Abstract: Light from a light source is applied to a diffraction grating via a collimator lens. The light diffracted by the diffraction grating is applied to a polarization beam splitter. The light polarized by the polarization beam splitter at a given polarizing plane is transmitted and is applied to a recording surface of an optical disc via a ¼-wave plate and an objective lens. The light reflected from the recording surface of the optical disc is applied to the polarization beam splitter via the objective lens and the ¼-wave plate and is reflected by the polarization beam splitter toward a focusing lens. The light incident to the focusing lens is thereby condensed and is applied to a holographic element which diffracts the light and disposes the focal points of the ±1 diffraction orders to be offset from each other along the optical axis of the zeroth diffraction order with the focal point of the zeroth diffraction order being between the focal points of the ±1 diffraction orders.

Abstract: A method for predicting life span of a rotary machine used in a manufacturing apparatus, includes: measuring rotary machine acceleration evaluation time series data with a sampling interval being less than a half the cycle of an analysis target frequency, a number of samplings being at least four times the analysis target frequency; generating evaluation diagnosis data based on variations in characteristics corresponding to the analysis target frequency by subjecting the evaluation time series data to frequency analysis; and determining the life span of the rotary machine using the evaluation diagnosis data.

Abstract: Light from a light source is applied to a diffraction grating via a collimator lens. The light diffracted by the diffraction grating is applied to a polarization beam splitter. The light polarized by the polarization beam splitter at a given polarizing plane is transmitted and is applied to a recording surface of an optical disc via a ¼-wave plate and an objective lens. The light reflected from the recording surface of the optical disc is applied to the polarization beam splitter via the objective lens and the ¼-wave plate and is reflected by the polarization beam splitter toward a focusing lens. The light incident to the focusing lens is thereby condensed and is applied to a holographic element which diffracts the light and disposes the focal points of the ±1 diffraction orders to be offset from each other along the optical axis of the zeroth diffraction order with the focal point of the zeroth diffraction order being between the focal points of the ±1 diffraction orders.

Abstract: An object of the invention is to provide a non-chlorine polypropylene wrap film excellent in adhesion, transparency, heat resistance, flexibility, gas barrier properties, touch and cutting properties, and disclosed is a polypropylene wrap film, a multilayer film having a tensile modulus of 200 to 1,000 MPa, containing at least a surface layer and an inner layer having a gas barrier resin, and being stretched into a twice or more length in a machine direction and/or a transverse direction, wherein in its multilayer constitution, the surface layer is constituted by a composition comprising, for example, a mixture of a polypropylene resin, a softening agent, an adhering agent and a liquid adhering assistant at a suitable mixing ratio, and the inner layer is constituted, for example, by an ethylene-vinyl alcohol copolymer resin.

Abstract: A cleaning method for a semiconductor device manufacturing apparatus includes a process of forming a film on a subject piece in a processing chamber, applying light having a predetermined wavelength to a monitoring section to indirectly monitor a thickness of a film formed on the subject piece, introducing cleaning gas capable of removing a substance deposited on the monitoring section into the processing chamber, measuring a reflection light which is the application light reflected near the monitoring section, measuring an amount of a substance corresponding to a thickness of a film deposited on the monitoring section based on a measurement result of the reflection light; and introducing, into the processing chamber, a cleaning gas which can remove the substance on the monitoring section until a measurement value of the amount of the substance on the monitoring section becomes zero.

Abstract: An apparatus for predicting life expectancy of a rotary machine includes: a load recipe input module acquiring loading conditions of a rotary machine; a characterizing feature input module obtaining characterizing feature data of a rotary machine; and a life expectancy prediction module calculating life expectancy of the rotary machine in conformity with the loading conditions and the characterizing feature datap.

Abstract: A semiconductor device having a trench capacitor is disclosed. The trench is formed on the surface of a semiconductor substrate. A first insulating film is formed on the side wall of the trench and a semiconductor film is buried in the trench. The first insulating film and the semiconductor film located in the upper part of the trench are etched and a second insulating film is deposited on the exposed side wall. The semiconductor film and the first insulating film are etched and a plate electrode is formed on the exposed side wall. A capacitor insulating film is formed on the plate electrode and a storage electrode is buried within the trench. The structure provides a semiconductor device having fewer memory cell defects.

Abstract: An encoding system capable of preventing the overflow of a buffer and performing the encoding of a VOP within a predetermined time period even where the processing time period necessary for encoding each macroblock is not constant. In order to provide the encoding system, the maximum number of bits Tmax is set for each VOP, and the output of encoding unit and the output of fixed code output unit is switched and outputted so that the number of bits Sc of the VOP may not exceed the Tmax.

Abstract: There is a jump in the number of devices formed on a single wafer, and it takes a lot of time to inspect a single wafer. In addition, if wafers are inspected every lot, detected wafers remain in staying in a prober until the inspection of all of the wafers is completed. Therefore, the time required to transfer the wafers of each lot to the subsequent step is delayed. As a result, it is difficult to shorten TAT (Turn-Around-Time), and it is difficult to flexibly operate the prober.

Abstract: The imaging device according to the present invention adjusts the luminance in the first image such that the addition value of the value, which is obtained by multiplying the feature quantity of the luminance in the central portion of the first image by the first coefficient, and the feature quantity of the luminance in the peripheral portion of the first image becomes the first target value, and also adjusts the luminance in the second image such that the addition value of the value, which is obtained by multiplying the feature quantity of the luminance in the central portion of the second image by the second coefficient that is set independently of the first coefficient, and the feature quantity of the luminance in the peripheral portion of the second image becomes the second target value.

Abstract: A method for cleaning a manufacturing apparatus, includes introducing a cleaning gas including fluorine so as to flow from upstream toward an outlet port in a reaction chamber; and flowing a protective gas which reacts with the fluorine from a vicinity of the outlet port of the reaction chamber as an introduction position.

Abstract: As the video signals of macroblocks are coded, they are stored in a buffer. When the total code length of the stored macroblocks exceeds a predetermined value, all but the most recently coded macroblock are output from the buffer as a video packet, and the most recently coded macroblock is coded again. To minimize this occurrence, when each coded macroblock is stored, the code length of the next macroblock is predicted and added to the total length, and if the resulting sum exceeds the predetermined value, all of the coded macroblocks stored in the buffer are output as a video packet.

Abstract: An encoding system capable of preventing the overflow of a buffer and performing the encoding of a VOP within a predetermined time period even where the processing time period necessary for encoding each macroblock is not constant. In order to provide the encoding system, the maximum number of bits Tmax is set for each VOP, and the output of encoding unit and the output of fixed code output unit is switched and outputted so that the number of bits Sc of the VOP may not exceed the Tmax.

Abstract: A system for determining dry cleaning timing, includes: a manufacturing apparatus configured to process materials assigned by a sequence of lots; an apparatus controller configured to control the manufacturing apparatus and obtaining operational conditions of the manufacturing apparatus as apparatus information; a lot information input terminal configured to obtain process conditions of one of the lots as lot information; an apparatus information storage unit configured to store the apparatus information from the apparatus controller as an apparatus information database; a lot information storage unit configured to store the lot information from the lot information input terminal as a lot information database; and a cleaning determination unit configured to determine timing to perform a dry cleaning of the manufacturing apparatus based on the apparatus information database and the lot information database.

Abstract: A method for diagnosing life of manufacturing equipment having a rotary machine, includes: measuring reference time series data for characteristics before deterioration of the manufacturing equipment occurs; finding a reference auto covariance function based on the reference time series data; extracting a reference variation caused by variations of the process condition and power supply from the reference auto covariance function, and calculating a cycle of the reference variation; measuring diagnostic time series data for the characteristics in a sequence to be measured of the manufacturing equipment; finding a diagnostic auto covariance function based on the diagnostic time series data; and determining the life of the manufacturing equipment from the diagnostic auto covariance function using a component with a cycle shorter than a cycle of the reference variation.

Abstract: A semiconductor device comprises a semiconductor substrate; a trench formed in the semiconductor substrate or in a layer deposited on the semiconductor substrate; a first conductive layer deposited in the trench and having a recess in the top surface thereof; a buried layer which buries the recess of the first conductive layer and which is made of a material having a melting point lower than that of the first conductive layer; and a second conductive layer formed on the buried layer inside the trench and electrically connected to the first conductive layer.

Abstract: A manufacturing apparatus which includes a rotary machine, includes: a plurality of accelerometers configured to measure diagnosis time series data attached to the rotary machine at locations where variations of the rotary machine are different; a frequency analysis device configured to perform a frequency analysis on the diagnosis time series data measured by the plurality of accelerometers; a time series data recording module configured to generate diagnosis data based on variations in characteristics of vibration corresponding to an analysis target frequency and to record the diagnosis data; and a life prediction unit configured to analyze the diagnosis data to determine a life span of the rotary machine.

Abstract: A method for predicting life of a rotary machine used in a manufacturing apparatus, includes: determining a starting time of an abnormal condition just before a failure of a monitor rotary machine used in a monitor manufacturing process, from monitor time-series data for characteristics of the monitor rotary machine, statistically analyzing the monitor time-series data, and finding a value for the characteristics at the starting time of the abnormal condition as a threshold of the abnormal condition; measuring diagnosis time-series data for the characteristic of a motor current of a diagnosis rotary machine during a manufacturing process; preparing diagnosis data from the diagnosis time-series data; and determining a time for the diagnosis data exceeding the threshold as the life of the diagnosis rotary machine.

Abstract: A system for predicting life of a rotary machine, includes a vibration gauge configured to measure time series data of a peak acceleration of the rotary machine; a band pass filter configured to filter an analog signal of the time series data of the peak acceleration measured by the vibration gauge in a frequency band including a first analysis frequency expressed as a product of an equation including a number of rotor blades of the rotary machine and a normal frequency unique to the rotary machine; and a data processing unit configured to predict a life span of the rotary machine by characteristics of the filtered analog data of the time series data of the peak acceleration with the first analysis frequency.

Abstract: In an automated guided vehicle including a transfer equipment which transfers a wafer, a buffer cassette which temporarily stores the wafer, and a pressing member which is provided at an opening of the buffer cassette, when traveling the automated guided vehicle, if the pressing member is slid to a center position from an end position of the opening of the buffer cassette to contact and press against the edge of the wafer, the pressing member was easily damaged by being rubbed against a periphery of the wafer, and there was a problem in durability of the pressing member.