Patents by Inventor Takashi Hozumi

Takashi Hozumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE INCLUDING STUD BUMPS AS EXTERNAL CONNECTION TERMINALS
    Publication number: 20020105069
    Abstract: A semiconductor device includes a semiconductor chip, a resin package for sealing said semiconductor chip, metal layers provided on a mounting-side surface of said resin package in an exposed manner and connecting members for electrically connecting electrode pads provided on the semiconductor chip and the metal layers. The metal layers are provided with stud bumps on the mounting side, the stud bumps serving as external connection terminals.
    Type: Application
    Filed: October 13, 1998
    Publication date: August 8, 2002
    Inventors: TOSHIMI KAWAHARA, MAMORU SUWA, MASANORI ONODERA, SYUICHI MONMA, SHINYA NAKASEKO, TAKASHI HOZUMI
  • Semiconductor device and mounting structure
    Patent number: 6329711
    Abstract: A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding from a mounting surface of the resin package, metallic film parts provided to the resin projections, connecting members electrically connecting electrode pads on the semiconductor element and the metallic film parts, and connection pads extending from the metallic film parts, the connecting members being connected to the connection pads.
    Type: Grant
    Filed: November 30, 1998
    Date of Patent: December 11, 2001
    Assignee: Fujitsu Limited
    Inventors: Toshimi Kawahara, Mamoru Suwa, Masanori Onodera, Syuichi Monma, Shinya Nakaseko, Takashi Hozumi, Yoshiyuki Yoneda, Ryuji Nomoto
  • SEMICONDUCTOR DEVICE KEEPING STRUCTURAL INTEGRITY UNDER HEAT-GENERATED STRESS
    Publication number: 20010045643
    Abstract: A semiconductor device includes an elastic member which has an adhesive contact with at least one other member. The adhesive contact forces said elastic member to stay in a deformed shape different from an original shape to which said elastic member tries to return, wherein a force generated by said elastic member trying to return to the original shape serves to counteract a heat-generated stress applied to said semiconductor device.
    Type: Application
    Filed: March 25, 1999
    Publication date: November 29, 2001
    Inventors: YOSHITSUGU KATOH, SHINYA NAKASEKO, TAKASHI HOZUMI
  • Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition
    Patent number: 5844309
    Abstract: An adhesive composition including: a main component comprising a resin material, a solvent for dissolving said main component, and a filler added to said main component, wherein said filler has a particle size so as to make a concavo-convex depth of a surface of said adhesive composition equal to or less than 15 .mu.m after said adhesive composition is applied to an adherend and dried in order to evaporate said solvent before a thermocompression process. The present invention also discloses a semiconductor device using the adhesive composition, an adhering method using the adhesive composition and a method for producing a semiconductor device using the adhesive composition.
    Type: Grant
    Filed: December 3, 1996
    Date of Patent: December 1, 1998
    Assignee: Fujitsu Limited
    Inventors: Yukio Takigawa, Shigeaki Yagi, Toshimi Kawahara, Mitsunada Osawa, Hiroyuki Ishiguro, Shinya Nakaseko, Takashi Hozumi, Masaaki Seki