unit includes communicating portions, each in which one via-conductor is disposed per ceramic layer, and a branching portion in which a plurality of via-conductors are disposed continuously between the communicating portions per ceramic layer.

Abstract: A switch module includes a switch circuit, a chip device which is a coupler, a chip device that defines together with the coupler a common-terminal-side circuit, chip devices defining switching-terminal-side circuits, and a multilayer substrate. The multilayer substrate includes inner-layer ground electrodes. A first inner-layer ground electrode is closer to the chip device than a second inner-layer ground electrode and includes an opening arranged so as not to be superposed with the chip device when viewed in plan in the stacking direction of the multilayer substrate.

Abstract: A high-frequency switch module includes a switch IC, a phase adjustment circuit, and a filter circuit. The phase adjustment circuit, which includes an inductor and capacitors, includes a ?-type circuit in which the inductor is connected in series between an individual terminal and the filter circuit. The filter circuit is an LC parallel resonant circuit including a filter inductor and a filter capacitor. A distortion second harmonic signal from the individual terminal of the switch IC is reflected by the filter circuit through the phase adjustment circuit and returns to the switch IC through the phase adjustment circuit. This distortion second harmonic signal, whose phase is adjusted by the phase adjustment circuit, is cancelled out by a distortion second harmonic signal output to a common terminal of the switch IC.

Abstract: Impedance mismatching by a matching circuit provided on a signal line which connects a first common terminal and a second common terminal is eliminated so as to significantly reduce insertion loss of a switch module. Therefore, it is possible to provide a switch module which has a simple configuration without the need for connection of a matching circuit to antenna terminals to which antennas are respectively connected, and is able to selectively connect any one of the antennas and any one of communication systems.

Abstract: A switching module includes a common terminal, individual terminals connected to respective corresponding signal paths, and a switch portion that selectively switches and connects the common terminal to one of the individual terminals. The switch portion includes first switches and at least one second switch, each first switch being connected to the common terminal at one end portion within the switch, the at least one second switch being connected to the common terminal at one end portion via a connection wiring electrode provided on a wiring board. This does not allow directional connection between the one end portion of the second switch and the common terminal within the switch. Thus, mutual interference between a communication signal transmitted through the first switch and a communication signal transmitted through the second switch is prevented.

Abstract: A radio frequency front-end circuit includes a duplexer, a phase adjustment circuit, and a low noise amplifier. The phase adjustment circuit is connected between an Rx filter of the duplexer and the low noise amplifier. The phase adjustment circuit executes phase adjustment such that a quadrant in which an impedance ZLNA(fn) at a particular frequency different from a fundamental frequency of a reception signal when looking at the low noise amplifier side from the Rx filter is present and a quadrant in which an impedance ZRX(fn) at the particular frequency when looking at the Rx filter side from the low noise amplifier is present are not in a conjugate relation in terms of phase.

Abstract: A high-frequency front end circuit includes a duplexer, a phase adjustment circuit, and a power amplifier. The phase adjustment circuit is connected between the power amplifier and a transmission filter of the duplexer. The phase adjustment circuit carries out phase adjustment so that a quadrant in which an impedance ZRX (fr0) seen from the transmission filter toward the power amplifier at the fundamental frequency of a reception signal is present and a quadrant in which an impedance ZTX (fr0) seen from the power amplifier toward the transmission filter at the fundamental frequency of the reception signal is present are not in a conjugate relationship with respect to the phase.

Abstract: A switch module includes a plurality of mounting electrodes for external connection provided on a peripheral portion of one main surface of a wiring substrate. The plurality of mounting electrodes includes a common electrode, a plurality of RF signal electrodes, a control electrode, and a power supply electrode. At least one of the power supply electrode and the control electrode is arranged between the RF signal electrodes.

Abstract: A high-frequency module is connected to a switch port and a switch IC including an antenna connection port and a plurality of switch ports. The high-frequency module includes a signal path that outputs transmitting signals having a predetermined frequency band to the switch IC, a module port connected to the signal path and to which a duplexer and a transmitter circuit are connected, and a harmonic branch circuit that is provided on the signal path and allows a harmonic of the transmitting signal to escape to ground.

Abstract: A high-frequency module includes a first switch element and a second switch element that are mounted on a multilayer body. The first switch element includes a common terminal and individual terminals. The second switch element includes a common terminal and individual terminals. The individual terminals are connected to any of SAW filters mounted on the multilayer body or low loss filters provided inside the multilayer body. The individual terminals are grounded by being connected to an inner layer ground electrode inside the multilayer body by conductive via holes.

Abstract: In a high-frequency module, SAW duplexers are connected to a selection target terminal. A phase circuit is connected between a first SAW duplexer and the selection target terminal and a phase circuit is connected between a second SAW duplexer and the selection target terminal. The phase circuits make the second SAW duplexer side, when seen from the selection target terminal side, be in a substantially open state at a high frequency in the frequency bands of fundamental waves of first communication signals and make the first SAW duplexer side be in a substantially open state in the frequency bands of fundamental waves of second communication signals. The phase circuit is a band elimination filter having an attenuation pole near a third harmonic frequency band of the first transmission signal.

Abstract: A high frequency module is configured to be compatible with a cellular phone with a plurality of specifications without increasing the number of ports in a switching device. The high frequency module includes a switching device and a module board. The switching device includes a common port and connection switch ports. The module board includes external connection ports and a third filter circuit. An external connection port is connected to one of the connection switch ports of the switching device via a transmission line inside the module board. The third filter circuit is connected to a second external connection port and a third external connection port independently from the device connection ports of the switching device.