Abstract: An optical position of a display device with respect to an optical axis of a projection optical system is displaced in a direction perpendicular to the optical axis in accordance with a change in the size of a projected image. For instance, a transparent flat plate is disposed in front of a projection lens, and the transparent flat plate is tilted in association with a rotation of a zoom adjustment ring. As the transparent flat plate is tilted, the apparent position of the display device relative to the projection lens is displaced in the direction perpendicular to the optical axis of the projection optical system. Thereby, the projected image on a screen is located at a proper position corresponding to a zoom state. Tilt control of the transparent flat plate is realized by a cam mechanism, for instance.

Abstract: A guide convex portion is formed on a base plate in parallel to an illumination optical axis. Further, a fixed-side supporting member is provided in the base plate. A first opening is formed in an upright portion of the fixed-side supporting member. A slide supporting member can be provided on the base plate. A second opening is formed in the upright portion of the slide supporting member. By inserting a tapered rod into the second opening at its light incidence side and by moving the slide supporting member along the aforementioned guide convex portion, the slide supporting member is stopped at a predetermined position and, at this position, the slide supporting member is fixed.

Abstract: A projection-type image display device includes an image light generator configured to generate image light, a projection optics configured to project the image light onto a screen. The projection optics includes a reflection mirror configured to reflect the image light toward the screen, the image light outputted from the image light generator. A projection-type image display device includes a protective cover provided on an optical path of the image light reflected by the reflection mirror. The protective cover has a transmissive region transmitting the image light reflected by the reflection mirror.

Abstract: For high density packaging of a semiconductor device, the semiconductor device has a multi-layer substrate, a first-stage chip connected electrically to the multi-layer substrate, other package substrates stacked in three stages on the multi-layer substrate and each connected to an underlying wiring substrate through solder balls, second-, third- and fourth-stage chips electrically connected respectively to the other package substrates, and solder balls provided on the bottom multi-layer substrate. The number of wiring layers in the bottom multi-layer substrate which has a logic chip is larger than that in the package substrates which have memory chips, whereby the semiconductor device can have a wiring layer not used for distribution of wires to the solder balls and wiring lines in the wiring layer can be used for the mounting of another semiconductor element or a passive component to attain high density packaging of the semiconductor device as a stacked type package.

Abstract: A projection-type image display device includes three light sources respectively configured to emit a different colored outgoing light, a light combining unit configured to combine outgoing lights, and a projection unit configured to project a combined light combined by the light combining it. The projection-type image display device includes a first cooler configured to cool a first light source of the three light sources, and a second cooler configured to cool a second and a third light source of the three light sources except the first light source.

Abstract: A semiconductor device uses a package substrate on which bonding leads are formed respectively corresponding to bonding pads for address and data which are distributed to opposing first and second sides of a memory chip and address terminals and data terminals which are connected to the bonding leads. The semiconductor device further includes an address output circuit and a data input/output circuit which also serves for memory access and a signal processing circuit having a data processing function. A semiconductor chip having bonding pads connected to the bonding leads corresponding to the address terminals of the package substrate and bonding pads connected to the bonding leads corresponding to the data terminals of the package substrate and distributed to two sides out of four sides and the above-mentioned memory chip are mounted on the package substrate in a stacked structure.

Abstract: There are provided a write light valve for generating image-writing light by modulating write light, a driver for writing images into the write light valve based on image data, read light valves for each color for generating respective color image lights by modulating each received color illumination light, an imaging lens group for guiding the image-writing light emitted from the write light valve to the respective read light valves, a dichroic cube for combining together color image lights emitted from the respective read light valves, a projection lens for projecting each color image light combined together. The imaging lens group has a distortion aberration which reduces or cancels out a distortion aberration of the projection lens.

Abstract: An ion wind generator (20) is arranged on one side of a light source (1). The ion wind generator (20) produces an air current by negatively ionizing air by corona discharges at a needle electrode (21), or negative side, and drawing the negatively-ionized air at a cylindrical electrode (22), or positive side. The air current blows toward the light source (1) and removes heat generated by the light source (1). An ultraviolet ray from the light source (1) is introduced to a vent of the ion wind generator (20) by a first dichroic mirror (4) and a ultraviolet ray reflection mirror (17). Though air exhausted from the vent includes ozone (o3) produced by corona discharges, the ozone is decomposed by the ultraviolet ray.

Abstract: A semiconductor device is disclosed wherein first wiring lines in a first row extend respectively from first connecting portions toward one side of a semiconductor chip, while second wiring lines extend respectively from second connecting portions toward the side opposite to the one side of the semiconductor chip. The reduction in size of the semiconductor device can be attained.

Abstract: a liquid cooling apparatus provided on an apparatus having a heat unit generating heat, and configured to cool the heat unit by coolant includes; a coolant tank configured to store the coolant; a radiator configured to cool the coolant; and a coolant pipe which is a flow path of the coolant and connecting the coolant tank and the radiator. The coolant tank is arranged adjacent to the radiator in a horizontal direction when the apparatus disposed statically. A size of the coolant tank in a vertical direction is larger than a size of the coolant tank in a horizontal direction when the apparatus is disposed statically.

Abstract: The present invention provides a semiconductor device having a stacked structure which realizes the miniaturization of a contour size and the reduction of thickness. The present invention also provides a semiconductor device which realizes high performance and high reliability in addition to the miniaturization of the contour size. The semiconductor device uses a package substrate on which bonding leads which are formed respectively corresponding to bonding pads for address and data which are distributed to opposing first and second sides of a memory chip and address terminals and data terminals which are connected to the bonding leads are formed. The semiconductor device further includes an address output circuit and a data input/output circuit which are also served for memory access and a signal processing circuit having a data processing function.

Abstract: A rear projection display, not requiring a dichroic prism, and capable of rendering a generation system of each image light in color independent of the other generation systems so as to optimally construct and improve easiness of assembly of, and so on, each generation system, is provided. Each unit for projecting image-light is formed of an LED array, a rod integrator, a liquid crystal display panel, and a projection lens. A projection optical axis of the projection lens of each unit for projecting image-light is parallel each other. A unit for projecting image light in red is provided with an LED array for emitting light of a wavelength band in red, a unit for projecting image light in green is provided with an LED array for emitting light of a wavelength band in green, and a unit for projecting image light in blue is provided with an LED array for emitting light of a wavelength band in blue.

Abstract: A semiconductor device uses a package substrate on which bonding leads are formed respectively corresponding to bonding pads for address and data which are distributed to opposing first and second sides of a memory chip and address terminals and data terminals which are connected to the bonding leads. The semiconductor device further includes an address output circuit and a data input/output circuit which also serves for memory access and a signal processing circuit having a data processing function. A semiconductor chip having bonding pads connected to the bonding leads corresponding to the address terminals of the package substrate and bonding pads connected to the bonding leads corresponding to the data terminals of the package substrate and distributed to two sides out of four sides and the above-mentioned memory chip are mounted on the package substrate in a stacked structure.

Abstract: There is provided a heat conductive portion for conducting heat generated by an LED light source to cooling liquid at a rear side of each LED light source. Each heat conductive portion is connected one another with a pipe, and the cooling liquid flowing in the pipe is sequentially circulated through each heat conductive portion. A heat generation amount of an LED light source for red light is the smallest, the heat generation amount of an LED light source for green light is the largest, and the heat generation amount of an LED light source for blue light is the middle of the two. The cooling liquid cooled by passing through a radiation fin is firstly supplied to the heat conductive portion for the LED light source for red light, secondly supplied to the heat conductive portion for the LED light source for blue light, and lastly supplied to the heat conductive portion for the LED light source for green light.

Abstract: The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

Abstract: An object of the present invention is to provide a photoreaction apparatus which can inexpensively and quickly prepare a micropattern. The photoreaction apparatus comprises an LCD projector which irradiates an LCD panel for displaying an input image with light to thereby project the image; a sample laying stage on which a photoreactive sample is laid; a reducing projection lens which reduces the projected light from the LCD projector to form an image on the sample; and a zoom adjustment mechanism for adjusting a projective magnification of the image to be formed on the sample. The zoom adjustment mechanism comprises a first adjustment section for adjusting a distance between the LCD panel and the reducing projection lens; and a second adjustment section for adjusting a distance between the reducing projection lens and the sample.

Abstract: An ion wind generator (20) is arranged in the vicinity of a light source (1). The ion wind generator (20) allows an air flow by negatively ionizing air by corona discharges using negative side needle electrodes (21), and drawing the negatively-ionized air using a ground side mesh electrode (22). High-temperature air surrounding the light source (1) is drawn by the air flow and exhausted from a exhaust port at a rear side of a casing. An ozone decomposition catalyst filter 23 is provided in the exhaust port. Ozone (O3) is generated by the corona discharges in the ion wind generator (20). However, the ozone is decomposed by passing through the ozone decomposition catalyst filter 23 provided at the exhaust port.

Abstract: An ion wind generator (20) is arranged on one side of a light source (1). The ion wind generator (20) produces an air current by negatively ionizing air by corona discharges at a needle electrode (21), or negative side, and drawing the negatively-ionized air at a cylindrical electrode (22), or positive side. The air current blows toward the light source (1) and removes heat generated by the light source (1). An ultraviolet ray from the light source (1) is introduced to a vent of the ion wind generator (20) by a first dichroic mirror (4) and a ultraviolet ray reflection mirror (17). Though air exhausted from the vent includes ozone (o3) produced by corona discharges, the ozone is decomposed by the ultraviolet ray.

Abstract: A surface mounting method for mounting semiconductor devices suppresses solder peeling defects which tried to occur during mounting. The method used for mounting semiconductor devices includes a process for preparing the semiconductor devices by obtaining multiple terminals by exposing a section of each of multiple leads protruding from a rear side of the plastic casing, and forming a layer of solder by solidifying a molten solder material; a process for supplying a solder paste material to multiple electrodes on a printed circuit board; and a process for melting the solder paste of the multiple electrodes and connecting each of the multiple terminals with the multiple electrodes.

Abstract: The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.