Abstract: The present invention provides a manufacturing method or a structure capable of reducing occurrence of sealing defects and breaking defects by resolving defects in form of a joined area between a sealing material and an anisotropic conductive material. A sealing material (2) is formed in such a manner as to superimpose ends (2b) on alignment marks (15) formed on the surface of a first substrate (6a), an anisotropic conductive material is formed in such a manner as to superimpose ends 3b on alignment marks (16) formed on the surface of a second substrate (6b), and the sealing material 2 and the anisotropic conductive material (3) are joined by bonding the first substrate (6a) and the second substrate (6b) to form one-piece sealing section (4).

Abstract: A permanent magnet electric motor 10 comprises a rotor 30 provided with two stages of permanent magnets in the axial direction on an outer circumferential face of a rotor iron core, and having a shaft shifted by a stage skew angle ?r in electrical angle to decrease a first frequency component of cogging torque in the circumferential direction of the rotor iron core between two stages of the permanent magnets, a stator iron core 21 of cylindrical shape provided with the stator winding for producing a rotating magnetic field causing the rotor 30 to be rotated, and a stator 20 dividing the stator iron core 21 into plural blocks in the axial direction, and shifted by a stage skew angle ?s in electrical angle to decrease a second frequency component of the cogging torque in the circumferential direction of the stator iron core 21.

Abstract: A blow molding method includes steps of moving a split mold to a parison receiving position where a parison is supplied and receiving a parison, closing the split mold, performing blow molding at a blow molding position, and opening the split mold at a product discharge position and thereby discharging a product. The method further includes steps of: sequentially reciprocating each split mold in trains of split molds provided opposed to each other across the parison receiving position to and from a position opposed to the parison receiving position; and sequentially reciprocating the split mold disposed at the position where the split mold is opposed to the parsion receiving position to and from the parison receiving position for performing blow molding. There is also provided a blow molding apparatus for carrying out this blow molding method.

Abstract: A semiconductor device that exhibits an enhanced inhibition to a generation of voids in an underfill resin for encapsulation supplied between a semiconductor chip and an electronic component, which are mutually coupled through bump electrodes. The semiconductor device includes a first semiconductor chip and a second semiconductor chip, wherein bumps-formed surface of the first semiconductor chip is opposed to bumps-formed surface of the electronic component. The semiconductor device includes insulating films that function as protective films respectively formed on an uppermost surface of the first semiconductor chip and on an uppermost surface of the electronic component. Openings for supplying an underfill resin between the first semiconductor chip and the second semiconductor chip are provided in the vicinity of the bumps-formed regions of at least one of the insulating films.

Abstract: A permanent-magnet rotating machine includes a rotor having a rotor core carrying on a curved outer surface multiple permanent magnets arranged in two rows along an axial direction. The permanent magnets in one row are skewed from those in the other row in a circumferential direction by a row-to-row skew angle (electrical angle) ?e. A stator having a tubular stator core in which the rotor disposed, includes stator coils for producing a rotating magnetic field for rotating the rotor. A lower limit of the row-to-row skew angle ?e larger than 30 degrees (electrical angle). A ratio, of cogging torque occurring in the absence of skew to cogging torque occurring when the permanent magnets are skewed, at a row-to-row skew angle of 30 degrees is calculated based on the cogging torque ratio, the row-to-row skew angle ?e, and B-H curve properties of the stator core.

Abstract: A highly-reliable semiconductor device and a method of fabricating the semiconductor device, while stably carrying out IC test, are proposed. A pad portion after an IC test using a probe is covered with a second passivation film. It is therefore made possible to protect the pad, which has partially been thinned by the IC test, from a chemical solution of wet etching used, after the IC test, for removing a barrier metal. This consequently makes it possible to suppress intrusion of a chemical solution through the pad portion into an IC chip. In the semiconductor device, the pad portion provided for the IC test using the probe and the opening provided for formation of the metal bump electrode are separated. It is therefore made possible to suppress any influence of the probe mark produced by the IC test exerted on the geometry of the metal bump electrode.

Abstract: A permanent-magnet rotating machine includes a rotor having a rotor core carrying on a curved outer surface multiple permanent magnets arranged in two rows along an axial direction. The permanent magnets in one row are skewed from those in the other row in a circumferential direction by a row-to-row skew angle (electrical angle) ?e. A stator having a tubular stator core in which the rotor disposed includes stator coils for producing a rotating magnetic field for rotating the rotor. A lower limit of the row-to-row skew angle ?e larger than 30 degrees (electrical angle). A ratio of cogging torque occurring in the absence of skew to cogging torque occurring when the permanent magnets are skewed, at a row-to-row skew angle of 30 degrees is calculated based on the cogging torque ratio, the row-to-row skew angle ?e, and B-H curve properties of the stator core.

Abstract: A permanent magnet motor 1 includes a rotor in which permanent magnets 31 are fixed. In the rotor 20, the outer peripheral shape of rotor magnetic-pole portions 24 is formed so that, in the circumferentially central portion, the distance from the center of the rotor iron core 21 is longest, and, at the inter-polar space, the distance from the center of the rotor iron core is shortest, and so that the outermost surface of the rotor magnetic-pole portions 24 forms an arc, and given that sheath thickness tc formed by the outer-side surface of each permanent magnet 31 and the outermost surface of each rotor magnetic-pole portion 24 is practically constant, and letting the thickness of the permanent magnets be the magnet thickness tm, then the relation tc/tm?0.25 is satisfied.

Abstract: There is disclosed a process for preparing a negative type light-sensitive lithographic printing plate having an aluminum plate as a support and a light-sensitive layer, provided on the support, containing a polymer, an ethylenically unsaturated compound, a photopolymerization initiator and a sensitizer having an absorption at a wavelength region of from visible light to infrared rays, which comprises subjecting the aluminum support after anodization treatment to a treatment in a solution containing potassium silicate and having a molar ratio of SiO2/M2O where M represents an alkali metal being in the range of 0.3 to 3.5.

Abstract: In a combination of, for example, a rotor having eight magnetic poles and a stator having twelve slots and pulsating components of permeance, which generate a sinusoidal cogging torque having maxima of the same number as the number of poles of the rotor, pressurizing parts arranged in predetermined positions applying a force at an outer periphery of the stator directed inwardly to cancel the pulsating components of the cogging torque.

Abstract: An electromagnetism suppressing material has an increased electromagnetism suppressing effect, can be flexibly formed in various shapes, and is inexpensive. An electromagnetism suppressing device uses the electromagnetism suppressing material, and an electronic appliance uses the electromagnetism suppressing material or the electromagnetism suppressing device. The electromagnetism suppressing material is a liquid material and/or gel material with electrical polarity.

Abstract: In a liquid crystal panel 1 provided with first and second substrates 1 and 3 bonded by a sealant 3, alignment layers 13 and 23 for covering electrodes 6A and 7A, respectively, are formed up to the regions overlapping the regions for forming up to 3. Accordingly, since there is no space between the alignment 13 or 23 and the sealant 3, a low twist domain does not occur in a liquid crystal 40. Therefore, the vicinity of the inner periphery of the sealant can also be effectively used as the region for displaying images.

Abstract: A reliable semiconductor device including support bumps so as to adequately seal the region between the chips is to be provided. The semiconductor device includes a semiconductor chip; a bump formed on an upper face of the semiconductor chip; and a plurality of support bumps formed along a circumference of the region where the bump is provided, formed on the upper face of the semiconductor chip; and a flow path for a sealing resin is provided between the plurality of support bumps, so as to connect the region where the bump is provided and a periphery region of the semiconductor chip.

Abstract: The present invention provides a manufacturing method or a structure capable of reducing occurrence of sealing defects and breaking defects by resolving defects in form of a joined area between a sealing material and an anisotropic conductive material. A sealing material (2) is formed in such a manner as to superimpose ends (2b) on alignment marks (15) formed on the surface of a first substrate (6a), an anisotropic conductive material is formed in such a manner as to superimpose ends 3b on alignment marks (16) formed on the surface of a second substrate (6b), and the sealing material 2 and the anisotropic conductive material (3) are joined by bonding the first substrate (6a) and the second substrate (6b) to form one-piece sealing section (4).

Abstract: The present invention provides a manufacturing method or a structure capable of reducing occurrence of sealing defects and breaking defects by resolving defects in form of a joined area between a sealing material and an anisotropic conductive material. A sealing material (2) is formed in such a manner as to superimpose ends (2b) on alignment marks (15) formed on the surface of a first substrate (6a), an anisotropic conductive material is formed in such a manner as to superimpose ends 3b on alignment marks (16) formed on the surface of a second substrate (6b), and the sealing material 2 and the anisotropic conductive material (3) are joined by bonding the first substrate (6a) and the second substrate (6b) to form one-piece sealing section (4).

Abstract: An optical transmission-path fault-detection system for detecting a fault in an optical-transmission path connecting an optical communications apparatus and an optical amplifier corresponding to the communications apparatus is disclosed.

Abstract: A flip-chip type semiconductor device includes a semiconductor substrate. A plurality of electrode terminals are provided and arranged on a top surface of the semiconductor substrate, a sealing resin layer is formed on the top surface of the semiconductor substrate such that the electrode terminals are completely covered with the sealing resin layer.

Abstract: There is disclosed a process for preparing a light-sensitive lithographic printing plate using an aluminum plate as a support, which comprises subjecting the aluminum support after anodization treatment to a treatment in an alkali silicate with a concentration of SiO2 of 1 to 4% by weight, a concentration of an alkali metal hydroxide of 0.5 to 5% by weight and a molar ratio of SiO2/M2O where M represents an alkali metal being in the range of 0.3 to 1.5 at 50 to 70° C. for 20 seconds or shorter.

Abstract: A blow molding method includes steps of moving a split mold to a parison receiving position where a parison is supplied and receiving a parison, closing the split mold, performing blow molding at a blow molding position, and opening the split mold at a product discharge position and thereby discharging a product. The method further includes steps of: sequentially reciprocating each split mold in trains of split molds provided opposed to each other across the parison receiving position to and from a position opposed to the parison receiving position; and sequentially reciprocating the split mold disposed at the position where the split mold is opposed to the parsion receiving position to and from the parison receiving position for performing blow molding. There is also provided a blow molding apparatus for carrying out this blow molding method.

Abstract: A flip chip type semiconductor device is provided with a semiconductor chip with a plurality of pad electrodes on one surface. A solder electrode is connected to each pad electrode and a metallic post is connected to each solder electrode. The surface of the semiconductor chip on a side on which the pad electrodes are provided is coated with an insulating resin layer and whole the pad electrode and solder electrode and part of the metallic post are buried in the insulating resin layer. The remaining portion of the metallic post is projected from the insulating resin layer to form a protrusion. Then, an outer solder electrode is formed so as to cover this protrusion. The outer solder electrodes are arranged in a matrix on the insulating resin layer. The height of the protrusion is made 7 to 50% of the distance between an end of the outer solder electrode and the surface of the insulating resin layer.