Abstract: An aluminum alloy thick plate is formed of an aluminum alloy including Mg of 2.0 to 5.0 mass %, and has a plate thickness of 300 to 400 mm. A is 700 pieces/cm2 or less and B is 1.3 times or more as large as A, where (i) A (pieces/cm2) is a maximum value in numbers of crystallized products with a maximum length of 60 ?m or more per unit area in each of positions located at a center portion in a thickness direction and at positions of 0.39 Wa to 0.48 Wa in a plate width direction; and (ii) B (pieces/cm2) is a maximum value in numbers of crystallized products with a maximum length of 60 ?m or more per unit area in each of positions located at the center portion in the thickness direction and at positions of 0.12 Wa to 0.30 Wa in the plate width direction.

Abstract: The solid electrolyte material of the present disclosure is made of Li, Ca, Y, Gd, X, and O, where X is at least one selected from the group consisting of F, Cl, Br, and I; and the molar ratio of O to the sum of Y and Gd is greater than O and 0.51 or less.

Abstract: A solid electrolyte material is made of Li, Ca, Y, Gd, X, O, and H, where X is at least one selected from the group consisting of F, Cl, Br, and I; and the molar ratio of O to the sum of Y and Gd is greater than 0 and less than 0.82.

Abstract: The production method of the present disclosure includes heat-treating a material mixture containing a compound containing Y, a compound containing Sm, NH4?, Li?, and Ca?2 in an inert gas atmosphere. The compound containing Y is at least one selected from the group consisting of Y2O3 and Y?3, and the compound containing Sm is at least one selected from the group consisting of Sm2O3 and Sm?3. The material mixture contains at least one selected from the group consisting of Y2O3 and Sm2O3, and ?, ?, ?, ?, and ? are each independently at least one selected from the group consisting of F, Cl, Br, and I.

Abstract: A production method for producing a halide, the method includes a heat treatment step of heat-treating a mixed material containing (NH4)aY?3+a, (NH4)bSm?3+b, Li?, and Ca?2 in an inert gas atmosphere, wherein ?, ?, ?, and ? are each independently at least one selected from the group consisting of F, Cl, Br, and I, and the following three formulas: 0?a?3, 0?b?3, and 0<a+b?6, are satisfied.

Abstract: The solid electrolyte material of the present disclosure includes Li, Ca, Y, Sm, X, and O, wherein X is at least one selected from the group consisting of F, Cl, Br, and I.

Abstract: The solid electrolyte material of the present disclosure is a solid electrolyte material made of Li, Ca, Y, Gd, X, and O, where X is at least one selected from the group consisting of F, Cl, Br, and I; the molar ratio of O to the sum of Y and Gd in the entire solid electrolyte material is greater than 0 and 0.42 or less; and O is present in a surface region of the solid electrolyte material.

Abstract: A production method for producing a halide, the method includes a heat treatment step of heat-treating a mixed material containing (NH4)aY?3+a, (NH4)bGd?3+b, Li?, and Ca?2 in an inert gas atmosphere, wherein ?, ?, ?, and ? are each independently at least one selected from the group consisting of F, Cl, Br, and I, and the formulas: 0?a?3, 0?b?3, and 0<a+b?6, are satisfied.

Abstract: The solid electrolyte material of the present disclosure includes Li, Ca, Y, Sm, X, O, and H, wherein, X is at least one selected from the group consisting of F, Cl, Br, and I; and the molar ratio of O to the sum of Y and Sm is greater than 0 and less than 0.32.

Abstract: The solid electrolyte material of the present disclosure includes Li, Ca, Y, Sm, X, and O, where Xis at least one selected from the group consisting of F, Cl, Br, and I; and the molar ratio of O to the sum of Y and Sm in a surface area of the solid electrolyte material is higher than the molar ratio of O to the sum of Y and Sm in the entire solid electrolyte material.

Abstract: The production method of the present disclosure includes: heat-treating a material mixture containing LiA, YB3, GdC3, and CaD2 in an inert gas atmosphere. A, B, C, and D are each independently at least one selected from the group consisting of F, Cl, Br, and I. In the heat-treating, the material mixture is heat-treated at higher than or equal to 200° C. and lower than or equal to 700° C.

Abstract: A measurement method includes: (a) measuring an emission intensity for each wavelength of light detected from a plasma generated in a plasma processing apparatus at each different exposure time by a light receiving element; (b) specifying, with respect to each of a plurality of different individual wavelength ranges that constitutes a predetermined wavelength range, a distribution of the emission intensity in the individual wavelength range measured at an exposure time at which an emission intensity of a predetermined wavelength included in the individual wavelength range becomes an emission intensity within a predetermined range; (c) selecting a distribution of the emission intensity in the individual wavelength range from the distribution of the emission intensity specified in (b); and (d) outputting the distribution of the emission intensity selected for each individual wavelength range.

Abstract: The solid electrolyte material comprises Li, Y, X, and O, where X is one selected from the group consisting of F, Cl, Br, and I, and the molar ratio of O to Y is greater than 0.01 and less than 0.52.

Abstract: The solid electrolyte material comprises Li, Y, X, O, and H, where X is one selected from the group consisting of F, Cl, Br, and I, and the molar ratio of O to Y is greater than 0.01 and less than 0.38.

Abstract: A circuit assembly includes an integrated circuit (IC) die and a capacitor die. The IC die has a first hybrid bonding layer. The capacitor die is stacked with the IC die, and is configured to include a capacitor coupled to the IC die, and has a second hybrid bonding layer in contact with the first hybrid bonding layer; wherein the IC die is electrically coupled to the capacitor die through the first hybrid bonding layer and the second hybrid bonding layer.

Abstract: A solid electrolyte composition according to the present disclosure includes a halide solid electrolyte material and an organic solvent. The halide solid electrolyte material has an average particle size of less than or equal to 1 ?m. The organic solvent consists of at least one selected from the group consisting of a compound having a functional group and a hydrocarbon. The functional group includes at least one selected from the group consisting of an ether group and a halogen group.

Abstract: A fiber reinforced resin molded article includes a fiber reinforced resin layer, and a functional site made up from a resin layer for molding that does not contain reinforcing fibers. An insert member is retained in an integrated manner in the functional site.

Abstract: This invention is intended to identify a gene cluster involved in biosynthesis of a cyclic peptide compound produced by a filamentous fungus of the Curvularia species and to establish a system for synthesizing such cyclic peptide compound. The gene is composed of a first module to a tenth module and encodes a protein having activity of synthesizing a nonribosomal peptide constituting a basic peptide backbone of a cyclic peptide compound produced by a filamentous fungus of the Curvularia species.

Abstract: A method for manufacturing a semiconductor structures is provided. The method includes forming a first hybrid bonding layer over a first wafer having a logic structure, forming a second hybrid bonding layer over a second wafer having a first capacitor structure, bonding the first wafer and the second wafer through a hybrid bonding operation to connect the first hybrid bonding layer and the second hybrid bonding layer, thereby obtaining a first bonded wafer, and the first capacitor structure is electrically connected to the logic structure through the first hybrid bonding layer and the second hybrid bonding layer, and singulating the first bonded wafer to obtain a plurality of semiconductor structures.

Abstract: A circuit assembly includes an integrated circuit (IC) die and a first capacitor die. The IC die provides an IC and includes a plurality of first conductive pads. The first capacitor die provides a plurality of capacitors, and includes a plurality of second conductive pads at the first side and a plurality of conductive vias at the second side. At least one of the second conductive pads electrically connects to the capacitors. The conductive vias is adapted to form a plurality of external signal connections of the IC die and the first capacitor die. The IC die is stacked with the first capacitor die in such a way that the first conductive pads electrically connect to the second conductive pads, and surfaces of the IC die and the first capacitor die attaching to each other are substantially of the same size.