Patents by Inventor Takashi Hinotsu

Takashi Hinotsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11072715
    Abstract: This disclosure relates to a conductive paste comprising a fine silver particle dispersion and a glass frit, wherein the fine silver particle dispersion comprising: (1) 65 to 95.4% by weight of fine silver particles which have average primary particle diameter of 10 to 190 nm and which comprise 25% by number or less of silver particles having primary particle diameter of 100 nm or larger, (2) 4.5 to 34.5% by weight of a solvent, (3) 0.1 to 1.0% by weight of ethyl cellulose having weight average molecular weight of 10,000 to 120,000. Also provided are: a method of manufacturing an electrically conductive thick film comprising steps of: (a) applying said fine silver particle dispersion on a substrate, and (b) heating the applied fine silver particle dispersion at 80 to 1000° C.; and an electrical device comprising a conductive thick film made with the foregoing paste.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: July 27, 2021
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Dave Hui, Michael Stephen Wolfe, Howard David Glicksman, Haixin Yang, Takashi Hinotsu, Shingo Teragawa
  • Publication number: 20200317935
    Abstract: This disclosure relates to a conductive paste comprising a fine silver particle dispersion and a glass frit, wherein the fine silver particle dispersion comprising: (1) 65 to 95.4% by weight of fine silver particles which have average primary particle diameter of 10 to 190 nm and which comprise 25% by number or less of silver particles having primary particle diameter of 100 nm or larger, (2) 4.5 to 34.5% by weight of a solvent, (3) 0.1 to 1.0% by weight of ethyl cellulose having weight average molecular weight of 10,000 to 120,000. Also provided are: a method of manufacturing an electrically conductive thick film comprising steps of: (a) applying said fine silver particle dispersion on a substrate, and (b) heating the applied fine silver particle dispersion at 80 to 1000 ° C.; and an electrical device comprising a conductive thick film made with the foregoing paste.
    Type: Application
    Filed: April 4, 2019
    Publication date: October 8, 2020
    Inventors: Dave Hui, Michael Stephen Wolfe, Howard David Glicksman, Haixin Yang, Takashi Hinotsu, Shingo Teragawa
  • Publication number: 20200321139
    Abstract: This disclosure relates to a fine silver particle dispersion including: (1) 65 to 95.4% by weight of fine silver particles which have an average primary particle diameter of 10 to 190 nm and which comprise 25% by number or less of silver particles having a primary particle diameter of 100 nm or larger, (2) 4.5 to 34.5% by weight of a solvent, and (3) 0.1 to 1.0% by weight of ethyl cellulose having a weight average molecular weight of 10,000 to 120,000.
    Type: Application
    Filed: April 4, 2019
    Publication date: October 8, 2020
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Shingo TERAGAWA, Takashi HINOTSU, Dave HUI, Michael Stephen WOLFE, Howard David GLICKSMAN, Haixin YANG
  • Patent number: 10543569
    Abstract: A bonding material of a silver paste contains: fine silver particles having an average primary particle diameter of 1 to 200 nm, each of the fine silver particles being coated with an organic compound having a carbon number of not greater than 8, such as sorbic acid; and a solvent mixed with the fine silver particles, wherein a diol, such as an octanediol, is used as the solvent and wherein a triol having a boiling point of 200 to 300° C., a viscosity of 2,000 to 10,000 mPa·s at 20° C. and at least one methyl group, such as 3-methylbutane-1,2,3-triol or 2-methylbutane-1,2,4-triol, is mixed with the solvent as an addition agent.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: January 28, 2020
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Satoru Kurita, Takashi Hinotsu, Keiichi Endoh, Hiromasa Miyoshi
  • Publication number: 20190103200
    Abstract: This disclosure relates to a method of manufacturing an electrically conductive thick film comprising steps of: (a) applying a fine silver particle dispersion on a substrate, wherein the fine silver particle dispersion comprises, (i) 60 to 95 wt. % of fine silver particles, wherein particle diameter (D50) of the fine silver particles is 50 to 300 nm, (ii) 4.5 to 39 wt. % of a solvent; and (iii) 0.1 to 3 wt. % of a resin, wherein the glass transition temperature (Tg) of the resin is 70 to 300° C., wherein the weight percentages are based on the weight of the fine silver particle dispersion; and (b) heating the applied fine silver particle dispersion at 80 to 1000° C.
    Type: Application
    Filed: October 4, 2017
    Publication date: April 4, 2019
    Inventors: Dave Hui, Michael Stephen Wolfe, Howard David Glicksman, Haixin Yang, Takashi Hinotsu, Shingo Teragawa
  • Publication number: 20190100641
    Abstract: This disclosure relates to a fine silver particle dispersion comprising: (i) 60 to 95 wt. % of fine silver particles, wherein particle diameter (D50) of the fine silver particles is 50 to 300 nm, (ii) 4.5 to 39 wt. % of a solvent; and (iii) 0.1 to 3 wt. % of a resin, wherein the glass transition temperature (Tg) of the resin is 70 to 300° C., wherein the weight percentages are based on the weight of the fine silver particle dispersion.
    Type: Application
    Filed: October 4, 2017
    Publication date: April 4, 2019
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Shingo TERAGAWA, Takashi HINOTSU, Dave HUI, Michael Stephen WOLFE, Howard David GLICKSMAN, Haixin YANG
  • Publication number: 20180179409
    Abstract: There is produced a fine silver particle dispersing solution which contains: fine silver particles (the content of silver in the fine silver particle dispersing solution being 30 to 95% by weight), which have an average primary particle diameter of greater than 100 nm and not greater than 300 nm and which are coated with an amine having a carbon number of 8 to 12, such as octylamine, serving as an organic protective material; a polar solvent (5 to 70% by weight) having a boiling point of 150 to 300° C.; and an acrylic dispersing agent (5% by weight or less with respect to the fine silver particles), such as a dispersing agent of at least one of acrylic acid ester and methacrylic acid ester.
    Type: Application
    Filed: April 22, 2016
    Publication date: June 28, 2018
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Shingo Teragawa, Takashi Hinotsu, Taro Torigoe, Shinichi Konno
  • Patent number: 9914845
    Abstract: There is produced a fine silver particle dispersing solution which contains: fine silver particles (the content of silver in the fine silver particle dispersing solution is 30 to 90% by weight), which have an average primary particle diameter of 1 to 100 nm and which are coated with an amine having a carbon number of 8 to 12, such as octylamine, serving as an organic protective material; a polar solvent (5 to 70% by weight) having a boiling point of 150 to 300° C.; and an acrylic dispersing agent (1.5 to 5% by weight with respect to the fine silver particles), such as a dispersing agent of at least one of acrylic acid ester and methacrylic acid ester.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: March 13, 2018
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Takashi Hinotsu, Tomonori Shibayama, Hiromasa Miyoshi
  • Patent number: 9682426
    Abstract: An aliphatic amine having a carbon number of not less than 6, such as octylamine, hexylamine or oleylamine, serving as an organic protective material is added to water serving as a solvent so that the molar ratio of the aliphatic amine with respect to silver of a silver compound is in the range of 0.05 to 6, a reducing agent, such as hydrazine or NaBH4, being added thereto so that the molar ratio of the reducing agent with respect to silver of the silver compound is in the range of 1 to 6, and the silver compound, such as a silver salt or a silver oxide, being added thereto so that the concentration of silver ions in the aqueous reaction solution is in the range of 0.01 to 1.0 mol/L, and then, the silver compound is reduced at a temperature of 10 to 50° C. to produce fine silver particles having an average primary particle diameter of 10 to 200 nm. Thus, there is provided a method for producing fine silver particles, the method being capable of inexpensively producing fine silver particles in a short time.
    Type: Grant
    Filed: September 20, 2013
    Date of Patent: June 20, 2017
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Tomonori Shibayama, Takashi Hinotsu, Tatuya Kariyasu
  • Patent number: 9662748
    Abstract: There is provided a metal nanoparticle dispersion which can be bonded at a lower temperature (for example, 200° C. or less), and enabling to obtain excellent mechanical properties and electric properties of the bonded portion, the metal nanoparticle dispersion, including: metal nanoparticles, with at least a part of a surface of each particle coated with amine A having 8 or more carbon atoms; and a dispersion medium for dispersing the metal nanoparticles, wherein the dispersion medium contains amine B which is primary, secondary, or tertiary amine having 7 or less carbon atoms, and which is linear alkyl amine or alkanol amine.
    Type: Grant
    Filed: April 25, 2014
    Date of Patent: May 30, 2017
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Keiichi Endoh, Hiromasa Miyoshi, Takashi Hinotsu, Satoru Kurita, Yoshiko Kohno
  • Publication number: 20170120395
    Abstract: A bonding material of a silver paste contains: fine silver particles having an average primary particle diameter of 1 to 200 nm, each of the fine silver particles being coated with an organic compound having a carbon number of not greater than 8, such as sorbic acid; and a solvent mixed with the fine silver particles, wherein a diol, such as an octanediol, is used as the solvent and wherein a triol having a boiling point of 200 to 300° C., a viscosity of 2,000 to 10,000 mPa·s at 20° C. and at least one methyl group, such as 2-methylbutane-2,3,4-triol or 2-methylbutane-1,2,4-triol, is mixed with the solvent as an addition agent.
    Type: Application
    Filed: May 29, 2015
    Publication date: May 4, 2017
    Applicant: Dowa Electronics Materials Co., Ltd.
    Inventors: Satoru Kurita, Takashi Hinotsu, Keiichi Endoh, Hiromasa Miyoshi
  • Publication number: 20160297982
    Abstract: There is produced a fine silver particle dispersing solution which contains: fine silver particles (the content of silver in the fine silver particle dispersing solution is 30 to 90% by weight), which have an average primary particle diameter of 1 to 100 nm and which are coated with an amine having a carbon number of 8 to 12, such as octylamine, serving as an organic protective material; a polar solvent (5 to 70% by weight) having a boiling point of 150 to 300° C.; and an acrylic dispersing agent (1.5 to 5% by weight with respect to the fine silver particles), such as a dispersing agent of at least one of acrylic acid ester and methacrylic acid ester.
    Type: Application
    Filed: December 4, 2014
    Publication date: October 13, 2016
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Takashi Hinotsu, Tomonori Shibayama, Hiromasa Miyoshi
  • Patent number: 9461188
    Abstract: In order to provide an electro-conductive paste bringing no increase of the contact resistance for forming an electrode of a solar cell device, the electro-conductive paste is characterized by containing an electro-conductive particle, an organic binder, a solvent, a glass frit, and an organic compound including alkaline earth metal, a metal with a low melting point or a compound affiliated with a metal with a low melting point.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: October 4, 2016
    Assignee: KYOTO ELEX CO., LTD.
    Inventors: Masashi Nakayama, Nobuo Ochiai, Takashi Hinotsu, Yutaka Nakayama, Masami Sakuraba, Wataru Fujimori
  • Publication number: 20160101486
    Abstract: There is provided a metal nanoparticle dispersion which can be bonded at a lower temperature (for example, 200° C. or less), and enabling to obtain excellent mechanical properties and electric properties of the bonded portion, the metal nanoparticle dispersion, including: metal nanoparticles, with at least a part of a surface of each particle coated with amine A having 8 or more carbon atoms; and a dispersion medium for dispersing the metal nanoparticles, wherein the dispersion medium contains amine B which is primary, secondary, or tertiary amine having 7 or less carbon atoms, and which is linear alkyl amine or alkanol amine.
    Type: Application
    Filed: April 25, 2014
    Publication date: April 14, 2016
    Inventors: Keiichi ENDOH, Hiromasa MIYOSHI, Takashi HINOTSU, Satoru KURITA, Yoshiko KOHNO
  • Patent number: 9273235
    Abstract: A bonding material using silver nanoparticles considerably changes in coating-material property in response to a slight change in composition, and the stability thereof has been insufficient for large-amount application. A bonding material which uses silver nanoparticles, meets the requirements for mass printing, attains dimensional stability, and gives a smooth printed surface is provided. The bonding material includes silver nanoparticles which have at least an average primary particle diameter of 1 nm to 200 nm and have been coated with an organic substance having 8 or less carbon atoms, a dispersion medium, and a viscosity modifier composed of an organic substance, and has a viscosity (measured at a shear rate of 15.7 [1/s]) of 100 Pa·s or lower and a thixotropic ratio (measured at a shear rate of 3.1 [1/s]/measured at a shear rate of 15.7 [1/s]) of 4 or lower.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: March 1, 2016
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Satoru Kurita, Takashi Hinotsu, Shinya Sasaki
  • Publication number: 20150266097
    Abstract: An aliphatic amine having a carbon number of not less than 6, such as octylamine, hexylamine or oleylamine, serving as an organic protective material is added to water serving as a solvent so that the molar ratio of the aliphatic amine with respect to silver of a silver compound is in the range of 0.05 to 6, a reducing agent, such as hydrazine or NaBH4, being added thereto so that the molar ratio of the reducing agent with respect to silver of the silver compound is in the range of 1 to 6, and the silver compound, such as a silver salt or a silver oxide, being added thereto so that the concentration of silver ions in the aqueous reaction solution is in the range of 0.01 to 1.0 mol/L, and then, the silver compound is reduced at a temperature of 10 to 50° C. to produce fine silver particles having an average primary particle diameter of 10 to 200 nm. Thus, there is provided a method for producing fine silver particles, the method being capable of inexpensively producing fine silver particles in a short time.
    Type: Application
    Filed: September 20, 2013
    Publication date: September 24, 2015
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Tomonori Shibayama, Takashi Hinotsu, Tatuya Kariyasu
  • Publication number: 20150020880
    Abstract: In order to provide an electro-conductive paste bringing no increase of the contact resistance for forming an electrode of a solar cell device, the electro-conductive paste is characterized by containing an electro-conductive particle, an organic binder, a solvent, a glass frit, and an organic compound including alkaline earth metal, a metal with a low melting point or a compound affiliated with a metal with a low melting point.
    Type: Application
    Filed: August 28, 2014
    Publication date: January 22, 2015
    Inventors: Masashi Nakayama, Nobuo Ochiai, Takashi Hinotsu, Yutaka Nakayama, Masami Sakuraba, Wataru Fujimori
  • Patent number: 8852465
    Abstract: In order to provide an electro-conductive paste bringing no increase of the contact resistance for forming an electrode of a solar cell device, the electro-conductive paste is characterized by containing an electro-conductive particle, an organic binder, a solvent, a glass frit, and an organic compound including alkaline earth metal, a metal with a low melting point or a compound affiliated with a metal with a low melting point.
    Type: Grant
    Filed: July 7, 2009
    Date of Patent: October 7, 2014
    Assignee: Kyoto Elex Co., Ltd.
    Inventors: Masashi Nakayama, Nobuo Ochiai, Takashi Hinotsu, Yutaka Nakayama, Masami Sakuraba, Wataru Fujimori
  • Publication number: 20140113109
    Abstract: A bonding material using silver nanoparticles considerably changes in coating-material property in response to a slight change in composition, and the stability thereof has been insufficient for large-amount application. A bonding material which uses silver nanoparticles, meets the requirements for mass printing, attains dimensional stability, and gives a smooth printed surface is provided. The bonding material includes silver nanoparticles which have at least an average primary particle diameter of 1 nm to 200 nm and have been coated with an organic substance having 8 or less carbon atoms, a dispersion medium, and a viscosity modifier composed of an organic substance, and has a viscosity (measured at a shear rate of 15.7 [1/s]) of 100 Pa·s or lower and a thixotropic ratio (measured at a shear rate of 3.1 [1/s]/measured at a shear rate of 15.7 [1/s]) of 4 or lower.
    Type: Application
    Filed: June 10, 2011
    Publication date: April 24, 2014
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Satoru Kurita, Takashi Hinotsu, Shinya Sasaki
  • Publication number: 20130153835
    Abstract: When a substrate having a low heat resistance is used, heat treatment at approximately 120° C. at which deformation does not occur is desirable. When a low resistance is achieved regardless of the type of resin used for a conductive paste, a flexible design of a paste is possible according to purposes, and fields to which the paste could be applied are expanded. Thus, a conductive paste capable of forming a conductive film exhibiting a high conductivity even at low temperatures of approximately 120° C. regardless of whether the constituting resin is a thermosetting resin or a thermoplastic resin is provided. In a method for forming a conductive film, a conductive paste in which a dicarboxylic acid having 2 to 8 carbon atoms is added to a paste including silver nanoparticles coated with an organic substance having 2 to 6 carbon atoms, a dispersion medium, and a resin is used.
    Type: Application
    Filed: October 28, 2011
    Publication date: June 20, 2013
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Takashi Hinotsu, Yuto Hiyama, Toshihiko Ueyama