Abstract: An integrated circuit device includes at least one data driver block for driving data lines, a plurality of control transistors TC1 and TC2, each of the control transistors being provided corresponding to each output line of the data driver block and controlled by using a common control signal, and a pad arrangement region in which data driver pads P1 and P2 for electrically connecting the data lines and the output lines QL1 and QL2 of the data driver block are disposed. The control transistors TC1 and TC2 are disposed in the pad arrangement region.

Abstract: An integrated circuit device includes first to Nth circuit blocks CB1 to CBN, a first interface region disposed along a fourth side and on the D2 side of the first to Nth circuit blocks CB1 to CBN, and a second interface region disposed along a second side and on the D4 side of the first to Nth circuit blocks CB1 to CBN. A local line LLG formed using a wiring layer lower than an Ith layer is provided between the adjacent circuit blocks as at least one of a signal line and a power supply line. Global lines GLG and GLD formed using the Ith or higher wiring layer are provided along the direction D1 over the circuit block disposed between the nonadjacent circuit blocks as at least one of a signal line and a power supply line.

Abstract: An integrated circuit device includes first and second transistors NTr1 and PTr1 push-pull connected between first and second power supply lines and outputting a voltage of one of the first and second power supply lines to a connection node ND by a charge-pump operation, and a pad PD electrically connected with the connection node ND and electrically connected with a flying capacitor, to which a given voltage is applied at one end, at the other end of the flying capacitor. The pad PD is disposed in an upper layer of at least one of the first and second transistors NTr1 and PTr1 so that the pad PD overlaps part or the entirety of at least one of the first and second transistors NTr1 and PTr1.

Abstract: An integrated circuit device includes a pad PDx and an electrostatic discharge protection element ESDx formed in a rectangular region and electrically connected with the pad PDx. The pad PDx is disposed in an upper layer of the electrostatic discharge protection element ESDx so that an arrangement direction of the pads is parallel to a long side direction of the region in which the electrostatic discharge protection element ESDx is formed, and the pad PDx overlaps part or the entirety of the electrostatic discharge protection element ESDx.

Abstract: An integrated circuit device includes first to Nth circuit blocks CB1 to CBN, a first interface region disposed along a fourth side and on the D2 side of the first to Nth circuit blocks CB1 to CBN, and a second interface region disposed along a second side and on the D4 side of the first to Nth circuit blocks CB1 to CBN. A local line LLG formed using a wiring layer lower than an Ith layer is provided between the adjacent circuit blocks as at least one of a signal line and a power supply line. Global lines GLG and GLD formed using the Ith or higher wiring layer are provided along the direction D1 over the circuit block disposed between the nonadjacent circuit blocks as at least one of a signal line and a power supply line.

Abstract: An integrated circuit device includes first to Nth circuit blocks CB1 to CBN, a first interface region disposed along a fourth side and on the D2 side of the first to Nth circuit blocks CB1 to CBN, and a second interface region disposed along a second side and on the D4 side of the first to Nth circuit blocks CB1 to CBN. A local line LLG formed using a wiring layer lower than an Ith layer is provided between the adjacent circuit blocks as at least one of a signal line and a power supply line. Global lines GLG and GLD formed using the Ith or higher wiring layer are provided along the direction D1 over the circuit block disposed between the nonadjacent circuit blocks as at least one of a signal line and a power supply line.

Abstract: An integrated circuit device includes first and second transistors NTr1 and PTr1 push-pull connected between first and second power supply lines and outputting a voltage of one of the first and second power supply lines to a connection node ND by a charge-pump operation, and a pad PD electrically connected with the connection node ND and electrically connected with a flying capacitor, to which a given voltage is applied at one end, at the other end of the flying capacitor. The pad PD is disposed in an upper layer of at least one of the first and second transistors NTr1 and PTr1 so that the pad PD overlaps part or the entirety of at least one of the first and second transistors NTr1 and PTr1.

Abstract: An integrated circuit device including first to Nth circuit blocks CB1 to CBN disposed along a first direction D1, when the first direction D1 is a direction from a first side of the integrated circuit device toward a third side which is opposite to the first side, the first side being a short side, and when a second direction D2 is a direction from a second side of the integrated circuit device toward a fourth side which is opposite to the second side, the second side being a long side. The circuit blocks CB1 to CBN include at least one memory block MB which stores image data, and at least one data driver block DB which drives data lines. The memory block MB and the data driver block DB are disposed adjacent to each other along the first direction D1.

Abstract: An integrated circuit device includes first to Nth circuit blocks CB1 to CBN disposed along a direction D1 when a direction from a first side which is a short side of the integrated circuit device toward a third side opposite to the first side is a direction D1 and a direction from a second side which is a long side of the integrated circuit device toward a fourth side opposite to the second side is a direction D2. At least one of the circuit blocks on both ends of the circuit blocks CB1 to CBN is a scan driver block for driving a scan line. Or, the scan driver block SB is disposed along the direction D1 on the side of the first to Nth circuit blocks in the direction D2.

Abstract: An integrated circuit device includes: first to Nth circuit blocks CB1 to CBN disposed along a direction D1, the circuit blocks CB1 to CBN includes a data driver block DB. A data driver DR included in the data driver block DB includes Q driver cells DRC1 to DRCQ arranged along a direction D2, each of the driver cells outputting a data signal corresponding to image data for one pixel. When a width of each of the driver cells DRC1 to DRCQ in the direction D2 is WD, each of the circuit blocks CB1 to CBN has a width WB in the direction D2 of “Q×WD?WB<(Q+1)×WD”.

Abstract: An integrated circuit device includes first to Nth circuit blocks CB1 to CBN disposed along a direction D1, a first interface region provided on the D2 side of the circuit blocks CB1 to CBN, and a second interface region provided on the D4 side of the circuit blocks CB1 to CBN. The circuit blocks CB1 to CBN include a data driver block DB and a circuit block other than the data driver block DB. When the widths of the first interface region, the circuit blocks CB1 to CBN, and the second interface region in the direction D2 are respectively W1, WB, and W2, the integrated circuit device has a width W in the direction D2 of “W1+WB+W2?W<W1+2×WB+W2”.

Abstract: An integrated circuit device including first to Nth circuit blocks CB1 to CBN disposed along a first direction D1, when the first direction D1 is a direction from a first side of the integrated circuit device toward a third side which is opposite to the first side, the first side being a short side, and when a second direction D2 is a direction from a second side of the integrated circuit device toward a fourth side which is opposite to the second side, the second side being a long side. The circuit blocks CB1 to CBN include a logic circuit block LB, a grayscale voltage generation circuit block GB, data driver blocks DB1 to DB4, and a power supply circuit block PB. The data driver blocks DB1 to DB4 are disposed between the logic circuit block LB and the grayscale voltage generation circuit block GB, and the power supply circuit block PB.

Abstract: An integrated circuit device including first to Nth circuit blocks CB1 to CBN disposed along a first direction D1, when the first direction D1 is a direction from a first side of the integrated circuit device toward a third side which is opposite to the first side, the first side being a short side, and when a second direction D2 is a direction from a second side of the integrated circuit device toward a fourth side which is opposite to the second side, the second side being a long side. The circuit blocks CB1 to CBN include a high-speed interface circuit block HB which transfers data through a serial bus using differential signals, and a circuit block other than HB. The high-speed interface circuit block HB is disposed as an Mth circuit block CBM (2?M?N?1) of the circuit blocks CB1 to CBN.

Abstract: An integrated circuit device, including first to Nth circuit blocks CB1 to CBN disposed along a first direction D1, when the first direction D1 is a direction from a first side of the integrated circuit device toward a third side which is opposite to the first side, the first side being a short side, and when a second direction D2 is a direction from a second side of the integrated circuit device toward a fourth side which is opposite to the second side, the second side being a long side. The circuit blocks CB1 to CBN include at least one memory block MB which stores image data, and at least one data driver block DB which drives data lines; and the memory block MB includes a memory cell array, a row address decoder RD, and a sense amplifier block SAB.

Abstract: An integrated circuit device includes a data driver block DB, a memory block MB, and a logic circuit block LB. The data driver block DB includes a data driver DR and a buffer circuit BF which buffers a driver control signal from the logic circuit block LB and outputs the buffered driver control signal to the data driver DR. The memory block MB includes a memory cell array MA and a row address decoder RD which selects a wordline. The data driver block DB and the memory block MB are disposed along a direction D1, the buffer circuit BF and the data driver DR are disposed along a direction D2, the row address decoder RD and the memory cell array MA are disposed along the direction D2, and the buffer circuit BF and the row address decoder RD are disposed along the direction D1.

Abstract: An integrated circuit device includes at least one data driver block for driving data lines, a plurality of control transistors TC1 and TC2, each of the control transistors being provided corresponding to each output line of the data driver block and controlled. by using a common control signal, and a pad arrangement region in which data driver pads P1 and P2 for electrically connecting the data lines and the output lines QL1 and QL2 of the data driver block are disposed. The control transistors TC1 and TC2 are disposed in the pad arrangement region.

Abstract: An integrated circuit device, including first to Nth circuit blocks CB1 to CBN disposed along a first direction D1, when the first direction D1 is a direction from a first side of the integrated circuit device toward a third side which is opposite to the first side, the first side being a short side, and when a second direction D2 is a direction from a second side of the integrated circuit device toward a fourth side which is opposite to the second side, the second side being a long side. The circuit blocks CB1 to CBN include a scan driver block SB, a power supply circuit block PB, a data driver block DB, and a memory block MB. The scan driver block SB and the power supply circuit block PB are disposed adjacent to each other along the direction D1; and the data driver block DB and the memory block MB are disposed adjacent to each other along the direction D1.

Abstract: An integrated circuit device includes first and second transistors NTr1 and PTr1 push-pull connected between first and second power supply lines and outputting a voltage of one of the first and second power supply lines to a connection node ND by a charge-pump operation, and a pad PD electrically connected with the connection node ND and electrically connected with a flying capacitor, to which a given voltage is applied at one end, at the other end of the flying capacitor. The pad PD is disposed in an upper layer of at least one of the first and second transistors NTr1 and PTr1 so that the pad PD overlaps part or the entirety of at least one of the first and second transistors NTr1 and PTr1.

Abstract: An integrated circuit device includes a pad PDx and an electrostatic discharge protection element ESDx formed in a rectangular region and electrically connected with the pad PDx. The pad PDx is disposed in an upper layer of the electrostatic discharge protection element ESDx so that an arrangement direction of the pads is parallel to a long side direction of the region in which the electrostatic discharge protection element ESDx is formed, and the pad PDx overlaps part or the entirety of the electrostatic discharge protection element ESDx.

Abstract: An integrated circuit device including first to Nth circuit blocks CB1 to CBN disposed along a first direction D1, when the first direction D1 is a direction from a first side of the integrated circuit device toward a third side which is opposite to the first side, the first side being a short side, and when a second direction D2 is a direction from a second side of the integrated circuit device toward a fourth side which is opposite to the second side, the second side being a long side. The circuit blocks CB1 to CBN include at least one memory block MB which stores image data, and at least one data driver block DB which drives data lines. The memory block MB and the data driver block DB are disposed adjacent to each other along the first direction D1.