Abstract: In a stacked workpiece molding method, a second mold 30 includes through-holes 32 that extend to be opened at a peripheral edge of a workpiece body 42, the through-holes 32 are connected to a first suction device 51 that sucks a sheet material 44, a first mold 20 includes suction holes 22 that extend to be opened at a portion that contacts the workpiece body 42, the suction holes 22 are connected to a second suction device 52 that sucks the workpiece body 42, and in a bonding step of bonding the sheet material 44 to the workpiece body 42, a suction force in the through-holes 32 by the first suction device 51 is set stronger than a suction force in the suction holes 22 by the second suction device 52.

Abstract: A stacked workpiece in which a sheet material can be more firmly attached to a workpiece body than in the related art is provided. A stacked workpiece (40) includes a workpiece body (42), and a sheet material (44) stacked on the workpiece body (42). In the workpiece body (42), a workpiece-side protruding portion (42a) that is placed at least in a part of a peripheral portion of the stacked sheet material (44) and that protrudes toward a side of the sheet material (44) is provided, and a thinly-crushed compression portion (44a) is formed in a portion of the sheet material (44) stacked on the workpiece-side protruding portion (42a).

Abstract: A stacked workpiece molding device 1 includes: a first mold 20 configured to suck and hold a workpiece body 42; and a second mold 30 having on an inner surface a pattern that can be transferred to a surface of a sheet material 44 stacked on the workpiece body 42 and press the sheet material 44 against the workpiece body 42. The inner surface of the second mold 30 includes a groove portion 31 that is positioned at a peripheral edge portion of the workpiece body 42, the second mold 30 includes a through-hole 32 extending to open into the groove portions 31, the through-hole 32 is connected to a first suction device 51 that sucks the sheet material 44, and the first mold 20 includes a suction hole 22 for sucking the workpiece body 42, and the suction hole 22 is connected to a second suction device 52.

Abstract: An LED lighting device capable of discharging heat generated from a light emitting element to the outside the LED lighting device. An LED lighting device includes: a plurality of light emitting elements; a mounted substrate on which the light emitting elements are mounted; and an electrode portion configured to supply a current to the light emitting elements from outside the LED lighting device. On the mounted substrate, a wiring substrate is located. On the upper surface of the mounted substrate, the mounted substrate includes: a light emitting region in which the plurality of light emitting elements are mounted; an exposed region which is located on the outer side of the light emitting region and through which the upper surface of the mounted substrate is exposed; and a wiring region which is located on the outer side of the light emitting region and in which the wiring substrate is located.

Abstract: An LED lighting device capable of discharging heat generated from a light emitting element to the outside the LED lighting device. An LED lighting device includes: a plurality of light emitting elements; a mounted substrate on which the light emitting elements are mounted; and an electrode portion configured to supply a current to the light emitting elements from outside the LED lighting device. On the mounted substrate, a wiring substrate is located. On the upper surface of the mounted substrate, the mounted substrate includes: a light emitting region in which the plurality of light emitting elements are mounted; an exposed region which is located on the outer side of the light emitting region and through which the upper surface of the mounted substrate is exposed; and a wiring region which is located on the outer side of the light emitting region and in which the wiring substrate is located.

Abstract: A semiconductor device directly joins electrodes of a semiconductor element to electrodes of a metal substrate and has good yield, connection reliability, good mass productivity, and superior heat dissipation efficiency. A method for producing the semiconductor device that directly joins the electrodes of the metal substrate to the electrodes of the semiconductor element includes forming an electrode separating groove in an element mounting position on a main surface of the metal substrate at a predetermined depth. The semiconductor element is mounted to extend over the electrode separating groove. The metal substrate is ground from a surface reverse to the main surface of the metal substrate up to a position reaching the electrode separating groove.

Abstract: In a first aspect of the present inventive subject matter, a lighting device includes a light-emitting element that includes a first electrode and a second electrode on a lower surface of the light-emitting element; a phosphor layer directly covering a peripheral side surface of the light-emitting element; and a light-reflecting layer that is in contact with an upper surface of the light-emitting element and in contact with an upper surface of the phosphor layer directly covering the peripheral side surface of the light-emitting element.

Abstract: A semiconductor device directly joins electrodes of a semiconductor element to electrodes of a metal substrate and has good yield, connection reliability, good mass productivity, and superior heat dissipation efficiency. A method for producing the semiconductor device that directly joins the electrodes of the metal substrate to the electrodes of the semiconductor element includes forming an electrode separating groove in an element mounting position on a main surface of the metal substrate at a predetermined depth. The semiconductor element is mounted to extend over the electrode separating groove. The metal substrate is ground from a surface reverse to the main surface of the metal substrate up to a position reaching the electrode separating groove.

Abstract: A light-emitting device includes a metal substrate, insulative portions, a plurality of LEDs, a support frame, and a light-transmissive encapsulation resin. The metal substrate includes electrode portions. The insulative portions separate the electrode portions from each other so that one serves as an anode and another serves as a cathode. The LEDs are positioned at a surface of the metal substrate. The LEDs each lie over a corresponding one of the insulative portions and are each electrically coupled to corresponding ones of the electrode portions. The support frame surrounds an outer perimeter of the metal substrate, and includes inner and outer wall portions. The inner wall portion is formed within a recessed groove along the outer perimeter of the metal substrate. The outer wall portion covers an outer perimeter surface of the metal substrate. The light-transmissive encapsulation resin encapsulates at least partially the LEDs.

Abstract: Provided is an LED package which is unlikely to cause the attenuation of emitted light from an LED element by bonding wires for electrical connection of the LED element. The LED package includes a board including a pair of connection electrodes formed thereon, an LED element mounted on the board, a bonding wire electrically connecting the LED element to the pair of connection electrodes, and a covering layer containing a phosphor and covering the bonding wire, wherein the phosphor is excited by emitted light from the LED element to emit light having an absorbance in the bonding wire lower than that of the emitted light and a wavelength longer than that of the emitted light.

Abstract: Provided is an LED package which is unlikely to cause the attenuation of emitted light from an LED element by bonding wires for electrical connection of the LED element. The LED package includes a board including a pair of connection electrodes formed thereon, an LED element mounted on the board, a bonding wire electrically connecting the LED element to the pair of connection electrodes, and a covering layer containing a phosphor and covering the bonding wire, wherein the phosphor is excited by emitted light from the LED element to emit light having an absorbance in the bonding wire lower than that of the emitted light and a wavelength longer than that of the emitted light.

Abstract: Provided is a compact and high-luminance semiconductor light-emitting device which has excellent color rendering characteristics and which enables arbitrary selection of emission color depending on the use of the device. The semiconductor light-emitting device includes a light-emitting element assembly configured by a plurality of fluorescent semiconductor light-emitting elements each of which has external connection electrodes respectively connected to an n-type semiconductor layer and a p-type semiconductor layer, wherein at least an outer surface other than the external connection electrodes of each of the fluorescent semiconductor light-emitting elements is coated with a resin containing a fluorescent material. The light-emitting element assembly is configured such that the external connection electrodes of the fluorescent semiconductor light-emitting elements are directly connected in series using solder.

Abstract: Provided is a compact and high-luminance semiconductor light-emitting device which has excellent color rendering characteristics and which enables arbitrary selection of emission color depending on the use of the device. The semiconductor light-emitting device includes a light-emitting element assembly configured by a plurality of fluorescent semiconductor light-emitting elements each of which has external connection electrodes respectively connected to an n-type semiconductor layer and a p-type semiconductor layer, wherein at least an outer surface other than the external connection electrodes of each of the fluorescent semiconductor light-emitting elements is coated with a resin containing a fluorescent material. The light-emitting element assembly is configured such that the external connection electrodes of the fluorescent semiconductor light-emitting elements are directly connected in series using solder.

Abstract: In a first aspect of the present inventive subject matter, a lighting device includes a light-emitting element that includes a first electrode and a second electrode on a lower surface of the light-emitting element; a phosphor layer directly covering a peripheral side surface of the light-emitting element; and a light-reflecting layer that is in contact with an upper surface of the light-emitting element and in contact with an upper surface of the phosphor layer directly covering the peripheral side surface of the light-emitting element.

Abstract: A light-emitting element according to an embodiment of the present invention includes a body including an upper surface, a lower surface opposite to the upper surface, and a peripheral side surface extending between peripheral edges of the upper surface and peripheral edges of the lower surface, the peripheral side surface including a front surface and a rear surface opposite to the front surface; a pair of element electrodes as a first element electrode and a second element electrode positioned at the rear surface of the body; and a support disposed at the rear surface of the body between the first element electrode and the second element electrode that are positioned at a lower area of the rear surface of the body.