Patents by Inventor Takashi Komatsu

Takashi Komatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9855593
    Abstract: A molding apparatus for molding a metal pipe includes: a gas supply unit which supplies gas into a heated metal pipe material, thereby expanding the metal pipe material; a mold which molds the metal pipe by bringing the expanded metal pipe material into contact therewith; and a drive unit which generates a driving force for moving the mold, in which a replacement unit is replaceably provided with respect to a main body unit having at least the drive unit, and the replacement unit is configured of at least the gas supply unit and the mold.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: January 2, 2018
    Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
    Inventors: Masayuki Ishizuka, Masayuki Saika, Norieda Ueno, Takashi Komatsu
  • Publication number: 20170266710
    Abstract: By the control of a controller, a gas is supplied into a metal pipe material from a gas supply part so as to expand a part of the metal pipe material in sub-cavity parts, and then a driving mechanism is driven such that expanded parts of the metal pipe material are pressed by an upper die and a lower die to form flange parts. In addition, by the control of the controller, a gas is supplied into the metal pipe material after the formation of the flange parts from the gas supply part so as to form a pipe part in a main cavity part. In this manner, the controller controls the gas supply part and the driving mechanism, and thus flange parts and a pipe part having a desired shape can be easily formed.
    Type: Application
    Filed: June 8, 2017
    Publication date: September 21, 2017
    Inventors: Masayuki ISHIZUKA, Masayuki SAIKA, Norieda UENO, Takashi KOMATSU
  • Publication number: 20170269884
    Abstract: An image processing device includes a receiving unit, a determining unit, a transmitting unit, and a presenting unit. The receiving unit receives an application for use of the image processing device from an applicant. The determining unit determines whether or not the applicant is associated with an administrator of the image processing device. The transmitting unit transmits, in a case where the applicant is associated with the administrator of the image processing device, a registration request to an external device so that the applicant is permitted to use the image processing device. The presenting unit presents, after a notification indicating registration is received from the external device, information indicating the permission for use to the applicant.
    Type: Application
    Filed: July 12, 2016
    Publication date: September 21, 2017
    Applicant: FUJI XEROX CO., LTD.
    Inventor: Takashi KOMATSU
  • Publication number: 20170136517
    Abstract: A disclosed forming system is a forming system which expands and forms a metal pipe in a die. The forming system includes a preliminary forming apparatus which preliminarily forms a metal pipe material, a forming apparatus which includes a gas supply unit which supplies gas into the preliminary-formed and heated metal pipe material to expand the metal pipe material and a main body portion to which the die is attached, and a cutting device which cuts at least a portion of the formed metal pipe. The gas supply unit is provided so as not to be disposed on a first straight line which connects the preliminary forming apparatus and the main body portion in a plan view and a second straight line which connects the cutting device and the main body portion in a plan view.
    Type: Application
    Filed: December 16, 2016
    Publication date: May 18, 2017
    Inventors: Masayuki ISHIZUKA, Masayuki SAIKA, Norieda UENO, Takashi KOMATSU
  • Publication number: 20170120317
    Abstract: A forming device includes a gas supply part supplying a gas into a metal pipe material held and heated between a first die and a second die paired with each other. A driving mechanism moves at least one of the first die and the second die in a direction in which the dies are combined together. A first cavity part is formed between the first die and the second die to form the pipe part. A second cavity part communicates with the first cavity part to form the flange part. A flange forming member can be allowed to advance or retreat in the second cavity part, and forms the flange part. A controller controls the gas supply of the gas supply part, the driving of the driving mechanism, and the advance or retreat of the flange forming member.
    Type: Application
    Filed: January 11, 2017
    Publication date: May 4, 2017
    Inventors: Masayuki ISHIZUKA, Norieda UENO, Masayuki SAIKA, Takashi KOMATSU
  • Patent number: 9630152
    Abstract: To provide a polyketone porous film having heat resistance and chemical resistance and useful as a filter for filtration having a high particle collection efficiency and as a battery or capacitor separator having a low permeation resistance to ion and the like. A polyketone porous film comprising from 10 to 100 mass % of a polyketone as a copolymer of carbon monoxide and one or more olefins, wherein the polyketone porous film has a pore formed only by a polyketone, the pore diameter uniformity parameter as a value obtained by dividing the standard deviation of the pore diameter in the pore by an average pore diameter is from 0 to 1.0, and the average through hole diameter of the polyketone porous film is from 0.01 to 50 ?m.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: April 25, 2017
    Assignee: ASAHI KASEI FIBERS CORPORATION
    Inventors: Daisuke Sato, Masayuki Kaneda, Takashi Komatsu
  • Publication number: 20170095853
    Abstract: A forming system that forms a metal pipe by expansion in a die includes a heater that heats at least an end part of a metal pipe material, a fluid supply unit that supplies a fluid into the metal pipe material to expand the metal pipe material, and a controller that controls the heater and the fluid supply unit, the fluid supply unit has a nozzle that supplies the fluid from the end part of the metal pipe material into the metal pipe material, and the controller controls the heater so as to heat the end part of the metal pipe material at least before the supply of the fluid by the fluid supply unit, and controls the fluid supply unit so as to expand the end part of the metal pipe material.
    Type: Application
    Filed: December 16, 2016
    Publication date: April 6, 2017
    Inventors: Masayuki Ishizuka, Norieda Ueno, Masayuki Saika, Takashi Komatsu
  • Publication number: 20170095854
    Abstract: A molding apparatus for molding a metal pipe includes: a gas supply unit which supplies gas into a heated metal pipe material, thereby expanding the metal pipe material; a mold which molds the metal pipe by bringing the expanded metal pipe material into contact therewith; and a drive unit which generates a driving force for moving the mold, in which a replacement unit is replaceably provided with respect to a main body unit having at least the drive unit, and the replacement unit is configured of at least the gas supply unit and the mold.
    Type: Application
    Filed: December 19, 2016
    Publication date: April 6, 2017
    Inventors: Masayuki Ishizuka, Masayuki Saika, Norieda Ueno, Takashi Komatsu
  • Publication number: 20170066028
    Abstract: A forming apparatus that forms a metal pipe includes: a heating unit which heats a metal pipe material; a gas supply unit which supplies gas into a heated metal pipe material, thereby expanding the metal pipe material; a die which forms the metal pipe by bringing the expanded metal pipe material into contact with the die; a cooling unit which cools the metal pipe after the forming by a cooling medium; and a control unit which controls an operation of the die, the gas supply unit, and the cooling unit, wherein the control unit makes cooling of the metal pipe by the cooling medium be performed, by controlling an operation of the die such that the die is opened and controlling the cooling unit such that the cooling unit brings the cooling medium into contact with the metal pipe, subsequently to completion of forming by the die.
    Type: Application
    Filed: November 18, 2016
    Publication date: March 9, 2017
    Inventors: Masayuki ISHIZUKA, Norieda UENO, Masayuki SAIKA, Takashi KOMATSU
  • Publication number: 20170048931
    Abstract: A molding apparatus capable of improving the quality of a molded article is provided. A control section controls a blowing mechanism to expand and mold a metal pipe material by supplying gas into the metal pipe material held between an upper mold and a lower mold by a pipe holding mechanism. The control section controls a driving section to mold a flange portion by crushing a second molded portion of the expanded metal pipe material in a sub-cavity portion between the upper mold and the lower mold. In a molding apparatus, the control section changes movement speed of a slide during the molding of the flange portion by controlling a servomotor. Accordingly, it becomes possible to control an operation of pressing at an appropriate movement speed according to the shape or the like of the flange portion. Accordingly, it is possible to improve the quality of a molded article.
    Type: Application
    Filed: October 19, 2016
    Publication date: February 16, 2017
    Inventors: Norieda Ueno, Masayuki Ishizuka, Masayuki Saika, Takashi Komatsu
  • Publication number: 20160279693
    Abstract: A molding apparatus that molds a metal pipe with a flange is disclosed. The molding apparatus comprises a first mold and a second mold that are paired with each other, a slide that moves at least one of the first mold and the second mold, a drive unit that generates a driving force for moving the slid, a holding section that holds a metal pipe material between the first mold and the second mold, a gas supply section that supplies gas into the metal pipe material held by the holding section, and a control unit that controls the drive unit, the holding section, and the gas supply section. The first mold and the second mold are provided with a first cavity portion that molds a pipe portion of the metal pipe, and a second cavity portion that molds a flange portion.
    Type: Application
    Filed: June 7, 2016
    Publication date: September 29, 2016
    Inventors: Norieda UENO, Masayuki ISHIZUKA, Masayuki SAIKA, Takashi KOMATSU
  • Patent number: 9105405
    Abstract: A ceramic electronic component with metal terminals comprising a chip component formed with terminal electrodes at both ends, and a pair of metal terminals comprising a flat plate portion having a flat plate portion facing face provided so that it faces an end face of said chip component and connected to said terminal electrodes via a joining portion , and a mounting portion connected to one end portion of said flat plate portion and extending approximately perpendicular to said flat plate portion, wherein said mounting portion has a mounting portion bottom face forming an angle of approximately 270 degrees with respect to said flat plate portion, and a mounting portion upper face forming an angle of approximately 90 degrees with respect to said flat plate portion, and a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed.
    Type: Grant
    Filed: September 11, 2013
    Date of Patent: August 11, 2015
    Assignee: TDK CORPORATION
    Inventors: Sunao Masuda, Katsumi Kobayashi, Takashi Komatsu, Akitoshi Yoshii, Kazuyuki Hasebe, Kayou Kusano, Norihisa Ando
  • Patent number: 9042079
    Abstract: A ceramic electronic component comprising; including a chip component of approximately rectangular parallelepiped, a first metal terminal portion having a first flat plate portion facing a first end face, at least a pair of first fitting arm portions connected to the first flat plate portion, having a first engagement projection engaging with a first wraparound portion holding the first wraparound portion in between, and a first mounting portion connected to the first flat plate portion and extending approximately parallel to one side face, and a second metal terminal portion having a second flat plate portion facing the second end face, at least a pair of second fitting arm portions connected to the second flat plate portion, having a second engagement projection engaging with a second wraparound portion, holding the second wraparound portion in between, and a second mounting portion extending approximately parallel to one side face.
    Type: Grant
    Filed: August 22, 2013
    Date of Patent: May 26, 2015
    Assignee: TDK CORPORATION
    Inventors: Sunao Masuda, Katsumi Kobayashi, Akitoshi Yoshii, Kazuyuki Hasebe, Takashi Komatsu, Kayou Kusano
  • Publication number: 20140217013
    Abstract: To provide a polyketone porous film having heat resistance and chemical resistance and useful as a filter for filtration having a high particle collection efficiency and as a battery or capacitor separator having a low permeation resistance to ion and the like. A polyketone porous film comprising from 10 to 100 mass % of a polyketone as a copolymer of carbon monoxide and one or more olefins, wherein the polyketone porous film has a pore formed only by a polyketone, the pore diameter uniformity parameter as a value obtained by dividing the standard deviation of the pore diameter in the pore by an average pore diameter is from 0 to 1.0, and the average through hole diameter of the polyketone porous film is from 0.01 to 50 ?m.
    Type: Application
    Filed: September 5, 2012
    Publication date: August 7, 2014
    Inventors: Daisuke Sato, Masayuki Kaneda, Takashi Komatsu
  • Publication number: 20140118882
    Abstract: A ceramic electronic component with metal terminals comprising a chip component formed with terminal electrodes at both ends, and a pair of metal terminals comprising a flat plate portion having a flat plate portion facing face provided so that it faces an end face of said chip component and connected to said terminal electrodes via a joining portion , and a mounting portion connected to one end portion of said flat plate portion and extending approximately perpendicular to said flat plate portion, wherein said mounting portion has a mounting portion bottom face forming an angle of approximately 270 degrees with respect to said flat plate portion, and a mounting portion upper face forming an angle of approximately 90 degrees with respect to said flat plate portion, and a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed.
    Type: Application
    Filed: September 11, 2013
    Publication date: May 1, 2014
    Inventors: Sunao MASUDA, Katsumi KOBAYASHI, Takashi KOMATSU, Akitoshi YOSHII, Kazuyuki HASEBE, Kayou KUSANO, Norihisa ANDO
  • Publication number: 20140055910
    Abstract: A ceramic electronic component comprising; including a chip component of approximately rectangular parallelepiped, a first metal terminal portion having a first flat plate portion facing a first end face, at least a pair of first fitting arm portions connected to the first flat plate portion, having a first engagement projection engaging with a first wraparound portion holding the first wraparound portion in between, and a first mounting portion connected to the first flat plate portion and extending approximately parallel to one side face, and a second metal terminal portion having a second flat plate portion facing the second end face, at least a pair of second fitting arm portions connected to the second flat plate portion, having a second engagement projection engaging with a second wraparound portion, holding the second wraparound portion in between, and a second mounting portion extending approximately parallel to one side face
    Type: Application
    Filed: August 22, 2013
    Publication date: February 27, 2014
    Applicant: TDK Corporation
    Inventors: Sunao MASUDA, Katsumi Kobayashi, Akitoshi Yoshii, Kazuyuki Hasebe, Takashi Komatsu, Kayou Kusano
  • Publication number: 20140003294
    Abstract: A judgment unit judges which one of an intermediate node and a terminal node each node depicted in a network configuration diagram as a node image is, based on node information. A first placement unit places, in the configuration diagram, an intermediate node image of a node judged as the intermediate node in a tree form having a first direction in which the intermediate node image of the same layer is placed and a second direction indicating a depth direction of a layer of the intermediate node, based on the node information. A second placement unit places a terminal node image of a node judged as a terminal node at a position of the second direction from the intermediate node image placed by the first placement unit to a parent node of the terminal node.
    Type: Application
    Filed: June 20, 2013
    Publication date: January 2, 2014
    Applicant: FUJITSU LIMITED
    Inventors: Takashi KOMATSU, Kazuya NAGAI
  • Patent number: 8460522
    Abstract: A plurality of targets are disposed in parallel with, and at a given distance to, one another. In case a predetermined thin film is formed by sputtering, the occurrence of non-uniformity in the film thickness distribution and the film quality distribution can be restricted. During the time when electric power is charged to a plurality of targets (31a to 31h) which are disposed inside a sputtering chamber (11a) so as to lie opposite to the process substrate (S), and are disposed at a predetermined distance from, and in parallel with, one another, thereby forming a predetermined thin film by sputtering, each of the targets is reciprocated at a constant speed in parallel with the process substrate. Also, magnet assemblies that form tunnel-shaped magnetic flux (M) in front of each target are reciprocated at a constant speed in parallel with each of the targets.
    Type: Grant
    Filed: October 12, 2007
    Date of Patent: June 11, 2013
    Assignee: ULVAC, Inc.
    Inventors: Yuichi Oishi, Takashi Komatsu, Junya Kiyota, Makoto Arai
  • Patent number: 8391635
    Abstract: A noise removal device that removes noise from an image signal includes: a separation unit that separates the image signal into at least two subband signals; a parameter setting unit that sets a plurality of coring ranges in relation to at least one of the subband signals; and a coring unit that performs coring processing on the basis of the plurality of coring ranges.
    Type: Grant
    Filed: August 28, 2008
    Date of Patent: March 5, 2013
    Assignees: Olympus Corporation, Kanagawa University
    Inventors: Hideya Aragaki, Takahiro Saito, Takashi Komatsu
  • Patent number: 8349645
    Abstract: A mask includes: a tabular first section which includes a side portion and an opening portion formed at a position corresponding to a film formation region of a substrate and on which the substrate is to be disposed so that the first section overlaps a face of the substrate on which a film is to be formed; and a second section which is provided along the side portion of the first section, and covers at least one of portions of a side face of the substrate, wherein second sections of two adjacent masks overlap each other and a superposed section is thereby formed when a plurality of masks are arrayed in a lateral direction thereof.
    Type: Grant
    Filed: October 21, 2009
    Date of Patent: January 8, 2013
    Assignee: Ulvac, Inc.
    Inventors: Miwa Watai, Kazuya Saito, Takashi Komatsu, Yusuke Mizuno, Atsushi Ota, Shunji Kuroiwa