Patents by Inventor Takaomi Toi

Takaomi Toi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9711270
    Abstract: A common mode choke coil as an electronic component includes a laminate. The laminate includes insulating layers stacked in a thickness direction and has a recess sinking in a stacking direction of the insulating layers. The laminate includes at least one coil conductor therein. The recess is filled with a magnetic resin material. The magnetic resin material is formed of a magnetic powder-containing resin that is a mixture of a soft magnetic metal powder and a thermosetting resin. The soft magnetic metal powder has an average particle size of 12 ?m or less. The magnetic powder-containing resin contains 65 vol % or more and 85 vol % or less of the soft magnetic metal powder.
    Type: Grant
    Filed: February 18, 2016
    Date of Patent: July 18, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiroshi Marusawa, Takaomi Toi, Kosuke Ishida, Mizuho Katsuta
  • Publication number: 20160247623
    Abstract: A common mode choke coil as an electronic component includes a laminate. The laminate includes insulating layers stacked in a thickness direction and has a recess sinking in a stacking direction of the insulating layers. The laminate includes at least one coil conductor therein. The recess is filled with a magnetic resin material. The magnetic resin material is formed of a magnetic powder-containing resin that is a mixture of a soft magnetic metal powder and a thermosetting resin. The soft magnetic metal powder has an average particle size of 12 ?m or less. The magnetic powder-containing resin contains 65 vol % or more and 85 vol % or less of the soft magnetic metal powder.
    Type: Application
    Filed: February 18, 2016
    Publication date: August 25, 2016
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Hiroshi MARUSAWA, Takaomi TOI, Kosuke ISHIDA, Mizuho KATSUTA
  • Patent number: 7772956
    Abstract: A multilayer transformer component includes a chip body including a primary-side coil and a secondary-side coil, and first to fourth external electrodes. The primary-side coil includes a body portion, a first lead, and a second lead, and the secondary-side coil includes a body portion, a third lead, and a fourth lead. A first projection and a second projection of each body portion are arranged to lie substantially on a linear line. The first lead and the fourth lead are arranged to be line-symmetrical with respect to a center line which is arranged at an approximate center between respective distal ends of the first projection and the second projection, and which is perpendicular or substantially perpendicular to an overlying direction of the primary-side and secondary-side coils. The second lead and the third lead are also arranged to be line-symmetrical with respect to the center line.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: August 10, 2010
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takaomi Toi, Kosuke Ishida, Daisuke Ishide, Kazuhide Kudo
  • Patent number: 7633366
    Abstract: A wire-wound coil includes a ferrite core having a winding core portion and flange portions, a wire wound around the winding core portion, electrodes connected to the wire on lower surfaces of the flange portions, and a ferrite plate attached to upper surfaces of both of the end flange portions so as to extend over the winding core portion. The flange portions and the ferrite plate are provided with corresponding recessed and projecting portions and, and the flange portions and the ferrite plate are integrated through the recessed and projecting portions. Joint sections between the flange portions and the ferrite plate include contact sections that are in direct contact with each other, and adhesion sections arranged to receive an adhesive.
    Type: Grant
    Filed: May 21, 2008
    Date of Patent: December 15, 2009
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shinya Hirai, Takaomi Toi
  • Publication number: 20090243777
    Abstract: A multilayer transformer component includes a chip body including a primary-side coil and a secondary-side coil, and first to fourth external electrodes. The primary-side coil includes a body portion, a first lead, and a second lead, and the secondary-side coil includes a body portion, a third lead, and a fourth lead. A first projection and a second projection of each body portion are arranged to lie substantially on a linear line. The first lead and the fourth lead are arranged to be line-symmetrical with respect to a center line which is arranged at an approximate center between respective distal ends of the first projection and the second projection, and which is perpendicular or substantially perpendicular to an overlying direction of the primary-side and secondary-side coils. The second lead and the third lead are also arranged to be line-symmetrical with respect to the center line.
    Type: Application
    Filed: June 12, 2009
    Publication date: October 1, 2009
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takaomi TOI, Kosuke ISHIDA, Daisuke ISHIDE, Kazuhide KUDO
  • Publication number: 20080224813
    Abstract: A wire-wound coil includes a ferrite core having a winding core portion and flange portions, a wire wound around the winding core portion, electrodes connected to the wire on lower surfaces of the flange portions, and a ferrite plate attached to upper surfaces of both of the end flange portions so as to extend over the winding core portion. The flange portions and the ferrite plate are provided with corresponding recessed and projecting portions and, and the flange portions and the ferrite plate are integrated through the recessed and projecting portions. Joint sections between the flange portions and the ferrite plate include contact sections that are in direct contact with each other, and adhesion sections arranged to receive an adhesive.
    Type: Application
    Filed: May 21, 2008
    Publication date: September 18, 2008
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Shinya Hirai, Takaomi Toi
  • Patent number: 7373715
    Abstract: A wire-wound type chip coil can take various inductance values while maintaining its outer dimension at a specified fixed value. A chip coil is formed by winding at least two conductive wires regularly in a single layer around a core made of a magnetic material and firmly connecting both ends of each conductive wire to terminal electrodes disposed on respective flanges of the core. This makes it possible to obtain a great current capacity. Furthermore, the inductance decreases because of an increase in the magnetic path length. A great number of different inductance values can be easily obtained by properly selecting parameters including the number of substantially parallel conductive wires, the diameter of each conductive wire, and the number of turns.
    Type: Grant
    Filed: February 18, 2005
    Date of Patent: May 20, 2008
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shinya Hirai, Takaomi Toi, Katsuhiko Tsubana, Hiroyuki Yasuzawa
  • Patent number: 7196608
    Abstract: A wire-wound type chip coil can take various inductance values while maintaining its outer dimension at a specific fixed value. A chip coil is formed by winding at least two conductive wires regularly in a single layer around a core made of a magnetic material and firmly connecting both ends of each conductive wire to terminal electrodes disposed on respective flanges of the core. This makes it possible to obtain a great current capacity. Furthermore, the inductance decreases because of an increase in the magnetic path length. A great number of different inductance values can be easily obtained by properly selecting parameters including the number of substantially parallel conductive wires, the diameter of each conductive wire, and the number of turns.
    Type: Grant
    Filed: September 21, 2005
    Date of Patent: March 27, 2007
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shinya Hirai, Takaomi Toi, Katsuhiko Tsubana, Hiroyuki Yasuzawa
  • Patent number: 7051770
    Abstract: A coil-winding method for forming a coil unit includes the steps of winding first and second wires substantially parallel to each other simultaneously around a first layer position of a core to form a first turn, winding the first and second wires simultaneously to form a second turn while the second wire is disposed directly around the core, the first wire of the second turn adjacent to the first turn being disposed between the first and second wires of the first turn in the first layer so as to form a second layer, and winding the first and second wires simultaneously to form a third turn while the second wire is disposed directly around the core, the first wire of the third turn being disposed in the second layer and wound between the second wire of the first turn and the second wire of the second turn in the first layer.
    Type: Grant
    Filed: September 8, 2004
    Date of Patent: May 30, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Koki Sasaki, Takaomi Toi
  • Publication number: 20060033603
    Abstract: A wire-wound type chip coil can take various inductance values while maintaining its outer dimension at a specific fixed value. A chip coil is formed by winding at least two conductive wires regularly in a single layer around a core made of a magnetic material and firmly connecting both ends of each conductive wire to terminal electrodes disposed on respective flanges of the core. This makes it possible to obtain a great current capacity. Furthermore, the inductance decreases because of an increase in the magnetic path length. A great number of different inductance values can be easily obtained by properly selecting parameters including the number of substantially parallel conductive wires, the diameter of each conductive wire, and the number of turns.
    Type: Application
    Filed: September 21, 2005
    Publication date: February 16, 2006
    Inventors: Shinya Hirai, Takaomi Toi, Katsuhiko Tsubana, Hiroyuki Yasuzawa
  • Patent number: 6965289
    Abstract: A common-mode choke coil includes a core having flanges disposed at both ends and a winding section arranged between the flanges. Electrodes are disposed in the flanges, while two pieces of wire are wound around the winding section and ends of the pieces of wire are connected to the electrodes. A ferrite plate with a relative magnetic permeability that is smaller than that of the core is attached on the upper surface of the flanges with an adhesive so as to cover the wire.
    Type: Grant
    Filed: September 17, 2002
    Date of Patent: November 15, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takaomi Toi, Yoshio Hanato, Tatsuyuki Yamada
  • Publication number: 20050146409
    Abstract: A wire-wound type chip coil can take various inductance values while maintaining its outer dimension at a specified fixed value. A chip coil is formed by winding at least two conductive wires regularly in a single layer around a core made of a magnetic material and firmly connecting both ends of each conductive wire to terminal electrodes disposed on respective flanges of the core. This makes it possible to obtain a great current capacity. Furthermore, the inductance decreases because of an increase in the magnetic path length. A great number of different inductance values can be easily obtained by properly selecting parameters including the number of substantially parallel conductive wires, the diameter of each conductive wire, and the number of turns.
    Type: Application
    Filed: February 18, 2005
    Publication date: July 7, 2005
    Inventors: Shinya Hirai, Takaomi Toi, Katsuhiko Tsubana, Hiroyuki Yasuzawa
  • Publication number: 20050115628
    Abstract: A coil-winding method for forming a coil unit includes the steps of winding first and second wires substantially parallel to each other simultaneously around a first layer position of a core to form a first turn, winding the first and second wires simultaneously to form a second turn while the second wire is disposed directly around the core, the first wire of the second turn adjacent to the first turn being disposed between the first and second wires of the first turn in the first layer so as to form a second layer, and winding the first and second wires simultaneously to form a third turn while the second wire is disposed directly around the core, the first wire of the third turn being disposed in the second layer and wound between the second wire of the first turn and the second wire of the second turn in the first layer.
    Type: Application
    Filed: September 8, 2004
    Publication date: June 2, 2005
    Inventors: Koki Sasaki, Takaomi Toi
  • Patent number: 6804882
    Abstract: A coil device includes terminal electrodes each including a bottom-surface electrode provided on a bottom surface of a flange, side-surface electrodes provided on side surfaces of the flange, and an end-surface electrode provided on an end surface of the flange at the lower part of the end surface. The end-surface electrode is arranged on the end surface of the flange so that the upper edge of the end-surface electrode is disposed at a first level that is substantially the same as that of the upper edges of the side-surface electrodes in the vicinity of boundaries between the end surface and each side surface of the flange and is disposed at a second level lower than the first level at an approximate central portion of the end surface of the flange.
    Type: Grant
    Filed: July 19, 2002
    Date of Patent: October 19, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takaomi Toi, Koki Sasaki
  • Patent number: 6552642
    Abstract: An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag—Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.
    Type: Grant
    Filed: May 24, 1999
    Date of Patent: April 22, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takaomi Toi, Tetsuya Morinaga, Masahiro Bando, Tetsuo Hatakenaka, Kazuo Kasahara, Koki Sasaki, Takayuki Hirotsuji
  • Publication number: 20030071704
    Abstract: A common-mode choke coil which is capable of achieving a desired impedance value and reducing the amount of deviation in the impedance values, includes a core having flanges disposed at both ends and a winding section arranged between the flanges. Electrodes are disposed in the flanges, while two pieces of wire are wound around the winding section and ends of the pieces of wire are connected to the electrodes. A ferrite plate with a relative magnetic permeability that is smaller than that of the core is attached on the upper surface of the flanges with an adhesive so as to cover the wire. Thereby, the impedance value of the coil preferably has a relative magnetic permeability that is different from that of a coil having the same relative magnetic permeability of the ferrite plate as that of the core, thereby increasing the degree of freedom of the impedance value while changes in the impedance value are reliably prevented even when the ferrite plate is displaced.
    Type: Application
    Filed: September 17, 2002
    Publication date: April 17, 2003
    Inventors: Takaomi Toi, Yoshio Hanato, Tatsuyuki Yamada
  • Publication number: 20030030526
    Abstract: A wire-wound type chip coil can take various inductance values while maintaining its outer dimension at a specified fixed value. A chip coil is formed by winding at least two conductive wires regularly in a single layer around a core made of a magnetic material and firmly connecting both ends of each conductive wire to terminal electrodes disposed on respective flanges of the core. This makes it possible to obtain a great current capacity. Furthermore, the inductance decreases because of an increase in the magnetic path length. A great number of different inductance values can be easily obtained by properly selecting parameters including the number of substantially parallel conductive wires, the diameter of each conductive wire, and the number of turns.
    Type: Application
    Filed: August 9, 2002
    Publication date: February 13, 2003
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Shinya Hirai, Takaomi Toi, Katsuhiko Tsubana, Hiroyuki Yasuzawa
  • Patent number: 6515566
    Abstract: An electronic component is constructed to prevent Cu elution to a solder from a wire, and also prevents the wire from becoming thin and being broken. A chip coil includes electrodes provided at both ends of a core. The electrodes include an underlying metal layer (Ag), a Ni plated layer, and a Sn—Cu plated layer arranged in this sequence from the bottom thereof. Ends of a wire are embedded in the Sn—Cu plated layer of the electrodes by thermal compression bonding.
    Type: Grant
    Filed: October 2, 2000
    Date of Patent: February 4, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takaomi Toi, Tetsuya Morinaga
  • Publication number: 20020180574
    Abstract: A coil device includes terminal electrodes each including a bottom-surface electrode provided on a bottom surface of a flange, side-surface electrodes provided on side surfaces of the flange, and an end-surface electrode provided on an end surface of the flange at the lower part of the end surface. The end-surface electrode is arranged on the end surface of the flange so that the upper edge of the end-surface electrode is disposed at a first level that is substantially the same as that of the upper edges of the side-surface electrodes in the vicinity of boundaries between the end surface and each side surface of the flange and is disposed at a second level lower than the first level at an approximate central portion of the end surface of the flange.
    Type: Application
    Filed: July 19, 2002
    Publication date: December 5, 2002
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takaomi Toi, Koki Sasaki
  • Patent number: 6480083
    Abstract: A coil device includes terminal electrodes each including a bottom-surface electrode provided on a bottom surface of a flange, side-surface electrodes provided on side surfaces of the flange, and an end-surface electrode provided on an end surface of the flange at the lower part of the end surface. The end-surface electrode is arranged on the end surface of the flange so that the upper edge of the end-surface electrode is disposed at a first level that is substantially the same as that of the upper edges of the side-surface electrodes in the vicinity of boundaries between the end surface and each side surface of the flange and is disposed at a second level lower than the first level at an approximate central portion of the end surface of the flange.
    Type: Grant
    Filed: August 25, 2000
    Date of Patent: November 12, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takaomi Toi, Koki Sasaki