Abstract: The invention comprises a lower electrode which is disposed in a processing chamber and holds a wafer W, and an exhaust ring mechanism disposed between the lower electrode and an inner wall of the processing chamber, wherein the exhaust ring mechanism has an exhaust ring, and a magnetic field forming section which forms a magnetic field parallel to the principal plane of the exhaust ring, and thereby preventing plasma leak from a plasma region to a non-plasma region by the formed magnetic field, and a plasma processing apparatus using the exhaust ring mechanism.

Abstract: There is provided a vacuum processing apparatus and an exhausting apparatus of the vacuum processing apparatus according to which the auxiliary vacuum pump can be made smaller or eliminated, and hence energy-saving and space-saving can be achieved, and moreover the floor space occupied by the exhausting apparatus can be reduced, and hence the vacuum processing apparatus as a whole can be made smaller in size. A main vacuum pump has an intake port connected to a processing chamber in which an article to be processed is processed in a vacuum atmosphere, to exhaust the processing chamber to a vacuum state. An auxiliary vacuum pump is connected to a discharge port of the main vacuum pump to exhaust the main vacuum pump to a vacuum state. The main vacuum pump is a high back pressure type pump that exhausts the processing chamber to a vacuum state with a predetermined high back pressure value.

Abstract: A motor speed controller with high speed response characteristics.