Patents by Inventor Takashi Kyono

Takashi Kyono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11616337
    Abstract: An optical module includes a light-forming unit to form light. The light-forming unit includes a base member having an electronic temperature control module, a base plate, a plurality of submounts, and a microelectromechanical system (MEMS) base. The light-forming unit also includes a plurality of laser diodes arranged on the submounts, a filter arranged on the base plate and located to receive the light emitted from the plurality of laser diodes and multiplex the emitted light, a MEMS arranged on the MEMS base and located to receive the light multiplexed by the filter. The MEMS includes a scanning mirror to scan the light multiplexed by the filter, and the electronic temperature control module regulates a temperature range of the MEMS. The light-forming unit also includes a protective member surrounding and sealing the light-forming unit, which includes a base body and a lid welded to the base body.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: March 28, 2023
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yohei Enya, Shinya Ito, Hiromi Nakanishi, Takashi Kyono
  • Patent number: 11609423
    Abstract: A mirror driving mechanism includes a plate-shaped base portion, a mirror that is installed at the base portion, and a temperature detecting section that is installed at the base portion and that detects a temperature of the base portion. The base portion includes a thin portion that is disposed away from an outer edge of the base portion and that has a through hole extending through the base portion in a plate-thickness direction of the base portion, a thick portion that is connected to the thin portion, that is thicker than the thin portion in the plate-thickness direction of the base portion, and that extends along the outer edge so as to surround the thin portion, and a first shaft portion extends into the through hole from an outer periphery of the through hole.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: March 21, 2023
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yohei Enya, Shinya Ito, Takashi Kyono
  • Publication number: 20220206289
    Abstract: An optical module includes a light-forming unit configured to form light, and a protective member surrounding and sealing the light-forming unit. The light-forming unit includes a laser diode, a first MEMS including a first mirror having a first reflective surface that reflects and scans light from the laser diode, the first mirror oscillating to form a first plane, and a second MEMS including a second mirror having a second reflective surface that reflects and scans light from the first mirror, the second mirror oscillating to form a second plane orthogonal to the first plane.
    Type: Application
    Filed: December 19, 2019
    Publication date: June 30, 2022
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Shinya ITO, Yohei ENYA, Takashi KYONO, Hiromi NAKANISHI
  • Publication number: 20220123520
    Abstract: An optical module includes a light-forming unit to form light. The light-forming unit includes a base member having an electronic temperature control module, a base plate, a plurality of submounts, and a microelectromechanical system (MEMS) base. The light-forming unit also includes a plurality of laser diodes arranged on the submounts, a filter arranged on the base plate and located to receive the light emitted from the plurality of laser diodes and multiplex the emitted light, a MEMS arranged on the MEMS base and located to receive the light multiplexed by the filter. The MEMS includes a scanning mirror to scan the light multiplexed by the filter, and the electronic temperature control module regulates a temperature range of the MEMS. The light-forming unit also includes a protective member surrounding and sealing the light-forming unit, which includes a base body and a lid welded to the base body.
    Type: Application
    Filed: December 29, 2021
    Publication date: April 21, 2022
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yohei ENYA, Shinya ITO, Hiromi NAKANISHI, Takashi KYONO
  • Patent number: 11245245
    Abstract: An optical module includes a light-forming unit configured to form light, and a protective member surrounding and sealing the light-forming unit. The light-forming unit includes a base member including an electronic temperature control module, a plurality of laser diodes arranged on the base member, a filter arranged on the base member and configured to multiplex light from the plurality of laser diodes, a beam shaping portion arranged on the base member and configured to convert a beam shape of the light multiplexed by the filter, and a MEMS arranged on the base member and including a scanning mirror configured to scan the light shaped in the beam shaping portion. The protective member includes a base body, and a lid welded to the base body.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: February 8, 2022
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yohei Enya, Shinya Ito, Hiromi Nakanishi, Takashi Kyono
  • Publication number: 20210167573
    Abstract: An optical module includes a light-forming unit configured to form light, and a protective member surrounding and sealing the light-forming unit. The light-forming unit includes a base member including an electronic temperature control module, a plurality of laser diodes arranged on the base member, a filter arranged on the base member and configured to multiplex light from the plurality of laser diodes, a beam shaping portion arranged on the base member and configured to convert a beam shape of the light multiplexed by the filter, and a MEMS arranged on the base member and including a scanning mirror configured to scan the light shaped in the beam shaping portion. The protective member includes a base body, and a lid welded to the base body.
    Type: Application
    Filed: March 5, 2019
    Publication date: June 3, 2021
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yohei ENYA, Shinya ITO, Hiromi NAKANISHI, Takashi KYONO
  • Publication number: 20200132985
    Abstract: A mirror driving mechanism includes a plate-shaped base portion, a mirror that is installed at the base portion, and a temperature detecting section that is installed at the base portion and that detects a temperature of the base portion. The base portion includes a thin portion that is disposed away from an outer edge of the base portion and that has a through hole extending through the base portion in a plate-thickness direction of the base portion, a thick portion that is connected to the thin portion, that is thicker than the thin portion in the plate-thickness direction of the base portion, and that extends along the outer edge so as to surround the thin portion, and a first shaft portion extends into the through hole from an outer periphery of the through hole.
    Type: Application
    Filed: March 19, 2019
    Publication date: April 30, 2020
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yohei ENYA, Shinya ITO, Takashi KYONO
  • Patent number: 10333270
    Abstract: An optical module 1 according to an embodiment includes a plurality of laser diodes (LDs) 21 to 23, a multiplexing optical system 30 combining a plurality of laser beams from the respective plurality of LDs, and a package 10 accommodating the plurality of LDs and the multiplexing optical system. The package includes a support mounted with the multiplexing optical system, and a cap having a transmissive window that allows a resultant light beam to pass through. At least one of the LDs has an oscillation wavelength of nor more than 550 nm. The package has an internal moisture content of not more than 3000 ppm. The multiplexing optical system is fixed to the support by a resin curing adhesive.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: June 25, 2019
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Takashi Kyono, Hideyuki Ijiri, Takao Nakamura, Hiromi Nakanishi, Takatoshi Ikegami, Kuniaki Ishihara, Yohei Enya, Tetsuya Kumano
  • Patent number: 10326034
    Abstract: A semiconductor layer includes a first semiconductor layer containing a III-V group compound semiconductor and having a first conductivity type, a quantum-well structure containing a III-V group compound semiconductor, a second semiconductor layer containing a III-V group compound semiconductor, a third semiconductor layer containing a III-V group compound semiconductor, and a fourth semiconductor layer containing a III-V group compound semiconductor and having a second conductivity type different from the first conductivity type. The first semiconductor layer, the quantum-well structure, the second semiconductor layer, the third semiconductor layer, and the fourth semiconductor layer are stacked in this order. The concentration of an impurity that generates carriers of the second conductivity type is lower in the third semiconductor layer than in the fourth semiconductor layer.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: June 18, 2019
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Suguru Arikata, Takuma Fuyuki, Susumu Yoshimoto, Takashi Kyono, Katsushi Akita
  • Publication number: 20190044010
    Abstract: A semiconductor layer includes a first semiconductor layer containing a III-V group compound semiconductor and having a first conductivity type, a quantum-well structure containing a III-V group compound semiconductor, a second semiconductor layer containing a III-V group compound semiconductor, a third semiconductor layer containing a III-V group compound semiconductor, and a fourth semiconductor layer containing a III-V group compound semiconductor and having a second conductivity type different from the first conductivity type. The first semiconductor layer, the quantum-well structure, the second semiconductor layer, the third semiconductor layer, and the fourth semiconductor layer are stacked in this order. The concentration of an impurity that generates carriers of the second conductivity type is lower in the third semiconductor layer than in the fourth semiconductor layer.
    Type: Application
    Filed: January 24, 2017
    Publication date: February 7, 2019
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Suguru ARIKATA, Takuma FUYUKI, Susumu YOSHIMOTO, Takashi KYONO, Katsushi AKITA
  • Patent number: 10199795
    Abstract: An optical module 1 according to an embodiment includes a plurality of laser diodes (LDs) 21 to 23, a multiplexing optical system 30 combining a plurality of laser beams from the respective plurality of LDs, and a package 10 accommodating the plurality of LDs and the multiplexing optical system. The package includes a support mounted with the multiplexing optical system, and a cap having a transmissive window that allows a resultant light beam to pass through. At least one of the LDs has an oscillation wavelength of nor more than 550 nm. The package has an internal moisture content of not more than 3000 ppm. The multiplexing optical system is fixed to the support by a resin curing adhesive.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: February 5, 2019
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Takashi Kyono, Hideyuki Ijiri, Takao Nakamura, Hiromi Nakanishi, Takatoshi Ikegami, Kuniaki Ishihara, Yohei Enya, Tetsuya Kumano
  • Patent number: 10158035
    Abstract: A semiconductor stack includes a first-conductivity-type layer of a first conductivity type, the first-conductivity-type layer being formed of a III-V compound semiconductor; a quantum well light-receiving layer formed of a III-V compound semiconductor; and a second-conductivity-type layer of a second conductivity type different from the first conductivity type, the second-conductivity-type layer being formed of a III-V compound semiconductor. The first-conductivity-type layer, the quantum well light-receiving layer, and the second-conductivity-type layer are stacked in this order. The quantum well light-receiving layer has a thickness of 0.5 ?m or more. The quantum well light-receiving layer has a carrier concentration of 1×1016 cm?3 or less.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: December 18, 2018
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Takuma Fuyuki, Suguru Arikata, Takashi Kyono, Yusuke Yoshizumi, Katsushi Akita
  • Patent number: 10024516
    Abstract: An optical module includes a transmitting member. The transmitting member is fixed to a cap member so as to cover a through-hole. On the assumption that the height of one point on a first surface in a state in which the transmitting member is detached from the cap member is zero and the direction toward the outside of the optical module is a positive direction, the amount of warp that is a difference between the displacement at the central point and the displacement at a standard point, on the first surface, corresponding to a reference point, on the projection image, away from a center of gravity by a particular distance is different between a first geodesic line and a second geodesic line, the displacement being a height of the one point in a direction of the optical axis in a state in which the transmitting member is fixed to the cap member. The transmitting member is joined to the cap member at the first surface or the second surface.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: July 17, 2018
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Takashi Kyono, Hiromi Nakanishi, Hideyuki Ijiri, Kaoru Shibata
  • Publication number: 20180122971
    Abstract: A semiconductor stack includes a first-conductivity-type layer of a first conductivity type, the first-conductivity-type layer being formed of a III-V compound semiconductor; a quantum well light-receiving layer formed of a III-V compound semiconductor; and a second-conductivity-type layer of a second conductivity type different from the first conductivity type, the second-conductivity-type layer being formed of a III-V compound semiconductor. The first-conductivity-type layer, the quantum well light-receiving layer, and the second-conductivity-type layer are stacked in this order. The quantum well light-receiving layer has a thickness of 0.5 ?m or more. The quantum well light-receiving layer has a carrier concentration of 1×1016 cm?3 or less.
    Type: Application
    Filed: April 8, 2016
    Publication date: May 3, 2018
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Takuma FUYUKI, Suguru ARIKATA, Takashi KYONO, Yusuke YOSHIZUMI, Katsushi AKITA
  • Patent number: 9929301
    Abstract: A semiconductor stack includes a substrate composed of a III-V group compound semiconductor, a buffer layer that is arranged on the substrate and that is composed of a III-V group compound semiconductor, and an active layer that is arranged on the buffer layer and that includes a layer composed of a III-V group compound semiconductor containing Sb as a group V element. A region of the buffer layer including a main surface of the buffer layer adjacent to the substrate includes a high-concentration region having a high total concentration of Si and C compared with another adjacent region.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: March 27, 2018
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Takashi Kyono, Suguru Arikata, Katsushi Akita
  • Publication number: 20180062019
    Abstract: A semiconductor stack includes a substrate composed of a III-V group compound semiconductor, a buffer layer that is arranged on the substrate and that is composed of a III-V group compound semiconductor, and an active layer that is arranged on the buffer layer and that includes a layer composed of a III-V group compound semiconductor containing Sb as a group V element. A region of the buffer layer including a main surface of the buffer layer adjacent to the substrate includes a high-concentration region having a high total concentration of Si and C compared with another adjacent region.
    Type: Application
    Filed: January 12, 2016
    Publication date: March 1, 2018
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Takashi KYONO, Suguru ARIKATA, Katsushi AKITA
  • Patent number: 9887310
    Abstract: A semiconductor layered structure includes a substrate formed of a III-V compound semiconductor, a buffer layer disposed on and in contact with the substrate and formed of a III-V compound semiconductor, and a quantum well layer disposed on and in contact with the buffer layer and including a plurality of component layers formed of III-V compound semiconductors. The substrate has a diameter of 55 mm or more. At least one of the component layers is formed of a mixed crystal of three or more elements. When the compound semiconductor forming the substrate has a lattice constant d1, the compound semiconductor forming the buffer layer has a lattice constant d2, and the compound semiconductors forming the quantum well layer have an average lattice constant d3, (d2?d1)/d1 is ?3×10?3 or more and 3×10?3 or less, and (d3?d1)/d1 is ?3×10?3 or more and 3×10?3 or less.
    Type: Grant
    Filed: January 19, 2015
    Date of Patent: February 6, 2018
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Katsushi Akita, Kei Fujii, Takashi Kyono, Koji Nishizuka, Kaoru Shibata
  • Publication number: 20180019568
    Abstract: An optical module 1 according to an embodiment includes a plurality of laser diodes (LDs) 21 to 23, a multiplexing optical system 30 combining a plurality of laser beams from the respective plurality of LDs, and a package 10 accommodating the plurality of LDs and the multiplexing optical system. The package includes a support mounted with the multiplexing optical system, and a cap having a transmissive window that allows a resultant light beam to pass through. At least one of the LDs has an oscillation wavelength of nor more than 550 nm. The package has an internal moisture content of not more than 3000 ppm. The multiplexing optical system is fixed to the support by a resin curing adhesive.
    Type: Application
    Filed: September 26, 2017
    Publication date: January 18, 2018
    Inventors: Takashi Kyono, Hideyuki Ijiri, Takao Nakamura, Hiromi Nakanishi, Takatoshi Ikegami, Kuniaki Ishihara, Yohei Enya, Tetsuya Kumano
  • Publication number: 20180010763
    Abstract: An optical module includes a transmitting member. The transmitting member is fixed to a cap member so as to cover a through-hole. On the assumption that the height of one point on a first surface in a state in which the transmitting member is detached from the cap member is zero and the direction toward the outside of the optical module is a positive direction, the amount of warp that is a difference between the displacement at the central point and the displacement at a standard point, on the first surface, corresponding to a reference point, on the projection image, away from a center of gravity by a particular distance is different between a first geodesic line and a second geodesic line, the displacement being a height of the one point in a direction of the optical axis in a state in which the transmitting member is fixed to the cap member. The transmitting member is joined to the cap member at the first surface or the second surface.
    Type: Application
    Filed: July 7, 2017
    Publication date: January 11, 2018
    Inventors: Takashi Kyono, Hiromi Nakanishi, Hideyuki Ijiri, Kaoru Shibata
  • Patent number: 9806494
    Abstract: An optical module 1 according to an embodiment includes a plurality of laser diodes (LDs) 21 to 23, a multiplexing optical system 30 combining a plurality of laser beams from the respective plurality of LDs, and a package 10 accommodating the plurality of LDs and the multiplexing optical system. The package includes a support mounted with the plurality of LDs and the multiplexing optical system, and a cap having a transmissive window that allows a resultant light beam to pass through. At least one of the LDs has an oscillation wavelength of nor more than 550 nm. The package has an internal moisture content of not more than 3000 ppm. The multiplexing optical system is fixed to the support by a resin curing adhesive.
    Type: Grant
    Filed: November 17, 2016
    Date of Patent: October 31, 2017
    Inventors: Takashi Kyono, Hideyuki Ijiri, Takao Nakamura, Hiromi Nakanishi, Takatoshi Ikegami, Kuniaki Ishihara, Yohei Enya, Tetsuya Kumano