Patents by Inventor Takashi Hinotsu

Takashi Hinotsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150020880
    Abstract: In order to provide an electro-conductive paste bringing no increase of the contact resistance for forming an electrode of a solar cell device, the electro-conductive paste is characterized by containing an electro-conductive particle, an organic binder, a solvent, a glass frit, and an organic compound including alkaline earth metal, a metal with a low melting point or a compound affiliated with a metal with a low melting point.
    Type: Application
    Filed: August 28, 2014
    Publication date: January 22, 2015
    Inventors: Masashi Nakayama, Nobuo Ochiai, Takashi Hinotsu, Yutaka Nakayama, Masami Sakuraba, Wataru Fujimori
  • Patent number: 8852465
    Abstract: In order to provide an electro-conductive paste bringing no increase of the contact resistance for forming an electrode of a solar cell device, the electro-conductive paste is characterized by containing an electro-conductive particle, an organic binder, a solvent, a glass frit, and an organic compound including alkaline earth metal, a metal with a low melting point or a compound affiliated with a metal with a low melting point.
    Type: Grant
    Filed: July 7, 2009
    Date of Patent: October 7, 2014
    Assignee: Kyoto Elex Co., Ltd.
    Inventors: Masashi Nakayama, Nobuo Ochiai, Takashi Hinotsu, Yutaka Nakayama, Masami Sakuraba, Wataru Fujimori
  • Publication number: 20140113109
    Abstract: A bonding material using silver nanoparticles considerably changes in coating-material property in response to a slight change in composition, and the stability thereof has been insufficient for large-amount application. A bonding material which uses silver nanoparticles, meets the requirements for mass printing, attains dimensional stability, and gives a smooth printed surface is provided. The bonding material includes silver nanoparticles which have at least an average primary particle diameter of 1 nm to 200 nm and have been coated with an organic substance having 8 or less carbon atoms, a dispersion medium, and a viscosity modifier composed of an organic substance, and has a viscosity (measured at a shear rate of 15.7 [1/s]) of 100 Pa·s or lower and a thixotropic ratio (measured at a shear rate of 3.1 [1/s]/measured at a shear rate of 15.7 [1/s]) of 4 or lower.
    Type: Application
    Filed: June 10, 2011
    Publication date: April 24, 2014
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Satoru Kurita, Takashi Hinotsu, Shinya Sasaki
  • Publication number: 20130153835
    Abstract: When a substrate having a low heat resistance is used, heat treatment at approximately 120° C. at which deformation does not occur is desirable. When a low resistance is achieved regardless of the type of resin used for a conductive paste, a flexible design of a paste is possible according to purposes, and fields to which the paste could be applied are expanded. Thus, a conductive paste capable of forming a conductive film exhibiting a high conductivity even at low temperatures of approximately 120° C. regardless of whether the constituting resin is a thermosetting resin or a thermoplastic resin is provided. In a method for forming a conductive film, a conductive paste in which a dicarboxylic acid having 2 to 8 carbon atoms is added to a paste including silver nanoparticles coated with an organic substance having 2 to 6 carbon atoms, a dispersion medium, and a resin is used.
    Type: Application
    Filed: October 28, 2011
    Publication date: June 20, 2013
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Takashi Hinotsu, Yuto Hiyama, Toshihiko Ueyama
  • Publication number: 20110192457
    Abstract: In order to provide an electro-conductive paste bringing no increase of the contact resistance for forming an electrode of a solar cell device, the electro-conductive paste is characterized by containing an electro-conductive particle, an organic binder, a solvent, a glass frit, and an organic compound including alkaline earth metal, a metal with a low melting point or a compound affiliated with a metal with a low melting point.
    Type: Application
    Filed: July 7, 2009
    Publication date: August 11, 2011
    Applicant: KYOTO ELEX CO., LTD.
    Inventors: Masashi Nakayama, Nobuo Ochiai, Takashi Hinotsu, Yutaka Nakayama, Masami Sakuraba, Wataru Fujimori
  • Publication number: 20080081178
    Abstract: After fluid material containing transparent conducting fine particles is coated on a substrate to form a coating film, and the transparent conducting fine particles are sintered by irradiating an electromagnetic wave after pressure is added to this coating film. For example, the pressure is added to the coating film so that density of the coating film becomes 3.0 g/cm3 or more. Besides, for example, the pressure is added to a surface of the coating film by means of a roll press. Besides, for example, a line pressure of the roll press is set to be 200 kg/cm or more. Besides, for example, the irradiated electromagnetic wave is a microwave of 1 GHz to 1 THz.
    Type: Application
    Filed: September 20, 2007
    Publication date: April 3, 2008
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Takashi Hinotsu, Koji Tanoue
  • Publication number: 20080047466
    Abstract: The change in resistance over time of a low-resistance acicular ITO powder is reduced, and the stability of the ITO powder in ambient air is improved. Tin-containing indium hydroxide baked in an atmosphere of an inert gas and reducing gas is processed for a predetermined time under a water-containing atmosphere of inert gas and/or reducing gas at a temperature of 0° C. or greater and 100° C. or less, and is then exposed to air.
    Type: Application
    Filed: March 22, 2007
    Publication date: February 28, 2008
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD
    Inventors: Koji Tanoue, Shinichi Konno, Takashi Hinotsu