Abstract: Disclosed is a probe card ease for accommodating a probe card. The probe card case includes: a first case member configured to mount the probe card at a predetermined position therein; a second case member configured to be fitted to a top side of the first case member, and including a card fixing mechanism for fixing the probe card; and a case fixing mechanism configured to fix the first case member and the second case member. The probe card is capable of being transferred in a state where the probe card is accommodated in the probe card case and the first case member and the second case member are fixed, and the probe card is capable of being transferred only with the second case member in a state where the probe card is fixed to the second case member.

Abstract: Disclosed is a probe card case for accommodating a probe card. The probe card case includes: a first case member configured to mount the probe card at a predetermined position therein; a second case member configured to be fitted to a top side of the first case member, and including a card fixing mechanism for fixing the probe card; and a case fixing mechanism configured to fix the first case member and the second case member. The probe card is capable of being transferred in a state where the probe card is accommodated in the probe card case and the first case member and the second case member are fixed, and the probe card is capable of being transferred only with the second case member in a state where the probe card is fixed to the second case member.

Abstract: A wafer inspection apparatus 10 includes a middle plate 22 that mounts a probe card 18 in which multiple contact probes 20 are provided; a drawer type table 21 in which the middle plate 22 is provided; a tester 15 to which the probe card 18 is mounted; and a transfer robot 17 that transfers the middle plate 22. The middle plate 22 includes a base 23 and multiple supports 24 protruding toward the probe card 18 to be mounted. A protruding height of each support 24 is equal to or higher than a protruding length of the contact probe 20 from the probe card 18. The probe card 18 is fastened to a probe card cover 29 when the probe card 18 is mounted on the middle plate 22, and the transfer robot 17 transfers the middle plate 22 from the table 21 to the tester 15.

Abstract: Disclosed is a probe card ease for accommodating a probe card. The probe card case includes: a first case member configured to mount the probe card at a predetermined position therein; a second case member configured to be fitted to a top side of the first case member, and including a card fixing mechanism for fixing the probe card; and a case fixing mechanism configured to fix the first case member and the second case member. The probe card is capable of being transferred in a state where the probe card is accommodated in the probe card case and the first case member and the second case member are fixed, and the probe card is capable of being transferred only with the second case member in a state where the probe card is fixed to the second case member.

Abstract: Disclosed is a probe card case for accommodating a probe card. The probe card case includes: a first case member configured to mount the probe card at a predetermined position therein; a second case member configured to be fitted to a top side of the first case member, and including a card fixing mechanism for fixing the probe card; and a case fixing mechanism configured to fix the first case member and the second case member. The probe card is capable of being transferred in a state where the probe card is accommodated in the probe card case and the first case member and the second case member are fixed, and the probe card is capable of being transferred only with the second case member in a state where the probe card is fixed to the second case member.

Abstract: A wafer inspection apparatus 10 includes a middle plate 22 that mounts a probe card 18 in which multiple contact probes 20 are provided; a drawer type table 21 in which the middle plate 22 is provided; a tester 15 to which the probe card 18 is mounted; and a transfer robot 17 that transfers the middle plate 22. The middle plate 22 includes a base 23 and multiple supports 24 protruding toward the probe card 18 to be mounted. A protruding height of each support 24 is equal to or higher than a protruding length of the contact probe 20 from the probe card 18. The probe card 18 is fastened to a probe card cover 29 when the probe card 18 is mounted on the middle plate 22, and the transfer robot 17 transfers the middle plate 22 from the table 21 to the tester 15.

Abstract: The present invention stably maintains contact between probe pins and a wafer. Screws are provided at a plurality of positions in an outer circumferential portion of a printed circuit board. On a lower surface side of the outer circumferential portion of the printed circuit board, a retainer plate is provided, and a bottom end surface of each of the screws is held down with the retainer plate. Turning each of the screws in a state where the bottom end surface of the each of the screws is held down with the retainer plate causes the outer circumferential portion of the printed circuit board to be moved up and down. Adjusting a height of the outer circumferential portion of the printed circuit board by turning each of the screws located at the plurality of positions enables parallelism of the entire probe card with respect to the wafer to be adjusted.

Abstract: In the present invention, an inspection contact structure is attached to the lower surface side of a circuit board in a probe card. In the inspection contact structure, elastic sheets with protruding conductive portions are respectively attached to both surfaces of a silicone substrate. The silicone substrate is formed with current-carrying paths passing therethrough in the vertical direction, and the sheet conductive portions are in contact with the current-carrying paths from above and below. The conductive portions on the upper side are in contact with connecting terminals of the circuit board. At the time of inspection of electric properties of a wafer, electrode pads on the wafer are pressed against the conductive portions on the lower side and thereby brought into contact with them.

Abstract: In the present invention, an inspection contact structure is attached to the lower surface side of a circuit board in a probe card. In the inspection contact structure, elastic sheets with protruding conductive portions are respectively attached to both surfaces of a silicone substrate. The silicone substrate is formed with current-carrying paths passing therethrough in the vertical direction, and the sheet conductive portions are in contact with the current-carrying paths from above and below. The conductive portions on the upper side are in contact with connecting terminals of the circuit board. At the time of inspection of electric properties of a wafer, electrode pads on the wafer are pressed against the conductive portions on the lower side and thereby brought into contact with them.

Abstract: The probe card is configured such that the outline of the probe card is formed almost round shape and a plurality of connectors for being electrically connected with a tester are provided on the upper surface thereof along the outline. A substrate with many probes arranged thereon is provided on the bottom surface of the probe card. The substrate and the connectors are connected with one another via a flexible print wiring board.

Abstract: In the present invention, an inspection contact structure is attached to a lower surface side of a circuit board of a probe card. The inspection contact structure has a silicon substrate, and sheets attached to upper and lower surfaces of the silicon substrate. Each of the sheets is elastic and has conductive portions in a projecting shape. The silicon substrate is formed with current-carrying paths passing through the substrate in a vertical direction so that the conductive portions of the sheets and the current-carrying paths of the silicon substrate are in contact with each other. The upper and lower sheets are fixed to the silicon substrate, and the sheet on the upper surface is fixed to a circuit board.

Abstract: An EPDM composition, which comprises 100 parts by weight of EPDM having an ethylene content of 50-58 wt. %, and a Mooney viscosity ML1+4 (100° C.) of 10-48, and 0.2-4.0 parts by weight of an organic peroxide as a cross-linking agent, has a distinguished blister resistance in a mixed state of chlorofluorocarbon gas/refrigerator oil, which has been a problem in practical use, and a distinguished moldability, as a rubber material for molding sealing materials for chlorofluorocarbon refrigerant including R134a. Sealing materials made from the EPDM composition by vulcanization-molding can provide EPDM-made sealing materials having less permeation leakage amount of chlorofluorocarbon refrigerant than that of hydrogenated NBR so far used as sealing materials in shaft sealing devices in compressors of automobile air conditioners.

Abstract: A probe card includes a contactor supporting probes, and a printed wiring board electrically connected to the contactor. An elastic sheet is interposed between the contactor and the printed wiring board. The elastic sheet is formed so that elasticity in a central side is smaller than that in an outer peripheral side of the contactor. An elastic reaction force which acts on the contactor from the elastic sheet when the elastic sheet is compressed becomes weaker at the central part side as compared with the outer peripheral side of the contactor. Thereby, the bending amount of a central part of the contactor which is away from a fixed end and bends the most is reduced, and horizontality of the contactor is maintained.

Abstract: The method is a method for positioning a three-layered rectangular frame-like anisotropic conductive connector in order to inspect the electrical properties of an object for inspection. The positioning is carried out in the following manner. The three-layered anisotropic conductive sheet is composed of a first anisotropic conductive sheet, a center substrate and a second anisotropic conductive sheet. Markings and through-holes are formed on the center substrate, and semi-transparent protrusions and through-holes are formed on each of the first anisotropic conductive sheet and the second anisotropic conductive sheet.

Abstract: In the present invention, an inspection contact structure is attached to the lower surface side of a circuit board in a probe card. In the inspection contact structure, elastic sheets with protruding conductive portions are respectively attached to both surfaces of a silicone substrate. The silicone substrate is formed with current-carrying paths passing therethrough in the vertical direction, and the sheet conductive portions are in contact with the current-carrying paths from above and below. The conductive portions on the upper side are in contact with connecting terminals of the circuit board. At the time of inspection of electric properties of a wafer, electrode pads on the wafer are pressed against the conductive portions on the lower side and thereby brought into contact with them.

Abstract: In the present invention, an inspection contact structure is attached to the lower surface side of a circuit board in a probe card. In the inspection contact structure, elastic sheets with protruding conductive portions are respectively attached to both surfaces of a silicone substrate. The silicone substrate is formed with current-carrying paths passing therethrough in the vertical direction, and the sheet conductive portions are in contact with the current-carrying paths from above and below. The conductive portions on the upper side are in contact with connecting terminals of the circuit board. At the time of inspection of electric properties of a wafer, electrode pads on the wafer are pressed against the conductive portions on the lower side and thereby brought into contact with them.

Abstract: [OBJECT] Contact of a wafer and a probe is stabilized. [ORGANIZATION] A probe card includes a contactor supporting probes, and a printed wiring board electrically connected to the contactor. An elastic sheet is interposed between the contactor and the printed wiring board. The elastic sheet is formed so that elasticity in a central side is smaller than that in an outer peripheral side of the contactor. An elastic reaction force which acts on the contactor from the elastic sheet when the elastic sheet is compressed becomes weaker at the central part side as compared with the outer peripheral side of the contactor. Thereby, the bending amount of a central part of the contactor which is away from a fixed end and bends the most is reduced, and horizontality of the contactor is maintained.

Abstract: It is an object of the present invention to conduct highly reliable inspection by adjusting a contactor of a probe card and an inspection object in a prober to a parallel state even if the contactor and the inspection object become not parallel to each other. The present invention is a probe card mounted in a prober via a holder, the probe card including: a contactor; a circuit board electrically connected to the contactor; a reinforcing member reinforcing the circuit board; and a parallelism adjustment mechanism adjusting a degree of parallelism between the contactor and an inspection object disposed in the prober.

Abstract: In the present invention, an inspection contact structure is attached to a lower surface side of a circuit board of a probe card. The inspection contact structure has a silicon substrate, and sheets attached to upper and lower surfaces of the silicon substrate. Each of the sheets is elastic and has conductive portions in a projecting shape. The silicon substrate is formed with current-carrying paths passing through the substrate in a vertical direction so that the conductive portions of the sheets and the current-carrying paths of the silicon substrate are in contact with each other. The upper and lower sheets are fixed to the silicon substrate, and the sheet on the upper surface is fixed to a circuit board.