Patents by Inventor Takashi Amemiya

Takashi Amemiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7267551
    Abstract: In the present invention, an inspection contact structure is attached to the lower surface side of a circuit board in a probe card. In the inspection contact structure, elastic sheets with protruding conductive portions are respectively attached to both surfaces of a silicone substrate. The silicone substrate is formed with current-carrying paths passing therethrough in the vertical direction, and the sheet conductive portions are in contact with the current-carrying paths from above and below. The conductive portions on the upper side are in contact with connecting terminals of the circuit board. At the time of inspection of electric properties of a wafer, electrode pads on the wafer are pressed against the conductive portions on the lower side and thereby brought into contact with them.
    Type: Grant
    Filed: November 10, 2005
    Date of Patent: September 11, 2007
    Assignee: Tokyo Electron Limited
    Inventors: Takashi Amemiya, Shuichi Tsukada
  • Publication number: 20070182431
    Abstract: The probe card is configured such that the outline of the probe card is formed almost round shape and a plurality of connectors for being electrically connected with a tester are provided on the upper surface thereof along the outline. A substrate with many probes arranged thereon is provided on the bottom surface of the probe card. The substrate and the connectors are connected with one another via a flexible print wiring board.
    Type: Application
    Filed: February 2, 2007
    Publication date: August 9, 2007
    Inventors: Shigekazu Komatsu, Takashi Amemiya, Jun Mochizuki
  • Publication number: 20070108996
    Abstract: The present invention stably maintains contact between probe pins and a wafer. Screws are provided at a plurality of positions in an outer circumferential portion of a printed circuit board. On a lower surface side of the outer circumferential portion of the printed circuit board, a retainer plate is provided, and a bottom end surface of each of the screws is held down with the retainer plate. Turning each of the screws in a state where the bottom end surface of the each of the screws is held down with the retainer plate causes the outer circumferential portion of the printed circuit board to be moved up and down. Adjusting a height of the outer circumferential portion of the printed circuit board by turning each of the screws located at the plurality of positions enables parallelism of the entire probe card with respect to the wafer to be adjusted.
    Type: Application
    Filed: October 2, 2006
    Publication date: May 17, 2007
    Inventors: Takashi Amemiya, Syuichi Tsukada
  • Patent number: 7199198
    Abstract: A fluororubber sealant composition includes 100 parts by weight of a fluororubber, which is a copolymer having a cross-linking site derived from a bromine-containing and/or iodine-containing compound, capable of crosslinking with peroxide and having a component unit composition comprising 20 to 23% by mol of a perfluoromethyl vinylether component unit, 60 to 70% by mol of a vinylidene fluoride component unit, 10 to 20% by mol of a tetrafluoroethylene component unit, 0 to 10% by mol of hexafluoropropylene component unit (based on 100% of the total of the above component units), and a small amount of a bromide and/or iodide unsaturated fluorohydrocarbon component unit as a crosslinking site based on 100% by mol of the total of the above component units; and further comprising, based on 100 parts by weight of the fluororubber, 2 to 50 parts by weight of a bituminous fine powder; 0.5 to 6 parts by weight of an organoperoxide; and 1 to 10 parts by weight of a polyfunctional monomer.
    Type: Grant
    Filed: February 5, 2004
    Date of Patent: April 3, 2007
    Assignee: NOK Corporation
    Inventors: Takashi Amemiya, Masashi Kudo, Chiyota Ogata, Tatsuo Okamura, Masaya Otsuka
  • Publication number: 20060154497
    Abstract: In the present invention, an inspection contact structure is attached to the lower surface side of a circuit board in a probe card. In the inspection contact structure, elastic sheets with protruding conductive portions are respectively attached to both surfaces of a silicon substrate. The silicon substrate is formed with current-carrying paths passing therethrough in the vertical direction, and the sheet conductive portions are in contact with the current-carrying paths from above and below. The conductive portions on the upper side are in contact with connecting terminals of the circuit board. At the time of inspection of electric properties of a wafer, electrode pads on the wafer are pressed against the conductive portions on the lower side and thereby brought into contact with them.
    Type: Application
    Filed: November 10, 2005
    Publication date: July 13, 2006
    Inventors: Takashi Amemiya, Shuichi Tsukada
  • Publication number: 20060058450
    Abstract: A fluororubber sealant includes 100 parts by weight of a fluororubber, which is a copolymer having a cross-linking site derived from a bromine-containing and/or iodine-containing compound, capable of crosslinking with peroxide and having a component unit composition comprising 20 to 23% by mol of a perfluoromethyl vinylether component unit, 60 to 70% by mol of a vinylidene fluoride component unit, 10 to 20% by mol of a tetrafluoroethylene component unit, 0 to 10% by mol of hexafluoropropylene component unit (based on 100% of the total of the above component units), and a small amount of a bromide and/or iodide unsaturated fluorohydrocarbon component unit as a crosslinking site based on 100% by mol of the total of the above component units; and further comprising, based on 100 parts by weight of the fluororubber, 2 to 50 parts by weight of a bituminous fine powder; 0.5 to 6 parts by weight of an organoperoxide; and 1 to 10 parts by weight of a polyfunctional monomer.
    Type: Application
    Filed: February 5, 2004
    Publication date: March 16, 2006
    Applicant: NOK CORPORATION
    Inventors: Takashi Amemiya, Masashi Kudo, Chiyota Ogata, Tatsuo Okamura, Masaya Otsuka
  • Patent number: 6759469
    Abstract: A butyl rubber composition, which comprises 100 parts by weight of butyl rubber and 30 to 150 parts be weight of carbon black having a CTAB specific surface area of 30 to 100 m2/g and preferably further contains 10 to 100 parts by weight of a flat filler having an average particle size of 1 to 40 &mgr;m and an aspect ratio of 5 or more and 0.05 to 5 parts by weight of a coupling agent of organometallic compound is provided. The butyl rubber composition can give vulcanization molded products capable of effectively sealing a carbon dioxide refrigerant without generation of blisters, etc. therein.
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: July 6, 2004
    Assignee: NOK Corporation
    Inventors: Masashi Kudo, Takashi Amemiya, Arata Iida
  • Publication number: 20030088013
    Abstract: A butyl rubber composition, which comprises 100 parts by weight of butyl rubber and 30 to 150 parts by weight of carbon black having a CTAB specific surface area of 30 to 100 m2/g and preferably further contains 10 to 100 parts by weight of a flat filler having an average particle size of 1 to 40 &mgr;m and an aspect ratio of 5 or more and 0.05 to 5 parts by weight of a coupling agent of organometallic compound is provided. The butyl rubber composition can give vulcanization molded products capable of effectively sealing a carbondioxide refrigerant without generation of blisters, etc therein.
    Type: Application
    Filed: December 28, 2001
    Publication date: May 8, 2003
    Inventors: Masashi Kudo, Takashi Amemiya, Arata Iida
  • Patent number: 5844199
    Abstract: A conductor pattern test apparatus comprises a DC voltage power source for applying a predetermined DC voltage to an end of one of a plurality of conductor patterns arranged in parallel with each other, a current measurement circuit for measuring a current flowing to another conductor pattern adjacent to the one of the conductor patterns via the end by the DC voltage power source to the end, and a short-circuit position calculation circuit for calculating a resistance value from the end to a short-circuited part of the two conductor patterns adjacent to each other, based on the current value measured by the current measurement circuit and the voltage value applied by the DC power source, and locating a position of the short-circuited part based on the calculated resistance value and a resistance value of a conductor pattern having no short-circuit. A disconnect location is also obtained.
    Type: Grant
    Filed: March 4, 1997
    Date of Patent: December 1, 1998
    Inventors: Shinji Iino, Takashi Amemiya
  • Patent number: 5639390
    Abstract: A conductor pattern test apparatus comprises a DC voltage power source for applying a predetermined DC voltage to an end of one of a plurality of conductor patterns arranged in parallel with each other, a current measurement circuit for measuring a current flowing to another conductor pattern adjacent to the one of the conductor patterns via the end by the DC voltage power source to the end, and a short-circuit position calculation circuit for calculating a resistance value from the end to a short-circuited part of the two conductor patterns adjacent to each other, based on the current value measured by the current measurement circuit and the voltage value applied by the DC power source, and locating a position of the short-circuited part based on the calculated resistance value and a resistance value of a conductor pattern having no short-circuit. A disconnection position calculator calculates a capacitance value from voltage values.
    Type: Grant
    Filed: December 23, 1994
    Date of Patent: June 17, 1997
    Assignees: Tokyo Electron Limited, TEL Engineering Limited
    Inventors: Shinji Iino, Takashi Amemiya
  • Patent number: 5248567
    Abstract: A fuel cell power plant comprised of a fuel cell main unit to which a fuel is supplied, a containment vessel for housing the fuel cell main unit; a purge gas supply pipe for introducing a purge gas which excludes combustion elements in the containment vessel; and a combustion element removal apparatus which is provided with the purge gas supply pipe and which effectively removes combustion elements in the purge gas before the purge gas is introduced in the containment vessel. The fuel call power plant may include a fuel reformer having at least a reforming space, and may use a reformed fuel gas or a used fuel gas as the purge gas from which the combustion elements are removed. The fuel reformer may include a burner for a reforming reaction, and in this case, the power plant may use a burner exhaust gas as the purge gas from which the combustion elements are removed.
    Type: Grant
    Filed: December 23, 1992
    Date of Patent: September 28, 1993
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takashi Amemiya, Tetsuya Funatsu, Motohiro Takahashi, Masahiro Akiyoshi, Yuji Nagata, Satoshi Suzuki
  • Patent number: 5178969
    Abstract: A fuel cell powerplant system comprises a fuel cell that houses in an airtight containment vessel a cell stack formed from many layers of individual fuel cells, a cooling water loop that cools the fuel cell, and a steam separator that is disposed on the side of an outlet of a fuel cell of the cooling loop and that discharges steam, and wherein one portion of the steam discharged from the steam separator is introduced via a purge steam line to the containment vessel or the cathode of the fuel cell for the purpose of purging containment vessel.
    Type: Grant
    Filed: June 20, 1991
    Date of Patent: January 12, 1993
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Takashi Amemiya
  • Patent number: 5085949
    Abstract: A fuel cell generation system comprises a cell stack consisting of a plurality of cells, said cell having a fuel electrode, an oxidizer electrode, and an electrolyte layer located between said both electrodes, a fuel cell main body having a plurality of cooling plates for absorbing heat generated in said cell, said plate being located between said cells, and a cooling unit for supplying a coolant through said cooling plate. The system further provides a reference voltage source for supplying a reference voltage and a determining unit for comparing an output voltage of at least one cell located at the upper portion of the cell main body with the reference voltage and determining if an abnormal state occurs in the cooling unit based on the comparing result. The reference voltage is picked up out of a part of the cell stack.
    Type: Grant
    Filed: February 5, 1991
    Date of Patent: February 4, 1992
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Robert A. Sanderson, Katsunori Sakai, Takeshi Kuwabara, Takashi Amemiya