Abstract: An inductance element and a case; the inductance element, comprising a winding type magnetic core having a hollow part formed by winding a magnetic ribbon thereon and a lead having a cross sectional dimension smaller than the inner diameter of the hollow part of the magnetic core and passing the hollow part, wherein a clearance is provided between the magnetic core and the lead; the case, comprising a plurality of members combined with each other, wherein the members are connected to each other in a surface including one or more case ridge lines.

Abstract: An inductance element and a case; the inductance element, comprising a winding type magnetic core having a hollow part formed by winding a magnetic ribbon thereon and a lead having a cross sectional dimension smaller than the inner diameter of the hollow part of the magnetic core and passing the hollow part, wherein a clearance is provided between the magnetic core and the lead; the case, comprising a plurality of members combined with each other, wherein the members are connected to each other in a surface including one or more case ridge lines.

Abstract: An inductance element and a case; the inductance element, comprising a winding type magnetic core having a hollow part formed by winding a magnetic ribbon thereon and a lead having a cross sectional dimension smaller than the inner diameter of the hollow part of the magnetic core and passing the hollow part, wherein a clearance is provided between the magnetic core and the lead; the case, comprising a plurality of members combined with each other, wherein the members are connected to each other in a surface including one or more case ridge lines.

Abstract: A liquid phase diffusion bonding method for dissimilar metal sheets by allowing a galvanized steel sheet and an aluminum alloy sheet to come into close contact with each other and pressing both sheets by using a first mold of a liquid phase diffusion bonding apparatus and a second mold of the same; and heating the sheets at approximately the same heat-up rate and at approximately the same temperature to perform liquid phase diffusion bonding of the sheets by using induction heat generated by applying high frequency currents to a first high frequency induction heating coil provided on the first mold and a second high frequency induction heating coil provided on the second mold. The first high frequency induction heating coil and the second high frequency induction heating coil are positioned to sandwich the sheets at predetermined distances from the sheets, respectively.

Abstract: In a sensor unit, an antenna section receives a high-frequency signal transmitted from a positioning system for output to a combining circuit. Also, in the sensor unit, a sensor section detects an angular velocity around one axis, and further detects an acceleration in directions of two axes (that is, X and Y axes) . Furthermore, the sensor section uses the detected angular velocity and acceleration to generate a data unit including at least data indicative of the angular velocity and data indicative of the acceleration. The sensor section then performs a digital modulation process with the generated data unit. The combining circuit combines the high-frequency signal output from the antenna section and a digital modulated signal output from the sensor section, and then outputs the resultant composite signal to a coaxial cable.

Abstract: In a semiconductor optical modulator of this invention, each quantum-well layer and each barrier layer of a quantum-well structure serving as a light absorption layer are respectively made of In1-X-YGaXAlYN (0?X, Y?1, 0?X+Y?1) and In1-X?-Y?GaX?AlY?N (0?X?, Y??1, 0?X?+Y??1). An electric field is being generated in the light absorption layer by spontaneous polarization.

Abstract: A liquid phase diffusion bonding method for dissimilar metal sheets of the present invention has the steps of: allowing a galvanized steel sheet and an aluminum alloy sheet to come into close contact with each other and pressing both sheets by using a first mold of a liquid phase diffusion bonding apparatus and a second mold of the same; and heating the galvanized steel sheet and the aluminum alloy sheet at approximately the same heat-up rate and at approximately the same temperature to perform liquid phase diffusion bonding of the sheets by using induction heat generated by applying high frequency currents to a first high frequency induction heating coil provided on the first mold and a second high frequency induction heating coil provided on the second mold. The first high frequency induction heating coil and the second high frequency induction heating coil are positioned to sandwich the galvanized steel sheet and the aluminum alloy sheet at predetermined distances from the sheets, respectively.

Abstract: A semiconductor light-emitting device of this invention includes at least a first cladding layer formed on a substrate, a light-emitting structure including an active layer made of In1?X?YGaXAlYN (0?X, Y?1, 0?X+Y<1) and formed on the first cladding layer, and a second cladding layer formed on the light-emitting structure. The active layer is made of a material with a small Auger effect and a small dependency of its band gap energy on environment temperature.

Abstract: An inductance element and a case; the inductance element, comprising a winding type magnetic core having a hollow part formed by winding a magnetic ribbon thereon and a lead having a cross sectional dimension smaller than the inner diameter of the hollow part of the magnetic core and passing the hollow part, wherein a clearance is provided between the magnetic core and the lead; the case, comprising a plurality of members combined with each other, wherein the members are connected to each other in a surface including one or more case ridge lines.

Abstract: In a sensor unit 1, an antenna section 11 receives a high-frequency signal transmitted from a positioning system for output to a combining circuit 13. Also, in the sensor unit 1, a sensor section 12 detects an angular velocity around one axis, and further detects an acceleration in directions of two axes (that is, X and Y axes). Furthermore, the sensor section 12 uses the detected angular velocity and acceleration to generate a data unit including at least data indicative of the angular velocity and data indicative of the acceleration. The sensor section 12 then performs a digital modulation process with the generated data unit. The combining circuit 13 combines the high-frequency signal output from the antenna section 11 and a digital modulated signal output from the sensor section 12, and then outputs the resultant composite signal to a coaxial cable 3.

Abstract: In a semiconductor optical modulator of this invention, each quantum-well layer and each barrier layer of a quantum-well structure serving as a light absorption layer are respectively made of In1-X-YGaXAlYN (0≦X, Y≦1, 0≦X+Y≦1) and In1-X′-Y′GaX′AlY′N (0≦X′, Y′≦1, 0≦X′+Y′≦1). An electric field is being generated in the light absorption layer by spontaneous polarization.

Abstract: A compact vehicle production line. The production line comprises a floor process of assembling floor constituent parts. Each is an aluminum alloy extrusion die cast product, which has been made, in an extrusion die casting process, by forcing molten aluminum alloy through a mold cavity in a predetermined direction. The assembled floor constituent parts are welded to make a floor structure. In an interior parts mount process, interior parts are to the floor structure to make a floor unit. In a body main process, each of two body side structures are trimmed to make a body side unit. A roof structure is trimmed to make a roof unit. The floor unit, the body side units, and the roof unit are assembled. The assembly is welded to make a body unit. In a running parts mount process, an under running unit is mounted to the body unit. In an exterior parts attachment process, color body panels are attached to the body unit.

Abstract: A compact vehicle production line is disclosed. The production line comprises a floor process of assembling floor constituent parts. Each is an aluminum alloy extrusion die cast product, which has been made, in an extrusion die casting process, by forcing molten aluminum alloy through a mold cavity in a predetermined direction. The assembled floor constituent parts are welded to make a floor structure. In an interior parts mount process, interior parts are to the floor structure to make a floor unit. In a body main process, each of two body side structures are trimmed to make a body side unit. A roof structure is trimmed to make a roof unit. The floor unit, the body side units, and the roof unit are assembled. The assembly is welded to make a body unit. In a running parts mount process, an under running unit is mounted to the body unit. In an exterior parts attachment process, color body panels are attached to the body unit.

Abstract: A semiconductor light-emitting device of this invention includes at least a first cladding layer formed on a substrate, a light-emitting structure including an active layer made of In1−X−YGaXAlYN (0≦X, Y≦1, 0≦X+Y<1) and formed on the first cladding layer, and a second cladding layer formed on the light-emitting structure. The active layer is made of a material with a small Auger effect and a small dependency of its band gap energy on environment temperature.

Abstract: In a sapphire substrate having a heteroepitaxial growth surface, the heteroepitaxial growth surface is parallel to a plane obtained by rotating a (01{overscore (1)}0) plane of the sapphire substrate about a c-axis of the sapphire substrate through 8° to 20° in a crystal lattice of the sapphire substrate. A semiconductor device, electronic component, and crystal growing method are also disclosed.

Abstract: Provided are a wafer polishing method in which, in single side polishing, covering a wafer holding surface (one side surface) with a protective film, a wafer polishing surface (the other side surface) is polished, so that the wafer holding surface can be prevented from being etched and contaminated by a polishing agent; a wafer cleaning method in which the protective film that remains behind on the wafer holding surface after polishing can be efficiently removed, and a waste cleaning solution is easily treated; and a wafer protective film that sufficiently covers the wafer holding surface in polishing but is effectively removed in cleaning.

Abstract: There is disclosed a pellicle having a pellicle frame with at least one vent for controlling atmospheric pressure and a filter attached so as to cover the vent, wherein it takes 5 minutes to 180 minutes, to restore a pellicle film swelled during a step of attaching the pellicle to the exposure original plate under atmospheric pressure of 760 mmHg followed by reducing atmospheric pressure to 500 mmHg and keeping the pressure, to the original state and a method for producing it, and a pellicle with a filter having a pellicle frame with at least one vent for controlling atmospheric pressure wherein all over the inner surface of the filter attached so as to cover said vent is impregnated with a resin, and 50% by volume or more of the filter is impregnated therewith.

Abstract: A compact vehicle production line is disclosed. The production line comprises a floor process of assembling floor constituent parts. Each is an aluminum alloy extrusion die cast product, which has been made, in an extrusion die casting process, by forcing molten aluminum alloy through a mold cavity in a predetermined direction. The assembled floor constituent parts are welded to make a floor structure. In an interior parts mount process, interior parts are to the floor structure to make a floor unit. In a body main process, each of two body side structures are trimmed to make a body side unit. A roof structure is trimmed to make a roof unit. The floor unit, the body side units, and the roof unit are assembled. The assembly is welded to make a body unit. In a running parts mount process, an under running unit is mounted to the body unit. In an exterior parts attachment process, color body panels are attached to the body unit.

Abstract: In a sapphire substrate having a heteroepitaxial growth surface, the heteroepitaxial growth surface is parallel to a plane obtained by rotating a (01{overscore (1)}0) plane of the sapphire substrate about a c-axis of the sapphire substrate through 8° to 20° in a crystal lattice of the sapphire substrate. A semiconductor device, electronic component, and crystal growing method are also disclosed.

Abstract: A compact vehicle production line is disclosed. The production line comprises a floor process of assembling floor constituent parts. Each is an aluminum alloy extrusion die cast product, which has been made, in an extrusion die casting process, by forcing molten aluminum alloy through a mold cavity in a predetermined direction. The assembled floor constituent parts are welded to make a floor structure. In an interior parts mount process, interior parts are to the floor structure to make a floor unit. In a body main process, each of two body side structures are trimmed to make a body side unit. A roof structure is trimmed to make a roof unit. The floor unit, the body side units, and the roof unit are assembled. The assembly is welded to make a body unit. In a running parts mount process, an under running unit is mounted to the body unit. In an exterior parts attachment process, color body panels are attached to the body unit.