Patents by Inventor Takaomi Toi

Takaomi Toi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device having electric wires and method of producing same
    Patent number: 6119924
    Abstract: An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag--Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.
    Type: Grant
    Filed: November 3, 1999
    Date of Patent: September 19, 2000
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takaomi Toi, Tetsuya Morinaga, Masahiro Bando, Tetsuo Hatakenaka, Kazuo Kasahara, Koki Sasaki, Takayuki Hirotsuji
  • Electronic device having electric wires and method of producing same
    Patent number: 6027008
    Abstract: An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag--Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.
    Type: Grant
    Filed: May 12, 1998
    Date of Patent: February 22, 2000
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takaomi Toi, Tetsuya Morinaga, Masahiro Bando, Tetsuo Hatakenaka, Kazuo Kasahara, Koki Sasaki, Takayuki Hirotsuji