Abstract: A traveling body is equipped with a traveling portion provided on a lower side of a main body portion. The traveling portion has middle wheels that are spaced apart from a rising axis extending in a width direction by a fixed distance, front links that space front wheels and the rising axis apart from each other respectively by a fixed distance, rear links that space rear wheels and the rising axis apart from each other respectively by a fixed distance, and a fixed frame that rises/falls as the rising axis rises/falls and that supports the main body portion. The front links and the rear links are coupled in such a manner as to be able to rock with respect to each other respectively around the rising axis. A controller lifts the main body portion and the middle wheels by rocking the front links and the rear links each other.

Abstract: A robot system includes: a first robot; a second robot; and circuitry configured to: control the first and second robots to execute a collaborative operation on a work piece; and control, in response to a detection of an irregular state of the first robot during the collaborative operation, the first and second robots to execute a collaborative counteractive operation to eliminate the irregular state.

Abstract: Provided is a cured body that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The cured body according to the present invention is a cured body of a resin composition that includes an epoxy compound, a curing agent, an inorganic filler, and a polyimide, in which the content of the inorganic filler is 30% by weight or more and 90% by weight or less in 100% by weight of the cured body, the cured body has a sea-island structure having a sea part and an island part, the island part has an average long diameter of 5 ?m or less, and the island part contains the polyimide.

Abstract: A semiconductor device includes: an insulating substrate having an upper surface on which a semiconductor element is mounted; a base plate joined to a lower surface of the insulating substrate; a case member that surrounds the insulating substrate and that is in contact with a surface of the base plate to which the insulating substrate is joined; a sealing resin provided in a region surrounded by the base plate and the case member; a cover member facing a surface of the sealing resin and fixed to the case member; and a holding plate, a lower surface of the holding plate and a portion of a side surface of the holding plate being in close contact with the surface of the sealing resin, an upper surface of the holding plate being fixed to and protruding from a surface of the cover member facing the surface of the sealing resin.

Abstract: A salt represented by formula (I): wherein Q1 and Q2 independently represent a fluorine atom or a C1 to C6 perfluoroalkyl group, R1 and R2 in each occurrence independently represent a hydrogen atom, a fluorine atom or a C1 to C6 perfluoroalkyl group, z represents an integer of 0 to 6, X1 represents *—CO—O—, *—O—CO— or —O—, * represents a binding position to C(R1)(R2) or C(Q1)(Q2), A1 represents a C4 to C24 hydrocarbon group having a C4 to C18 divalent alicyclic hydrocarbon moiety, A2 represents a C2 to C12 divalent hydrocarbon group, R3 and R4 independently represent a hydrogen atom or a C1 to C6 monovalent saturated hydrocarbon group, R5 represents a hydrogen atom, a fluorine atom, or a C1 to C6 alkyl group where a hydrogen atom may be replaced by a fluorine atom, and Z+ represents an organic cation.

Abstract: Provided is a cured body that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The cured body according to the present invention is a cured body of a resin composition that includes an epoxy compound, a curing agent, an inorganic filler, and a polyimide, in which the content of the inorganic filler is 30% by weight or more and 90% by weight or less in 100% by weight of the cured body, the cured body has a sea-island structure having a sea part and an island part, the island part has an average long diameter of 5 ?m or less, and the island part contains the polyimide.

Abstract: A semiconductor device includes: an insulating substrate having an upper surface on which a semiconductor element is mounted; a base plate joined to a lower surface of the insulating substrate; a case member that surrounds the insulating substrate and that is in contact with a surface of the base plate to which the insulating substrate is joined; a sealing resin provided in a region surrounded by the base plate and the case member; a cover member facing a surface of the sealing resin and fixed to the case member; and a holding plate, a lower surface of the holding plate and a portion of a side surface of the holding plate being in close contact with the surface of the sealing resin, an upper surface of the holding plate being fixed to and protruding from a surface of the cover member facing the surface of the sealing resin.

Abstract: The power module includes: an insulating substrate having an upper surface on which a semiconductor element is mounted; a base plate joined to a lower surface of the insulating substrate; a case member surrounding the insulating substrate and adhered to the base plate; a sealing resin provided in a region surrounded by the base plate and the case member, so as to seal the insulating substrate; and a holding plate projecting from an inner wall of the case member to above an outer peripheral portion of the insulating substrate, the holding plate being fixed to the inner wall, the holding plate being in contact with the sealing resin.

Abstract: A power semiconductor device including an insulating substrate having a metal layer formed on an upper surface thereof, a semiconductor element and a main electrode bonded to the metal layer, a metal wire connecting the metal layer with the semiconductor element, a metal member bonded to a lower surface side of the insulating substrate, a case member surrounding the insulating substrate and being in contact with a surface of the metal member bonded to the insulating substrate, and a sealing resin which fills a region surrounded by the metal member and the case member and has a resin strength of 0.12 MPa or higher at room temperature, a microcrystallization temperature of ?55° C. or lower, and a needle penetration of 30 to 50 after storage at 175° C. for 1000 hours and seals the insulating substrate, the metal layer, the semiconductor element, the metal wire, and the main electrode.

Abstract: A robot system includes a robot including leading end, base, and multi-articular arm, and circuitry that controls the atm to move the end based on motion control program specifying transition over time of target position and posture of the end, the transition including correction target portion starting and ending in the transition; controls the arm to move the end in response to guided manipulation applying external force to the robot while the circuitry controls the arm; obtains relative command information based on the target position and posture at start of the correction portion and specifying the target position and posture at points in the correction portion including start and end in the correction portion; and controls the arm to move the end from the position and posture based on the information, beginning at time when movement of the arm controlled by the circuitry in response to the manipulation has ended.

Abstract: A power semiconductor device including an insulating substrate having a metal layer formed on an upper surface thereof, a semiconductor element and a main electrode bonded to the metal layer, a metal wire connecting the metal layer with the semiconductor element, a metal member bonded to a lower surface side of the insulating substrate, a case member surrounding the insulating substrate and being in contact with a surface of the metal member bonded to the insulating substrate, and a sealing resin which fills a region surrounded by the metal member and the case member and has a resin strength of 0.12 MPa or higher at room temperature, a microcrystallization temperature of ?55° C. or lower, and a needle penetration of 30 to 50 after storage at 175° C. for 1000 hours and seals the insulating substrate, the metal layer, the semiconductor element, the metal wire, and the main electrode.

Abstract: A robot controller (2) configured to control a robot (1) including a plurality of joints (J1-J6) each rotatable around a rotation axis, the robot controller (2) including: an acquisition unit (21) configured to acquire a rotation angle of each of the plurality of joints (J1-J6); a determination unit (22) configured to determine whether or not the robot (1) has been in proximity to a singular configuration, based on the rotation angle of each of the plurality of joints (J1-J6); and a control unit (23) configured to control the plurality of joints (J1-J6) to be rotated not to rotate simultaneously, when the determination unit (22) determines that the robot (1) has been in proximity to the singular configuration.

Abstract: A resist composition contains: a resin having a structural unit represented by formula (I), an alkali-soluble resin, an acid generator, and a solvent: wherein Ri51 represents a hydrogen atom or a methyl group, Ri52 and Ri53 each independently represent a hydrogen atom or a C1 to C12 hydrocarbon group, Ri54 represents a C5 to C20 alicyclic hydrocarbon group, Ri55 represents a C1 to C6 alkyl group or a C1 to C6 alkoxy group, and “p” represents an integer of 0 to 4.

Abstract: A robot system includes a robot, a sensor, and a processor. The sensor is configured to detect an external force acting on the robot. The processor is configured to move the robot in a forward direction such that a representative point of the robot moves along a motion track in the forward direction; move the robot in a reverse direction such that the representative point moves along the motion track in the reverse direction opposite to the forward direction when the external force satisfies a first condition which includes a condition that the external force is larger than a first threshold force; and move the robot to reduce the external force when the external force satisfies a second condition which includes a condition that the external force is larger than a second threshold force even after the robot has been moved in the reverse direction.

Abstract: [Problem] To provide a polypeptide which enables stimulation of numerous T cells of different derivation, and to induce strong immunological response against numerous types of cancers. [Solution] Provided is a fused polypeptide that includes a helper epitope derived from the WT1 protein, and a killer epitope derived from the WT1 protein, wherein the polypeptide includes a total of 3 to 6 of the helper epitopes and the killer epitopes per molecule of the fused polypeptide.

Abstract: A manipulation unit includes a body, a tool holder, and a manipulated portion. The body has a first end, a second end opposite to the first end, and a peripheral surface connecting the first end and the second end. The first end is attachable to a robot arm. The tool holder is connected to the second end and configured to hold a tool. The manipulated portion is provided on the peripheral surface. The manipulated portion includes a manipulation surface and a surrounding portion. The robot arm is to be operated via the manipulation surface. The surrounding portion surrounds the manipulation surface such that the manipulation surface is recessed from the surrounding portion.

Abstract: The object aims to provide: a novel tumor antigen; a novel therapeutic agent useful in a method for treating a malignant neoplasm by utilizing the tumor antigen; and a tumor antigen which can be used as the therapeutic agent. Thus, disclosed are: a novel tumor antigen which has an epitope capable of inducing a Th1 cell which is a CD4-positive T cell specific to Survivin; and use of the tumor antigen. Specifically disclosed is a polypeptide which comprises an amino acid sequence depicted in SEQ ID NO:17 or the like and has an activity to cause the production of a cytokine by a Th cell that is a cell specific to Survivin. The peptide can induce a Th cell that is specific to Survivin and can cause the production of a cytokine by the Sur/Th cell when the peptide is incubated together with an antigen-presenting cell and a CD4-positive T cell.

Abstract: The power module includes: an insulating substrate having an upper surface on which a semiconductor element is mounted; a base plate joined to a lower surface of the insulating substrate; a case member surrounding the insulating substrate and adhered to the base plate; a sealing resin provided in a region surrounded by the base plate and the case member, so as to seal the insulating substrate; and a holding plate projecting from an inner wall of the case member to above an outer peripheral portion of the insulating substrate, the holding plate being fixed to the inner wall, the holding plate being in contact with the sealing resin.

Abstract: A resist composition contains: a resin having an acid-labile group, a resin having a structural unit represented by formula (I), an acid generator, and a solvent; wherein Ri41 represents a hydrogen atom or a methyl group, Ri42 represents a C1 to C10 hydrocarbon group that may be substituted with a hydroxy group, a C2 to C7 acyl group or a hydrogen atom, Ri43 in each occurrence independently represents a C1 to C6 alkyl group or a C1 to C6 alkoxy group, “p” represents an integer of 0 to 4, Z represents a divalent C3 to C20 hydrocarbon group having a group represented by formula (Ia), and a methylene group contained in the hydrocarbon group may be replaced by an oxygen atom, a sulfur atom or a carbonyl group, *—[(CH2)w—O]r— (Ia): wherein “w” and “r” each independently represents an integer of 1 to 10, and * represent a bonding position.

Abstract: A resist composition includes (A1) a resin which includes a structural unit represented by formula (a4), a structural unit having a cyclic carbonate and a structural unit represented by formula (I), the resin has no acid-labile group; (A2) a resin which has an acid-labile group; and an acid generator: wherein R3 represents a hydrogen atom or a methyl group, R4 represents a C1 to C24 saturated hydrocarbon group having a fluorine atom, and a methylene group contained in the saturated hydrocarbon group may be replaced by an oxygen atom or a carbonyl group, R1 represents a hydrogen atom or a methyl group, and L1 represents a single bond or a C1 to C18 divalent saturated hydrocarbon group where a methylene group may be replaced by an oxygen atom or a carbonyl group, and R2 represents a C3 to C18 alicyclic hydrocarbon group where a hydrogen atom may be replaced by a C1 to C8 aliphatic hydrocarbon group or a hydroxy group, provided that the carbon atom directly bonded to L1 has no aliphatic hydrocarbon group by