Abstract: Systems and methods for encapsulating a stack of semiconductor dice are described. A stack of semiconductor dice may be formed, for example by attaching die to flexible printed circuit supports attached to frames and stacking the supports, and then encapsulated by flowing a liquid encapsulant around the stack of dice and solidifying the liquid encapsulant. The die supports may contain encapsulant flow openings, such as rectangular slits, that allow the liquid encapsulant to flow around the stack of dice.

Abstract: A method for producing a molded flip chip package is described. The incomplete flip chip package comprising a thin substrate and a silicon chip is placed in a mold. A resin, preferably epoxy, is injected into the mold filling the gap between the surface of the flip chip and the adjacent substrate. Additionally, a stiffening structure is formed to increase the overall rigidity of the thin substrate specifically and the package as a whole.

Abstract: Multi-purpose planarizing/back-grind/pre-under-fill arrangements for bumped wafers and dies, in which a planarizing coating provides improved and continued surface protection to the circuit surface of a wafer or die throughout back-grinding and subsequent mounting operations, and provides improved stiffening/strengthening of the wafer and die throughout back-grinding and subsequent mounting operations.

Abstract: A method for producing a molded flip chip package is described. The incomplete flip chip package comprising a thin substrate and a silicon chip is placed in a mold. A resin, such as an epoxy, is injected into the mold filling the gap between the surface of the flip chip and the adjacent substrate. Additionally, a stiffening structure is formed to increase the overall rigidity of the thin substrate specifically and the package as a whole.

Abstract: Chip lead frames are made by disposing a die having terminals on a substrate surface to form a cavity between the die and the substrate and contacts between the terminals and the substrate. A compound is applied to the surface such that the compound enters that cavity and forms a layer on the upper substrate surface. The layer can impart sufficient rigidity to the assembly that the substrate can be etched to produce a lead frame. Also disclosed are devices that include a die, a lead frame, and a continuous network that can form a layer on the lead frame and fill the cavity between the die and the lead frame.

Abstract: A method for producing a molded flip chip package is described. The incomplete flip chip package comprising a thin substrate and a silicon chip is placed in a mold. A resin, preferably epoxy, is injected into the mold filling the gap between the surface of the flip chip and the adjacent substrate. Additionally, a stiffening structure is formed to increase the overall rigidity of the thin substrate specifically and the package as a whole.