Abstract: An information processing apparatus includes a display controller that displays a plurality of different display character strings on a display part displaying a video, a voice processor that recognizes voice inputted to a predetermined microphone, a selector that selects a display character string that is relatively close to an input character string indicated by the voice recognized by the voice processor from the plurality of display character strings, and a processing executer that executes processing that corresponds to the display character string selected by the selector and affects the video.

Abstract: An object of the invention is to provide a multilayer glass which can be manufactured by a simple process. To solve the above problem, the multilayer glass according to the invention includes a first glass substrate, a second glass substrate that faces the first glass substrate at an interval of a predetermined space, and a sealing part that seals a periphery of an internal space defined by the first glass substrate and the second glass substrate. The sealing part is formed with a sealing material containing low melting point glass. The internal space is in a vacuum state. The first glass substrate includes an exhaust port that is provided to be included in a projection part of the sealing part when being projected in a lamination direction of the first glass substrate and the second glass substrate. The exhaust port is blocked by the sealing material (see FIG. 3).

Abstract: Provided is a physical quantity measurement device in which a bonding temperature of a bonding layer is lowered to a temperature not affecting an operation of a semiconductor chip and an insulating property of the semiconductor chip and a base is secured. The physical quantity measurement device includes a base (diaphragm), a semiconductor chip (strain detection element) to measure a physical quantity on the basis of stress acting on the base, and a bonding layer to bond the semiconductor chip to the base. The bonding layer has a first bonding layer bonded to the semiconductor chip, a second bonding layer bonded to the base, and an insulating base material disposed between the first bonding layer and the second bonding layer. The first and second bonding layers and contain glass.

Abstract: An object of the invention is to provide a multilayer glass which can be manufactured by a simple process. To solve the above problem, the multilayer glass according to the invention includes a first glass substrate, a second glass substrate that faces the first glass substrate at an interval of a predetermined space, and a sealing part that seals a periphery of an internal space defined by the first glass substrate and the second glass substrate. The sealing part is formed with a sealing material containing low melting point glass. The internal space is in a vacuum state. The first glass substrate includes an exhaust port that is provided to be included in a projection part of the sealing part when being projected in a lamination direction of the first glass substrate and the second glass substrate. The exhaust port is blocked by the sealing material (see FIG. 3).

Abstract: It is an object to provide a highly reliable physical-quantity measurement device which can relax thermal stress at a time of bonding and suppress creep or drift of a sensor output. To attain the above-described object, a physical-quantity measurement device according to the present invention includes a semiconductor element, and a base board connected to the semiconductor element with a plurality of layers being interposed. In the plurality of layers, a stress relaxing layer including at least metal as a main ingredient and a glass layer including glass as a main ingredient are formed each in a layered form including one or more layers. At least one of the stress relaxing layer and the glass layer includes low-melting-point glass, and a softening point of the low-melting-point glass is equal to or lower than the highest heat temperature that the semiconductor element can resist.

Abstract: Provided is a physical quantity measurement device in which a bonding temperature of a bonding layer is lowered to a temperature not affecting an operation of a semiconductor chip and an insulating property of the semiconductor chip and a base is secured. The physical quantity measurement device includes a base (diaphragm), a semiconductor chip (strain detection element) to measure a physical quantity on the basis of stress acting on the base, and a bonding layer to bond the semiconductor chip to the base. The bonding layer has a first bonding layer bonded to the semiconductor chip, a second bonding layer bonded to the base, and an insulating base material disposed between the first bonding layer and the second bonding layer. The first and second bonding layers and contain glass.

Abstract: The purpose of the present invention is to provide a charged particle beam device that exhibits high performance due to the use of vanadium glass coatings, and to provide a method of manufacturing a component for a charged particle beam device. Specifically provided is a charged particle beam device using a vacuum component characterized by comprising a metal container, the interior space of which is evacuated to form a high vacuum, and coating layers formed on the surface on the interior space-side of the metal container, wherein the coating layers are vanadium-containing glass, which is to say an amorphous substance.

Abstract: The purpose of the present invention is to provide a charged particle beam device that exhibits high performance due to the use of vanadium glass coatings, and to provide a method of manufacturing a component for a charged particle beam device. Specifically provided is a charged particle beam device using a vacuum component characterized by comprising a metal container, the interior space of which is evacuated to form a high vacuum, and coating layers formed on the surface on the interior space-side of the metal container, wherein the coating layers are vanadium-containing glass, which is to say an amorphous substance.

Abstract: Provided is a structure including a first member (2); a second member (3) disposed opposite to the first member (2); and a glass layer (4) disposed between the first member (2) and the second member (3) so as to bond the first member (2) and the second member (3). A glass transition point of the glass layer (4) is lower than a temperature of the glass layer (4) under operation. In the glass layer (4), at least either of ceramic and metallic particles 4b, 4c is dispersed. In a temperature region lower than the glass transition point of the glass layer (4), a thermal expansion coefficient thereof falls in between thermal expansion coefficients of the first member (2) and the second member (3). This allows thermal strain caused within the structure (1) to be reduced when the structure (1) is operated at a higher temperature than a room temperature.

Abstract: Provided is a structure including a first member (2); a second member (3) disposed opposite to the first member (2); and a glass layer (4) disposed between the first member (2) and the second member (3) so as to bond the first member (2) and the second member (3). A glass transition point of the glass layer (4) is lower than a temperature of the glass layer (4) under operation. In the glass layer (4), at least either of ceramic and metallic particles 4b, 4c is dispersed. In a temperature region lower than the glass transition point of the glass layer (4), a thermal expansion coefficient thereof falls in between thermal expansion coefficients of the first member (2) and the second member (3). This allows thermal strain caused within the structure (1) to be reduced when the structure (1) is operated at a higher temperature than a room temperature.

Abstract: The connector attaching/detaching apparatus includes a plurality of fitting members that causes connectors to fit with or separate from one another by sliding, guiding members that sequentially causes the plurality of fitting members to slide by moving in an arrangement direction of the fitting means, and a moving apparatus that causes the guiding members to move in the arrangement direction of the fitting members.

Abstract: A hybrid vehicle includes a road condition acquisition portion (40, 41) that acquires information on an actual road condition; a storage portion (42) where road data is stored; a route setting portion (40) that sets a route to a destination, based on the road data stored in the storage portion (42); a travel pattern setting portion (30) that sets a travel pattern on the route set by the route setting portion (40), based on the road data stored in the storage portion (42); an operation schedule setting portion (30) that sets an operation schedule that is a schedule of operations of the engine and the motor, based on the travel pattern set by the travel pattern setting portion (30); and a control portion (30) that controls the operations of the engine and the motor based on the information on the actual road condition acquired by the road condition acquisition portion (40, 41) and the operation schedule set by the operation schedule setting portion (30).

Abstract: A site registering device that registers a site allowing charging where a vehicle battery can be charged, the device including: a position acquisition unit that acquires position information on a charging site where charging of the battery has been conducted; and a registering unit that specifies, on the basis of an actual charging result in the charging site, a category to which the charging site belongs among a plurality of categories, associates the charging site with the specified category and the position information, and registers the thus associated charging site as the site allowing charging.

Abstract: A road information acquisition device includes: a surface elevation acquisition unit that obtains a surface elevation; a road information acquisition unit that calculates first road information relating to a travel route to be traveled by a host vehicle on the basis of the surface elevation; and a structure determination unit that determines whether or not a structure exists on the travel route, wherein, when the structure determination unit determines that the structure exists on the travel route, the road information acquisition unit obtains second road information, which is different from the first road information, relating to a point at which the structure exists on the travel route.

Abstract: A glass bonding material contains vanadium and phosphor as main glass components, and comprises in amounts converted as oxides of the elements in the components, 45 to 60% by weight of V2O5, 15 to 30% by weight of P2O5, 5 to 25% by weight of BaO, or contains a glass comprising at least vanadium, phosphor, barium and antimony, wherein the glass comprises in amounts converted as oxides, 15 to 35% by weight of BaO and Sb2O3 in total, and a weight ratio of BaO/Sb2O3 or Sb2O3/BaO is 0.3 or less.

Abstract: A sealing glass of a low melting point phosphate glass composition contains 15 to 35% of BaO and Sb2O3 (in total) and the ratio by weight of BaO to Sb2O3 or Sb2O3 to BaO is 0.3 or less. Particularly the transition metal is vanadium and the glass contains V2O5 of 45 to 60 wt % as vanadium oxide and P2O5 of 15 to 30 wt % as phosphorus oxide. The bonding material is a mixture of a filler and a vanadate-phosphate glass that contains V2O5 of 45 to 60%, P2O5 of 20 to 30%, BaO of 5 to 15%, TeO2 of 0 to 10%, Sb2O3 of 5 to 10%, and WO3 of 0 to 5%. The particle size of the filler is in the range of 1 to 150 ?m and the ratio of filler is 80% by volume or less of the adhesive glass.

Abstract: A hybrid vehicle includes a road condition acquisition portion (40, 41) that acquires information on an actual road condition; a storage portion (42) where road data is stored; a route setting portion (40) that sets a route to a destination, based on the road data stored in the storage portion (42); a travel pattern setting portion (30) that sets a travel pattern on the route set by the route setting portion (40), based on the road data stored in the storage portion (42); an operation schedule setting portion (30) that sets an operation schedule that is a schedule of operations of the engine and the motor, based on the travel pattern set by the travel pattern setting portion (30); and a control portion (30) that controls the operations of the engine and the motor based on the information on the actual road condition acquired by the road condition acquisition portion (40, 41) and the operation schedule set by the operation schedule setting portion (30).

Abstract: The connector attaching/detaching apparatus includes a plurality of fitting members that causes connectors to fit with or separate from one another by sliding, guiding members that sequentially causes the plurality of fitting members to slide by moving in an arrangement direction of the fitting means, and a moving apparatus that causes the guiding members to move in the arrangement direction of the fitting members.

Abstract: A glass bonding material contains vanadium and phosphor as main glass components, and comprises in amounts converted as oxides of the elements in the components, 45 to 60% by weight of V2O5, 15 to 30% by weight of P2O5, 5 to 25% by weight of BaO, or contains a glass comprising at least vanadium, phosphor, barium and antimony, wherein the glass comprises in amounts converted as oxides, 15 to 35% by weight of BaO and Sb2O3 in total, and a weight ratio of BaO/Sb2O3 or Sb2O3/BaO is 0.3 or less.

Abstract: It is an object of the present invention to provide a spacer which has an adequate Young's modulus for a spacer used in an image display panel and allows free adjustment of an electric resistance value, and an image display panel using the spacer. The spacer SPC holds a gap between a back panel PNL1 including a signal line CL, a scanning line GL, and an electronic source ELS provided for the main surface of a back substrate SUB1, and a front panel PNL2 including a fluorescent material PH, a black matrix BM, and an anode AD provided for the main surface of a front substrate SUB2. The spacer comprises phosphate glass including the same transition metal element with different valences. For electrical conduction, the included same transition metal element with different valences allows the use of hopping conduction between transition metal atoms with different valences to perform adjustment of electric resistance relatively easily.