Patents by Inventor Takashi Koga

Takashi Koga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154208
    Abstract: This battery unit is a battery unit including a battery pack that houses a battery cell, and a water-cooling medium flow path formed outside a bottom surface of the battery pack, in which the water-cooling medium flow path of the battery pack is made of an Al-based plated steel sheet.
    Type: Application
    Filed: February 4, 2022
    Publication date: May 9, 2024
    Applicant: NIPPON STEEL CORPORATION
    Inventors: Kyohei MIYAKE, Atsuo KOGA, Kohei UEDA, Yutaka MIKAZUKI, Katsunari NORITA, Sho MATSUI, Takashi OKE
  • Publication number: 20240120595
    Abstract: This battery unit is a battery unit including a battery pack that houses a battery cell, and a water-cooling medium flow path formed outside a bottom surface of the battery pack, in which the water-cooling medium flow path is made of a Zn-based plated steel sheet, an inorganic film or a resin film is formed as a chemical conversion coating film on a surface of the Zn-based plated steel sheet, and the inorganic film contains a Si-based component or a Zr-based component as a main component.
    Type: Application
    Filed: February 7, 2022
    Publication date: April 11, 2024
    Applicant: NIPPON STEEL CORPORATION
    Inventors: Kyohei MIYAKE, Atsuo KOGA, Kohei UEDA, Yutaka MIKAZUKI, Katsunari NORITA, Sho MATSUI, Takashi OKE
  • Patent number: 11955854
    Abstract: In this stator armature, a first leg portion has a first surface side part that has a thickness in a radial direction smaller than a thickness of a first leg portion body portion in the radial direction, a second leg portion has a second surface side part that has a thickness in the radial direction smaller than a thickness of a second leg portion body portion in the radial direction, and in the radial direction, a thickness of a joint portion is equal to or more than a thickness of a part other than the joint portion.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: April 9, 2024
    Assignee: AISIN CORPORATION
    Inventors: Kiyotaka Koga, Takahiro Kobuchi, Takashi Kato
  • Patent number: 11753569
    Abstract: A hot-melt composition includes, with respect to 100 parts by mass of (A) a hydrogenated styrene thermoplastic elastomer having styrene-based polymer blocks at both ends and a hydrogenated diene polymer block at a middle portion and having a mass-average molecular weight of 250,000-600,000, 20-150 parts by mass of (B) a first styrene-based tackifying resin having a softening point of 135-160° C., 100-400 parts by mass of (C) a second styrene-based tackifying resin having a softening point of 105-135° C., 100-500 parts by mass of (D) a third tackifying resin for the hydrogenated diene polymer block having a softening point of 100-160° C. and 500-1,500 parts by mass of (E) a liquid softener. The hot-melt composition has excellent adhesion and easy peel ability, and is a material suitable as a sealing material for a lighting device of an automobile or the like.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: September 12, 2023
    Assignee: ASAHI CHEMICAL SYNTHETIC CO., LTD.
    Inventors: Tomonobu Yamauchi, Kazuya Furukawa, Daisuke Kumon, Takashi Koga
  • Publication number: 20230178392
    Abstract: A separating system includes a placing unit, a removing apparatus and a transfer device. The placing unit is configured to place therein a first cassette allowed to accommodate a combined substrate in which a first substrate and a second substrate are bonded to each other with a separation layer therebetween, a second cassette allowed to accommodate the first substrate, and a third cassette allowed to accommodate the second substrate. The removing apparatus is configured to remove the separation layer by radiating laser light to the combined substrate. The transfer device is configured to perform a processing of transferring the combined substrate to the removing apparatus and a processing of transferring the first substrate and the second substrate separated from the combined substrate to the placing unit.
    Type: Application
    Filed: December 1, 2022
    Publication date: June 8, 2023
    Inventors: Satoshi Nishimura, Takeshi Tamura, Takashi Koga, Yohei Maeda
  • Patent number: 10840213
    Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate to a bonding apparatus, a first holding plate configured to hold the first substrate from an upper surface side, and a second holding plate disposed below the first holding plate and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate. The substrate transfer device includes a first holding part capable of holding the first substrate from the upper surface side, and a second holding part disposed below the first holding part and capable of holding the second substrate from the lower surface side. The first holding part and the second holding part are configured to receive and hold the first substrate and the second substrate at the same time from the first holding plate and the second holding plate.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: November 17, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Masataka Matsunaga, Takahiro Masunaga, Yasutaka Soma, Takashi Koga, Shogo Hara, Masaaki Umitsuki, Kazutoshi Ishimaru, Fumio Sakata
  • Publication number: 20200255712
    Abstract: A hot-melt composition includes, with respect to 100 parts by mass of (A) a hydrogenated styrene thermoplastic elastomer having styrene-based polymer blocks at both ends and a hydrogenated diene polymer block at a middle portion and having a mass-average molecular weight of 250,000-600,000, 20-150 parts by mass of (B) a first styrene-based tackifying resin having a softening point of 135-160° C., 100-400 parts by mass of (C) a second styrene-based tackifying resin having a softening point of 105-135° C., 100-500 parts by mass of (D) a third tackifying resin for the hydrogenated diene polymer block having a softening point of 100-160° C. and 500-1,500 parts by mass of (E) a liquid softener. The hot-melt composition has excellent adhesion and easy peel ability, and is a material suitable as a sealing material for a lighting device of an automobile or the like.
    Type: Application
    Filed: July 30, 2018
    Publication date: August 13, 2020
    Applicant: ASAHI CHEMICAL SYNTHETIC CO., LTD.
    Inventors: Tomonobu YAMAUCHI, Kazuya FURUKAWA, Daisuke KUMON, Takashi KOGA
  • Patent number: 10424502
    Abstract: A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: September 24, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Masataka Matsunaga, Takahiro Masunaga, Takashi Koga, Yasuharu Iwashita, Shingo Katsuki, Masaaki Umitsuki, Kazutoshi Ishimaru, Fumio Sakata
  • Patent number: 10340248
    Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: July 2, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Masataka Matsunaga, Takashi Koga, Takeshi Tamura, Takahiro Masunaga, Yuji Mimura, Masaru Honda, Toshifumi Inamasu, Satoshi Nishimura
  • Publication number: 20180019226
    Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate to a bonding apparatus, a first holding plate configured to hold the first substrate from an upper surface side, and a second holding plate disposed below the first holding plate and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate. The substrate transfer device includes a first holding part capable of holding the first substrate from the upper surface side, and a second holding part disposed below the first holding part and capable of holding the second substrate from the lower surface side. The first holding part and the second holding part are configured to receive and hold the first substrate and the second substrate at the same time from the first holding plate and the second holding plate.
    Type: Application
    Filed: July 7, 2017
    Publication date: January 18, 2018
    Inventors: Masataka MATSUNAGA, Takahiro MASUNAGA, Yasutaka SOMA, Takashi KOGA, Shogo HARA, Masaaki UMITSUKI, Kazutoshi ISHIMARU, Fumio SAKATA
  • Publication number: 20180019153
    Abstract: A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.
    Type: Application
    Filed: July 7, 2017
    Publication date: January 18, 2018
    Inventors: Masataka MATSUNAGA, Takahiro MASUNAGA, Takashi KOGA, Yasuharu IWASHITA, Shingo KATSUKI, Masaaki UMITSUKI, Kazutoshi ISHIMARU, Fumio SAKATA
  • Publication number: 20180019225
    Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.
    Type: Application
    Filed: July 7, 2017
    Publication date: January 18, 2018
    Inventors: Masataka MATSUNAGA, Takashi KOGA, Takeshi TAMURA, Takahiro MASUNAGA, Yuji MIMURA, Masaru HONDA, Toshifumi INAMASU, Satoshi NISHIMURA
  • Publication number: 20140027686
    Abstract: A polycarbonate resin composition which has high light transmission performance in the visible light region, excellent infrared shielding properties and excellent resistance to molding heat, can contribute to the reduction of an environmental burden, and has such high designability that it can be tinted in various colors as well as a molded article thereof. The polycarbonate resin composition comprises: (A) 100 parts by weight of a polycarbonate resin (component A); (B) 0.001 to 0.1 part by weight of an inorganic infrared shielding material (component B); and (C) 0.01 to 1 part by weight of an ultraviolet absorbent represented by the following formula (1) (component C).
    Type: Application
    Filed: September 26, 2013
    Publication date: January 30, 2014
    Applicant: TEIJIN CHEMICALS LTD.
    Inventors: Fumihiro TOGASHI, Takashi KOGA
  • Publication number: 20120305863
    Abstract: A polycarbonate resin composition which has high light transmission performance in the visible light region, excellent infrared shielding properties and excellent resistance to molding heat, can contribute to the reduction of an environmental burden, and has such high designability that it can be tinted in various colors as well as a molded article thereof. The polycarbonate resin composition comprises: (A) 100 parts by weight of a polycarbonate resin (component A); (B) 0.001 to 0.1 part by weight of an inorganic infrared shielding material (component B); and (C) 0.01 to 1 part by weight of an ultraviolet absorbent represented by the following formula (1) (component C).
    Type: Application
    Filed: February 14, 2011
    Publication date: December 6, 2012
    Inventors: Fumihiro Togashi, Takashi Koga
  • Publication number: 20120252941
    Abstract: It is an object of the present invention to provide a bisbenzoxazinone compound which does not substantially contain an alkali metal salt, has high purity and provides a resin composition having excellent resistance to hydrolysis when it is contained in a resin, a production method thereof, and a resin composition comprising the compound. The present invention is a bisbenzoxazinone compound represented by the following formula (4): (R1 and R2 are each independently a hydrogen atom, hydroxyl group, alkyl group having 1 to 3 carbon atoms, or the like), and has (i) a purity of 98% or more, (ii) a content of a compound represented by the following formula (7) of less than 0.15 wt %: (iii) a maximum peak in the measurement of the light reflectance at a visible range of its powder at 380 to 480 nm and a maximum light reflectance of 100 to 120%, (iv) a metal sodium content of less than 50 ppm and (v) a YI value of ?10 to 10.
    Type: Application
    Filed: November 26, 2009
    Publication date: October 4, 2012
    Inventors: Shun Ibusuki, Takashi Koga, Akira Miyake, Masayuki Hayashi, Masaya Yoshida
  • Patent number: 7241825
    Abstract: The object of the present invention is to provide a polycarbonate resin composition which has excellent transparency and durability against molding heat, which gives a molded article having an excellent mold release property, reduced strains, improved cracking resistance and, preferably, weatherability, and which is particularly suitable for a transparent member for a vehicle, pellets thereof and a molded article thereof, and the present invention provides a polycarbonate resin composition obtained by blending 100 parts by weight of a polycarbonate resin (Component A) and 0.005 to 2 parts by weight of a full ester (Component B) from an aliphatic polyhydric alcohol having 4 to 8 hydroxyl groups and 5 to 30 carbon atoms and an aliphatic carboxylic acid having 10 to 22 carbon atoms, said Component B having a 5% weight loss temperature, measured by TGA (thermogravimetric analysis), of 250 to 360° C. and having an acid value of 4 to 20, pellets thereof and a molded article thereof.
    Type: Grant
    Filed: May 1, 2003
    Date of Patent: July 10, 2007
    Assignee: Teijin Chemicals, Ltd.
    Inventors: Takashi Koga, Mitsuhiro Takeo, Daisuke Takahashi
  • Patent number: 7148313
    Abstract: A polycarbonate resin composition comprising 100 parts by weight of a polycarbonate resin (component A), 0.01 to 10 parts by weight of at least one ultraviolet light absorber (component B) selected from the group of a specific cyclic imino ester, and 0.01 to 1 part by weight of a fatty acid ester compound (component C) which is an ester of a polyhydric alcohol and an aliphatic carboxylic acid and has a molecular weight of 500 to 2,000 g/mol, as well as molded articles thereof. The polycarbonate resin composition provides molded articles having excellent transparency, color and resistance to ultraviolet radiation, is excellent in heat stability at the time of molding and releasability and fully suppresses the production of a deposit on a metal mold.
    Type: Grant
    Filed: July 8, 2004
    Date of Patent: December 12, 2006
    Assignee: Teijin Chemicals, Ltd.
    Inventors: Takashi Koga, Daisuke Takahashi, Mitsuhiro Takeo
  • Publication number: 20050215750
    Abstract: A polycarbonate resin composition comprising 100 parts by weight of a polycarbonate resin (component A), 0.01 to 10 parts by weight of at least one ultraviolet light absorber (component B) selected from the group of a specific cyclic imino ester, and 0.01 to 1 part by weight of a fatty acid ester compound (component C) which is an ester of a polyhydric alcohol and an aliphatic carboxylic acid and has a molecular weight of 500 to 2,000 g/mol, as well as molded articles thereof. The polycarbonate resin composition provides molded articles having excellent transparency, color and resistance to ultraviolet radiation, is excellent in heat stability at the time of molding and releasability and fully suppresses the production of a deposit on a metal mold.
    Type: Application
    Filed: July 8, 2004
    Publication date: September 29, 2005
    Inventors: Takashi Koga, Daisuke Takahashi, Mitsuhiro Takeo
  • Publication number: 20040152806
    Abstract: The object of the present invention is to provide a polycarbonate resin composition which has excellent transparency and durability against molding heat, which gives a molded article having an excellent mold release property, reduced strains, improved cracking resistance and, preferably, weatherability, and which is particularly suitable for a transparent member for a vehicle, pellets thereof and a molded article thereof, and the present invention provides a polycarbonate resin composition obtained by blending 100 parts by weight of a polycarbonate resin (Component A) and 0.005 to 2 parts by weight of a full ester (Component B) from an aliphatic polyhydric alcohol having 4 to 8 hydroxyl groups and 5 to 30 carbon atoms and an aliphatic carboxylic acid having 10 to 22 carbon atoms, said Component B having a 5% weight loss temperature, measured by TGA (thermogravimetric analysis), of 250 to 360° C. and having an acid value of 4 to 20, pellets thereof and a molded article thereof.
    Type: Application
    Filed: January 8, 2004
    Publication date: August 5, 2004
    Inventors: Takashi Koga, Mitsuhiro Takeo, Daisuke Takahashi
  • Patent number: 5311306
    Abstract: A motion detecting circuit for a video signal processor having a filter arrangement for separating the video signal into the low and high frequency components, a first detecting circuit for detecting a low frequency luminance moving signal, a second detecting circuit for detecting a high frequency luminance moving signal, a third detecting circuit for detecting a chrominance moving signal, a first threshold circuit for generating a low band luminance motion digit signal, a second threshold circuit for generating a high band luminance motion digit signal, a control circuit coupled for generating a control signal in response to the low and high band luminance motion digit signals, a gate circuit for selectively transmitting the chrominance moving signal in response to the control signal and a selector for selectively outputting the one of the low frequency luminance moving signal and the chrominance moving signal having the high signal intensity.
    Type: Grant
    Filed: July 17, 1992
    Date of Patent: May 10, 1994
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Seiichi Tanaka, Takashi Koga, Kouichi Kurihara