Patents by Inventor Takashi SAIO
Takashi SAIO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9228120Abstract: Disclosed is a liquid chemical for forming a water-repellent protecting film at least on a surface of a recessed portion of an uneven pattern at the time of cleaning a wafer having a finely uneven pattern at its surface and containing silicon at least a part of the uneven pattern. This liquid chemical contains a silicon compound A represented by the general formula: R1aSi(H)bX4-a-b and an acid A, the acid A being at least one selected from the group consisting of trimethylsilyl trifluoroactate, trimethylsilyl trifluoromethanesulfonate, dimethylsilyl trifluoroactate, dimethylsilyl trifluoromethanesulfonate, butyldimethylsilyl trifluoroactate, butyldimethylsilyl trifluoromethanesulfonate, hexyldimethylsilyl trifluoroacetate, hexyldimethylsilyl trifluoromethanesulfonate, octyldimethylsilyl trifluoroactate, octyldimethylsilyl trifluoromethanesulfonate, decyldimethylsilyl trifluoroacetate and decyldimethylsilyl trifluoromethanesulfonate.Type: GrantFiled: October 5, 2011Date of Patent: January 5, 2016Assignee: Central Glass Company, LimitedInventors: Soichi Kumon, Takashi Saio, Shinobu Arata, Masanori Saito, Atsushi Ryokawa, Shuhei Yamada, Hidehisa Nanai, Yoshinori Akamatsu
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Publication number: 20150270123Abstract: A liquid chemical for forming a water-repellent protective film, containing: a water-repellent protective film forming agent for forming a water-repellent protective film on a wafer having at its surface an uneven pattern and containing at least one kind of element selected from titanium, tungsten, aluminum, copper, tin, tantalum and ruthenium at surfaces of recessed portions of the uneven pattern, the protective film being formed at least on the surfaces of the recessed portions by retaining the liquid chemical at least on the recessed portions of the wafer before a rinsing treatment step of rinsing the wafer surface with a rinsing liquid consisting only of a protic polar solvent or a rinsing liquid containing a protic polar solvent as the principal component; and a solvent. The water-repellent protective film forming agent is at least one kind of compound represented by the following general formulas [1] to [3].Type: ApplicationFiled: September 12, 2013Publication date: September 24, 2015Applicant: CENTRAL GLASS COMPANY, LIMITEDInventors: Shinobu Arata, Soichi Kumon, Masanori Saito, Takashi Saio
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Patent number: 9090782Abstract: The present invention relates to a method for cleaning wafers while preventing pattern collapse of the wafers in semiconductor device fabrication, the wafer having at its surface an uneven pattern and containing silicon element at least on surfaces of recessed portions. Provided is: a liquid chemical for forming a protective film which allows efficient cleaning; and a method for cleaning wafers, using the liquid chemical. A liquid chemical for forming a water repellent protective film is provided for forming a protective film on a wafer (having at its surface an uneven pattern and containing silicon element at least at a part of the uneven pattern), the protective film being formed at least on surfaces of recessed portions of the uneven pattern at the time of cleaning the wafer. The liquid chemical contains a dialkylsilyl compound represented by the formula [1] and does not contain an acid and a base.Type: GrantFiled: June 15, 2011Date of Patent: July 28, 2015Assignee: Central Glass Company, LimitedInventors: Takashi Saio, Soichi Kumon, Masanori Saito, Shinobu Arata, Hidehisa Nanai
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Publication number: 20150179433Abstract: A surface treatment was conducted by using a liquid chemical containing a water-repellent protective film forming agent represented by the following general formula [1], subsequent to a step of cleaning a metal-based wafer and prior to a step of drying the wafer. (R1 represents a C1-C18 monovalent hydrocarbon group the hydrogen elements of which may partially or entirely be replaced with a fluorine element(s). R2 mutually independently represents a monovalent organic group having a C1-C18 hydrocarbon group the hydrogen elements of which may partially or entirely be replaced with a fluorine element(s). “a” is an integer of from 0 to 2.Type: ApplicationFiled: July 4, 2013Publication date: June 25, 2015Applicant: Central Glass Company, LimitedInventors: Takashi Saio, Soichi Kumon, Masanori Saito, Shinobu Arata
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Patent number: 9053924Abstract: A cleaning agent for a silicon wafer (a first cleaning agent) contains at least a water-based cleaning liquid and a water-repellent cleaning liquid for providing at least a recessed portion of an uneven pattern with water repellency during a cleaning process. The water-based cleaning liquid is a liquid in which a water-repellent compound having a reactive moiety chemically bondable to Si element in the silicon wafer and a hydrophobic group, and an organic solvent including at least an alcoholic solvent are mixed and contained. With this cleaning agent, the cleaning process which tends to induce a pattern collapse can be improved.Type: GrantFiled: October 5, 2010Date of Patent: June 9, 2015Assignee: Central Glass Company, LimitedInventors: Soichi Kumon, Takashi Saio, Shinobu Arata, Hidehisa Nanai, Yoshinori Akamatsu, Shigeo Hamaguchi, Kazuhiko Maeda
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Publication number: 20150101643Abstract: A silicon wafer cleaning agent includes at least a water-based cleaning liquid, and a water-repellent cleaning liquid for providing water-repellent to an uneven pattern at least at recessed portions during a cleaning process. The water-repellent cleaning liquid is a liquid composed of a water-repellent compound containing a reactive moiety which is chemically bondable to Si in the silicon wafer, and a hydrophobic group, or is a liquid wherein 0.1 mass % or more of the water-repellent compound relative to the total quantity of 100 mass % of the water-repellent cleaning liquid and an organic solvent are mixed and contained therein. A cleaning process wherein a pattern collapse is easily induced can be improved by using the cleaning agent.Type: ApplicationFiled: December 18, 2014Publication date: April 16, 2015Inventors: Soichi KUMON, Masanori SAITO, Takashi SAIO, Hidehisa NANAI, Yoshinori AKAMATSU
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Patent number: 8957005Abstract: A silicon wafer cleaning agent includes at least a water-based cleaning liquid, and a water-repellent cleaning liquid for providing water-repellent to an uneven pattern at least at recessed portions during a cleaning process. The water-repellent cleaning liquid is a liquid composed of a water-repellent compound containing a reactive moiety which is chemically bondable to Si in the silicon wafer, and a hydrophobic group, or is a liquid wherein 0.1 mass % or more of the water-repellent compound relative to the total quantity of 100 mass % of the water-repellent cleaning liquid and an organic solvent are mixed and contained therein. A cleaning process wherein a pattern collapse is easily induced can be improved by using the cleaning agent.Type: GrantFiled: September 15, 2010Date of Patent: February 17, 2015Assignee: Central Glass Company, LimitedInventors: Soichi Kumon, Masanori Saito, Takashi Saio, Hidehisa Nanai, Yoshinori Akamatsu
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Patent number: 8932390Abstract: Disclosed is a liquid chemical for forming a water-repellent protecting film. The liquid chemical contains an agent for forming a water-repellent protecting film, and a solvent. The agent is for provided to form a water-repellent protecting film on a wafer after a cleaning step for the wafer and before a drying step for the wafer, the wafer having at its surface an uneven pattern and containing at least one kind element of titanium, tungsten, aluminum, copper, tin, tantalum and ruthenium at surfaces of recessed portions of the uneven pattern, the water-repellent protecting film being formed at least on the surfaces of the recessed portions. The liquid chemical is characterized in that the agent for forming a water-repellent protecting film is a compound represented by the following general formula [1].Type: GrantFiled: January 11, 2012Date of Patent: January 13, 2015Assignee: Central Glass Company, LimitedInventors: Takashi Saio, Soichi Kumon, Masanori Saito, Shinobu Arata, Hidehisa Nanai, Yoshinori Akamatsu
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Publication number: 20140373870Abstract: Disclosed is a liquid chemical for forming a water-repellent protecting film. The liquid chemical contains an agent for forming a water-repellent protecting film, and a solvent. The agent is for provided to form a water-repellent protecting film on a wafer after a cleaning step for the wafer and before a drying step for the wafer, the wafer having at its surface an uneven pattern and containing at least one kind element of titanium, tungsten, aluminum, copper, tin, tantalum and ruthenium at surfaces of recessed portions of the uneven pattern, the water-repellent protecting film being formed at least on the surfaces of the recessed portions. The liquid chemical is characterized in that the agent for forming a water-repellent protecting film is a compound represented by the following general formula [1].Type: ApplicationFiled: September 5, 2014Publication date: December 25, 2014Inventors: Takashi SAIO, Soichi KUMON, Masanori SAITO, Shinobu ARATA, Hidehisa NANAI, Yoshinori AKAMATSU
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Publication number: 20140339321Abstract: The present invention provides a pressure feed container capable of ensuring the cleanliness of a liquid such as a protective film-forming liquid chemical or a protective film-forming liquid chemical kit for preparing the liquid chemical even after long-term storage, and also capable of suppressing electrostatic charge in the liquid. The present invention provides a pressure feed container configured to store a protective film-forming liquid chemical or a protective film-forming liquid chemical kit that is mixed into the protective film-forming liquid chemical, and to transfer a liquid upon application of pressure to the inside of the container, the protective film-forming liquid chemical being for forming a water-repellent protective film on at least surfaces of recessed portions of an uneven pattern formed on a surface of a wafer containing a silicon element at least at a part of the uneven pattern.Type: ApplicationFiled: May 19, 2014Publication date: November 20, 2014Applicant: CENTRAL GLASS COMPANY, LIMITEDInventors: Atsushi RYOKAWA, Shuhei YAMADA, Masahiro FUJITANI, Yosuke HASHIMOTO, Chiaki IDETA, Soichi KUMON, Masanori SAITO, Takashi SAIO
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Publication number: 20140311379Abstract: A method for preparing a liquid chemical for forming a water-repellant protective film, the liquid chemical having a solvent and an agent for forming a water-repellant protective film, the liquid chemical being for forming a water-repellent protective film at least on surfaces of recessed portions of an uneven pattern of a wafer having the uneven pattern at its surface, the method including: a first refinement step for eliminating the elements (metal impurities) Na, Mg, K, Ca, Mn, Fe, Cu, Li, Al, Cr, Ni, Zn and Ag in a solvent by distilling the solvent or by a particle-eliminating membrane and an ion exchange resin membrane; a mixing step for mixing the solvent after the first refinement step and an agent for forming a water-repellant protective film; and a second refinement step for eliminating particles in a liquid chemical after the mixing step by a particle-eliminating membrane.Type: ApplicationFiled: November 19, 2012Publication date: October 23, 2014Inventors: Atsushi Ryokawa, Shuhei Yamada, Masahiro Fujitani, Soichi Kumon, Masanori Saito, Takashi Saio, Shinobu Arata, Yosuke Hashimoto
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Patent number: 8828144Abstract: A process for cleaning a wafer having an uneven pattern at its surface. The process includes at least the steps of: cleaning the wafer with a cleaning liquid; substituting the cleaning liquid retained in recessed portions of the wafer with a water-repellent liquid chemical after cleaning; and drying the wafer, wherein the cleaning liquid contains 80 mass % or greater of a solvent having a boiling point of 55 to 200° C., and wherein the water-repellent liquid chemical supplied in the substitution step has a temperature of not lower than 40° C. and lower than a boiling point of the water-repellent liquid chemical thereby imparting water repellency at least to surfaces of the recessed portions.Type: GrantFiled: January 13, 2012Date of Patent: September 9, 2014Assignee: Central Grass Company, LimitedInventors: Soichi Kumon, Takashi Saio, Shinobu Arata, Masanori Saito, Hidehisa Nanai, Yoshinori Akamatsu
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Publication number: 20140174465Abstract: A cleaning agent for a silicon wafer (a first cleaning agent) contains at least a water-based cleaning liquid and a water-repellent cleaning liquid for providing at least a recessed portion of an uneven pattern with water repellency during a cleaning process. The water-based cleaning liquid is a liquid in which a water-repellent compound having a reactive moiety chemically bondable to Si element in the silicon wafer and a hydrophobic group, and an organic solvent including at least an alcoholic solvent are mixed and contained. With this cleaning agent, the cleaning process which tends to induce a pattern collapse can be improved.Type: ApplicationFiled: December 20, 2013Publication date: June 26, 2014Applicant: Central Glass Company, LimitedInventors: Soichi KUMON, Takashi SAIO, Shinobu ARATA, Hidehisa NANAI, Yoshinori AKAMATSU, Shigeo HAMAGUCHI, Kazuhiko MAEDA
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Publication number: 20130255534Abstract: Disclosed herein is a method for preparing a liquid chemical for forming a water-repellent protective film, the liquid chemical being for forming the water-repellent protective film at the time of cleaning a wafer having at its surface an uneven pattern and containing silicon element at least at a part of the uneven pattern at least on surfaces of recessed portions of the uneven pattern, the liquid chemical containing a nonaqueous organic solvent, a silylation agent, and an acid or a base. The method includes (i) adjusting a water content of the nonaqueous organic solvent to 200 mass ppm or less by dehydration; and (ii) mixing the nonaqueous organic solvent, the silylation agent, and the acid or the base after the adjusting step.Type: ApplicationFiled: November 29, 2012Publication date: October 3, 2013Inventors: Atsushi RYOKAWA, Shuhei Yamada, Masahiro Fujitani, Soichi Kumon, Masanori Saito, Takashi Saio, Shinobu Arata
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Publication number: 20130104931Abstract: Disclosed is a liquid chemical for forming a water repellent protective film at least on surfaces of recessed portions of a metal-based wafer, the liquid chemical for forming a water repellent protective film being characterized by comprising a surfactant which has an HLB value of 0.001-10 according to Griffin's method and includes a hydrophobic moiety having a C6-C18 hydrocarbon group and water, and characterized in that the concentration of the surfactant in the liquid chemical is not smaller than 0.00001 mass % and not larger than the saturated concentration relative to 100 mass % of the total amount of the liquid chemical. This liquid chemical can improve a cleaning step which tends to induce a metal-based wafer to cause a pattern collapse.Type: ApplicationFiled: June 15, 2011Publication date: May 2, 2013Applicant: Central Glass Company, LimitedInventors: Shinobu Arata, Masanori Saito, Takashi Saio, Soichi Kumon, Hidehisa Nanai
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Publication number: 20130092191Abstract: The present invention relates to a method for cleaning wafers while preventing pattern collapse of the wafers in semiconductor device fabrication, the wafer having at its surface an uneven pattern and containing silicon element at least on surfaces of recessed portions. Provided is: a liquid chemical for forming a protective film which allows efficient cleaning; and a method for cleaning wafers, using the liquid chemical. A liquid chemical for forming a water repellent protective film is provided for forming a protective film on a wafer (having at its surface an uneven pattern and containing silicon element at least at a part of the uneven pattern), the protective film being formed at least on surfaces of recessed portions of the uneven pattern at the time of cleaning the wafer. The liquid chemical contains a dialkylsilyl compound represented by the formula [1] and does not contain an acid and a base.Type: ApplicationFiled: June 15, 2011Publication date: April 18, 2013Applicant: Central Glass Company, LimitedInventors: Takashi Saio, Soichi Kumon, Masanori Saito, Shinobu Arata, Hidehisa Nanai
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Publication number: 20130056023Abstract: Disclosed is a liquid chemical for forming a water repellent protective film on a wafer that has at its surface a finely uneven pattern and contains silicon element at least at a part of the uneven pattern, the water repellent protective film being formed at least on surfaces of recessed portions of the uneven pattern at the time of cleaning the wafer. The liquid chemical contains: a silicon compound (A) represented by the general formula R1aSi(H)b(X)4?a?b and an acid; or a silicon compound (C) represented by the general formula R7gSi(H)h(CH3)w(Z)4?g?h?w and a base that contains no more than 35 mass % of water. The total amount of water in the liquid chemical is no greater than 1000 mass ppm relative to the total amount of the liquid chemical. The liquid chemical can improve a cleaning step that easily induces pattern collapse.Type: ApplicationFiled: May 11, 2011Publication date: March 7, 2013Applicant: Central Glass Company, LimitedInventors: Soichi Kumon, Takashi Saio, Shinobu Arata, Masanori Saito, Atsushi Ryokawa, Shuhei Yamada, Hidehisa Nanai, Yoshinori Akamatsu
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Publication number: 20120272999Abstract: A liquid chemical for forming a water repellent protecting film on a wafer having at its surface an uneven pattern and containing at least one kind of element selected from the group consisting of titanium, tungsten, aluminum, copper, tin, tantalum and ruthenium at surfaces of recessed portions of the uneven pattern, the water repellent protecting film being formed at least on the surfaces of the recessed portions. The liquid chemical is characterized by including: a water repellent protecting film forming agent; and water, and characterized in that the water repellent protecting film forming agent is at least one selected from compounds represented by the following general formula [1] and salt compounds thereof and that the concentration of the water relative to the total quantity of a solvent contained in the liquid chemical is not smaller than 50 mass %.Type: ApplicationFiled: April 27, 2012Publication date: November 1, 2012Applicant: Central Glass Company, LimitedInventors: Soichi KUMON, Takashi SAIO, Masanori SAITO, Shinobu ARATA
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Publication number: 20120211025Abstract: A process for cleaning a wafer having an uneven pattern at its surface. The process includes at least the steps of: cleaning the wafer with a cleaning liquid; substituting the cleaning liquid retained in recessed portions of the wafer with a water-repellent liquid chemical after cleaning; and drying the wafer, wherein the cleaning liquid contains 80 mass % or greater of a solvent having a boiling point of 55 to 200° C., and wherein the water-repellent liquid chemical supplied in the substitution step has a temperature of not lower than 40° C. and lower than a boiling point of the water-repellent liquid chemical thereby imparting water repellency at least to surfaces of the recessed portions.Type: ApplicationFiled: January 13, 2012Publication date: August 23, 2012Applicant: Central Glass Company, LimitedInventors: Soichi KUMON, Takashi SAIO, Shinobu ARATA, Masanori SAITO, Hidehisa NANAI, Yoshinori AKAMATSU
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Publication number: 20120174945Abstract: Disclosed is a liquid chemical for forming a water-repellent protecting film. The liquid chemical contains an agent for forming a water-repellent protecting film, and a solvent. The agent is for provided to form a water-repellent protecting film on a wafer after a cleaning step for the wafer and before a drying step for the wafer, the wafer having at its surface an uneven pattern and containing at least one kind element of titanium, tungsten, aluminum, copper, tin, tantalum and ruthenium at surfaces of recessed portions of the uneven pattern, the water-repellent protecting film being formed at least on the surfaces of the recessed portions. The liquid chemical is characterized in that the agent for forming a water-repellent protecting film is a compound represented by the following general formula [1].Type: ApplicationFiled: January 11, 2012Publication date: July 12, 2012Applicant: Central Glass Company, LimitedInventors: Takashi Saio, Soichi Kumon, Masanori Saito, Shinobu Arata, Hidehisa Nanai, Yoshinori Akamatsu