Abstract: Provided is a canned motor to be coupled to a vacuum pump and used as a rotary driving source for the vacuum pump. The canned motor includes: a stator core; a rotor provided on an inner side of the stator core; and a non-conductive can provided between the stator core and the rotor. The non-conductive can is configured to separate the stator core and the rotor from each other. The non-conductive can is made of resin, ceramic, or composite material thereof. The non-conductive can is bonded to the stator core with an adhesive.

Abstract: Provided is a canned motor to be coupled to a vacuum pump and used as a rotary driving source for the vacuum pump. The canned motor includes: a stator core; a rotor provided on an inner side of the stator core; and a non-conductive can provided between the stator core and the rotor. The non-conductive can is configured to separate the stator core and the rotor from each other. The non-conductive can is made of resin, ceramic, or composite material thereof. The non-conductive can is bonded to the stator core with an adhesive.

Abstract: Provided is a canned motor to be coupled to a vacuum pump and used as a rotary driving source for the vacuum pump. The canned motor includes: a stator core; a rotor provided on an inner side of the stator core; and a non-conductive can provided between the stator core and the rotor. The non-conductive can is configured to separate the stator core and the rotor from each other. The non-conductive can is made of resin, ceramic, or composite material thereof. The non-conductive can is bonded to the stator core with an adhesive.

Abstract: Provided is a canned motor to be coupled to a vacuum pump and used as a rotary driving source for the vacuum pump. The canned motor includes: a stator core; a rotor provided on an inner side of the stator core; and a non-conductive can provided between the stator core and the rotor. The non-conductive can is configured to separate the stator core and the rotor from each other. The non-conductive can is made of resin, ceramic, or composite material thereof. The non-conductive can is bonded to the stator core with an adhesive.

Abstract: A sealing structure for a vacuum pump motor which maintains the sealing properties of the vacuum pump motor in an ensured fashion, including a lead wire which is passed through an opening portion formed in a motor frame to be connected to a motor stator and a seal member which seals the opening portion. The lead wire includes a core wire portion and a covering portion which covers the core wire portion. The lead wire also includes a seal portion formed around at least part of the core wire portion inside the covering portion.

Abstract: In order to provide a vacuum pump motor which is free from rotation imbalance, there is provided a vacuum pump motor 10 which is connected directly to a pump main shaft 21 of a vacuum pump 20, including a motor rotor 120 which is attached directly or indirectly to the pump main shaft 21 and balance rings 127 which are attached directly or indirectly to the pump main shaft 21 at ends thereof which are spaced apart from end portions of a rotor core 123, wherein the balance rings 127 contain a material having anticorrosion properties.

Abstract: Provided is a canned motor to be coupled to a vacuum pump and used as a rotary driving source for the vacuum pump. The canned motor includes: a stator core; a rotor provided on an inner side of the stator core; and a non-conductive can provided between the stator core and the rotor. The non-conductive can is configured to separate the stator core and the rotor from each other. The non-conductive can is made of resin, ceramic, or composite material thereof. The non-conductive can is bonded to the stator core with an adhesive.

Abstract: In order to provide a vacuum pump motor which is free from rotation imbalance, there is provided a vacuum pump motor 10 which is connected directly to a pump main shaft 21 of a vacuum pump 20, including a motor rotor 120 which is attached directly or indirectly to the pump main shaft 21 and balance rings 127 which are attached directly or indirectly to the pump main shaft 21 at ends thereof which are spaced apart from end portions of a rotor core 123, wherein the balance rings 127 contain a material having anticorrosion properties.

Abstract: To provide a sealing structure for a vacuum pump motor which maintains the sealing properties of the vacuum pump motor in an ensured fashion, there is provided a sealing structure for a vacuum pump motor 100, including a lead wire 151a which is passed through an opening portion 143 formed in a motor frame 140 to be connected to a motor stator 110 and a seal member 145 which seals the opening portion 143, wherein the lead wire 151a includes a core wire portion 154a and a covering portion 155a which covers the core wire portion 154, and a seal portion 153 is formed in at least part of the core wire portion 154a.

Abstract: Provided is a canned motor to be coupled to a vacuum pump and used as a rotary driving source for the vacuum pump. The canned motor includes: a stator core; a rotor provided on an inner side of the stator core; and a non-conductive can provided between the stator core and the rotor. The non-conductive can is configured to separate the stator core and the rotor from each other. The non-conductive can is made of resin, ceramic, or composite material thereof. The non-conductive can is bonded to the stator core with an adhesive.

Abstract: The present invention relates to a dry vacuum pump unit capable of achieving ultimate pressure of about 1 Pa. The vacuum pump unit includes a main pump (15) disposed at an outside-pressure side, and a booster pump (16) disposed at a vacuum side. The booster pump (16) and the main pump (15) are coupled in series. The booster pump (16) has a higher pumping speed than that of the main pump (15). Each of the main pump (15) and the booster pump (16) includes a pair of pump rotors (52a and 52b), a casing (50) having an inlet port and an outlet port, and a pair of magnet rotors (54 and 54) rotatable with the pair of pump rotors.

Abstract: The present invention relates to a dry vacuum pump unit capable of achieving ultimate pressure of about 1 Pa. The vacuum pump unit includes a main pump (15) disposed at an outside-pressure side, and a booster pump (16) disposed at a vacuum side. The booster pump (16) and the main pump (15) are coupled in series. The booster pump (16) has a higher pumping speed than that of the main pump (15). Each of the main pump (15) and the booster pump (16) includes a pair of pump rotors (52a and 52b), a casing (50) having an inlet port and an outlet port, and a pair of magnet rotors (54 and 54) rotatable with the pair of pump rotors.

Abstract: A semiconductor device includes a semiconductor chip, a resin package for sealing said semiconductor chip, metal layers provided on a mounting-side surface of said resin package in an exposed manner and connecting members for electrically connecting electrode pads provided on the semiconductor chip and the metal layers. The metal layers are provided with stud bumps on the mounting side, the stud bumps serving as external connection terminals.

Abstract: A semiconductor device includes a semiconductor chip, a resin package for sealing said semiconductor chip, metal layers provided on a mounting-side surface of said resin package in an exposed manner and connecting members for electrically connecting electrode pads provided on the semiconductor chip and the metal layers. The metal layers are provided with stud bumps on the mounting side, the stud bumps serving as external connection terminals.

Abstract: A wafer level semiconductor device including a wafer having a plurality of semiconductor elements formed on an upper surface thereof, a sealing resin including a first part for sealing the upper surface of the wafer and a second part for sealing a side surface of wafer, the second part having a lower edge surface flush with a lower surface of the wafer, and a film for covering the lower surface of wafer and the lower edge surface of the second part of the sealing resin and conducting the process using the wafer level semiconductor device in which the film is bonded. This structure prevents warping of the wafer level semiconductor device after the sealing resin is formed on the device and it is then taken out from the mold dies.

Abstract: A method of producing semiconductor devices which have an excellent separability from a metal mold after resin encapsulation and thus eliminates the need to clean the metal mold. A metal mold for producing such semiconductor devices is also provided. According to the method of the present invention, the metal mold is first opened, and two separation sheets are disposed on dividing surfaces including cavity forming surfaces of a first metal mold and a second metal mold. A substrate is then placed on one of the separation sheets, with its semiconductor chip formed surface facing the second metal mold. An encapsulation resin is provided on the substrate placed on one of the separation sheets. The metal mold in a heated state is closed and pressed to form a resin layer for encapsulating electrodes formed on the substrate. The metal mold is again opened, and the resin-encapsulated substrate is taken out of the metal mold.

Abstract: A semiconductor device is provided, which device includes a semiconductor chip including external terminals formed on a surface thereof and a sealing resin formed on the surface of the semiconductor chip. A contaminant film formed on the surface of said semiconductor chip has a laser-processed edge so that a peripheral portion of the surface of said semiconductor chip is bonded to the sealing resin.

Abstract: In a semiconductor device of the present invention and a production method thereof, an electronic circuit is provided in a semiconductor substrate, the electronic circuit having terminals. An internal wiring pattern is provided in the substrate, the internal wiring pattern being connected to the electronic circuit terminals. A protective layer is provided on the substrate, the protective layer covering the substrate. Vias are provided on the substrate so as to project from the protective layer, the vias being connected to the internal wiring pattern at arbitrary positions on the substrate. An external wiring pattern is provided on the protective layer, the external wiring pattern being connected to the vias. Projection electrodes are connected to the external wiring pattern, the projection electrodes having a predetermined height above the external wiring pattern.

Abstract: A semiconductor device includes a semiconductor element having a circuit surface on which a projection electrode is formed, a seal resin which seals the circuit surface of the semiconductor element while exposing at least an end part of the projection electrode, a connect surface that is to face a board when the semiconductor device is implemented on the board, a back surface which is opposite to the connect surface, a side surface arranged between the connect surface and the back surface, and an organic material layer formed on the side surface.