Abstract: A semiconductor light-receiving element, includes: a semiconductor substrate; a high-concentration layer of a first conductivity type formed on the semiconductor substrate; a low-concentration layer of the first conductivity type formed on the high-concentration layer of the first conductivity type and in contact with the high-concentration layer of the first conductivity type; a low-concentration layer of a second conductivity type configured to form a PN junction interface together with the low-concentration layer of the first conductivity type; and a high-concentration layer of the second conductivity type formed on the low-concentration layer of the second conductivity type and in contact with the low-concentration layer of the second conductivity type. The low-concentration layers have a carrier concentration of less than 1×1016/cm3. The high-concentration layers have a carrier concentration of 1×1017/cm3 or more.

Abstract: An endoscope is provided in which an attachment/detachment operation of the proximal end of a wire is easily performed to/from an erecting operation mechanism and leakage of current to the outside can be prevented. An endoscope has an operation section 22 provided with an erecting lever, and a movable member 96 that moves in association with an operation of the erecting lever. The movable member 96 is arranged to be exposed to the outside of the operation section 22. A wire 60 is, at a distal end side thereof, coupled to an erecting base, and, at a proximal end side thereof, coupled to an attachment member 98 that is attachable to or detachable from the movable member 96 by a one-touch operation. The wire 60 includes a wire body 60A, and an insulating coat 60B coating a wire exposure region L.

Abstract: Variation in electrostatic capacitances of control signal lines in a pixel is reduced.

Abstract: A solid-state imaging element according to an aspect of the present disclosure includes a first semiconductor substrate (11), an insulating layer (46) and a second semiconductor substrate (21), a floating diffusion layer (FD) of the first semiconductor substrate (11), a transfer gate (TG) of the first semiconductor substrate (11), a first through wire (71) electrically connected to the floating diffusion layer (FD) and penetrating the insulating layer (46) and the second semiconductor substrate (21), a second through wire (72) electrically connected to the transfer gate (TG) and penetrating the insulating layer (46) and the second semiconductor substrate (21), a wiring layer (56) stacked on the second semiconductor substrate (21) and having a wiring electrically connected to the first through wire (71) or the second through wire (72), and an adjustment layer that is provided on the second semiconductor substrate (21) so as to be in contact with both or one of the first through wire (71) and the second through

Abstract: A defect inspection apparatus (100) includes an imager (image sensor 35) configured to image an inspection target 7, and a display (6) configured to display an image based on an image captured by the imager. The defect inspection apparatus (100) also includes a controller (4) configured or programmed to receive a setting of a marking (64) in a predetermined region of interest (S) on the image (still image 61) displayed on the display (6). The controller (4) is configured or programmed to inspect the inspection target (7) for a defect based on the image captured by the imager, and superimpose an image of the marking (64) on a position corresponding to the predetermined region of interest (S) in an image of an inspection result (overlay image 65) displayed on the display (6).

Abstract: A die for extrusion molding includes an extrusion port configured to extrude a plastic composition, and a plastic flow channel configured to cause the supplied plastic composition to flow to the extrusion port. The plastic flow channel includes a supply flow channel, and an extrusion flow channel. The supply flow channel is configured to be supplied with the plastic composition. The extrusion flow channel has an upstream end coupled to the supply flow channel, and downstream end having the extrusion port. In the extrusion flow channel, a flow channel cross-sectional area perpendicular to the flow direction of the plastic composition in the extrusion flow channel gradually changes to the extrusion port, and an inner wall surface of a flow channel has a protruding surface protruding toward an inside of the flow channel in a cross section including an extrusion central axis and parallel to the extrusion central axis.

Abstract: Disclosed is a service providing system capable of providing an information processing function effective for a variety of system constructions as a service. The service providing system of the present embodiment realizes an information retrieval function, a knowledge base construction function, and a knowledge presentation function. The information retrieval function retrieves information on an analysis target and information indicating a condition of the analysis target; the knowledge base construction function constructs a knowledge database for acquiring knowledge corresponding to the condition of the analysis target based on the information retrieved by the information retrieval function. The knowledge presentation function presents knowledge corresponding to the condition of the analysis target from the knowledge database.

Abstract: Disclosed is a service providing system capable of providing an information processing function effective for a variety of system constructions as a service. The service providing system of the present embodiment realizes an information retrieval function, a knowledge base construction function, and a knowledge presentation function. The information retrieval function retrieves information on an analysis target and information indicating a condition of the analysis target; the knowledge base construction function constructs a knowledge database for acquiring knowledge corresponding to the condition of the analysis target based on the information retrieved by the information retrieval function. The knowledge presentation function presents knowledge corresponding to the condition of the analysis target from the knowledge database.

Abstract: A substrate processing apparatus includes a substrate holder configured to horizontally hold and rotate a substrate which has a recess and a base metal layer exposed from a bottom surface of the recess; and a pre-cleaning liquid supply configured to supply a pre-cleaning liquid such as dicarboxylic acid or tricarboxylic acid onto the substrate being held and rotated by the substrate holder, to thereby pre-clean the base metal layer. A temperature of the pre-cleaning liquid on the substrate is equal to or higher than 40° C.

Abstract: A resin foam production apparatus is provided including: a metal mold including a foaming part and a discharge part; and an extruder configured to feed a resin foamable composition into the metal mold to cause the resin foamable composition to pass through the discharge part. The resin foamable composition comprises at least one type of resin. A ratio of resin pressure Cp2 at the foaming part of the metal mold relative to resin pressure Cp1 generated by the extruder is 0.3 or more.

Abstract: A flow path forming device including a first flow path forming member and a second flow path forming member that form a tubular flow path through which a plastic composition is allowed to pass to mold the plastic composition. At least one of a flow path forming surface of the first flow path forming member and a flow path forming surface of the second flow path forming member has a surface roughness parameter Rk of 1.0 ?m or more.

Abstract: A flow path forming device including a first flow path forming member and a second flow path forming member that form a tubular flow path through which a plastic composition is allowed to pass to mold the plastic composition. At least one of a flow path forming surface of the first flow path forming member and a flow path forming surface of the second flow path forming member has a surface roughness parameter RPc of 60 or less.

Abstract: A method using a surveying device 200 and a survey target device 300 includes: performing benchmark measurement including measuring an altitude of a benchmark that serves as a reference height of a batter board; performing stake top measurement including measuring an altitude of a stake top of a batter board stake installed; and performing beam top position display including calculating a difference in height from the stake top of the batter board stake to a beam top based on the reference height of a foundation stored in advance, the altitude of the benchmark, the altitude of the stake top of the batter board stake, and displaying the difference on a terminal device 100.

Abstract: A surveying method using a surveying system including a surveying device and a terminal. The surveying method includes: receiving, by the terminal, a result of selecting a survey target foundation point from among a plurality of consecutive foundation points; obtaining an intersection between a reference line and a boundary side set in advance, the reference line connecting the survey target foundation point and an adjacent foundation point adjacent to the survey target foundation point; and outputting, in association with the survey target foundation point, a relative positional relationship between the intersection and a survey target device surveyed by the surveying device for the survey target foundation point.

Abstract: A digestion accelerator which is safe and has a high digestion acceleration effect is provided. The digestion accelerator according to the present invention contains tannin or a polyphenol compound that is a hydrolysate of the tannin, a salt of the polyphenol compound, or ester of the polyphenol compound.

Abstract: A tilt analysis method analyzing a tilt of a columnar object is disclosed. The tilt analysis method includes: acquiring a reference value on the basis of a first position of a reflector of a measurement target device attached to a column foot portion of the columnar object; acquiring, in response to an execution instruction, a column top value on the basis of a second position of the reflector of the measurement target device attached to a column top of the columnar object, the execution instruction being received by an input section and inputted via a column top value acquisition instruction section displayed on a display section of a terminal device; generating tilt information indicating in which direction the columnar object tilts based on the reference value and the column top value; and causing the display section to display the tilt information including graphic display.

Abstract: A crack measuring apparatus includes distance-measuring units, an image pickup unit having pixels the positions of which are identified on an imaging device, an infrared image pickup unit having pixels the positions of which are identified on an imaging device and having sensitivity to infrared rays, driving units, angle-measuring units, and an arithmetic control unit, the arithmetic control unit searches for a cracked portion from a temperature difference in an infrared image by turning the infrared image pickup unit, captures an image of the cracked portion by the image pickup unit and identifies a position of the cracked portion from a density difference in the captured image, measures the position of the cracked portion by the distance-measuring units and the angle-measuring units, and acquires three-dimensional absolute coordinates of the cracked portion.

Abstract: A solid-state imaging device according to an embodiment includes: a semiconductor substrate including a photoelectric conversion element; a lens disposed above a first light incident surface of the photoelectric conversion element; and a plurality of columnar structures disposed on a surface parallel to the first light incident surface that is located between a second light incident surface of the lens and the first light incident surface of the photoelectric conversion element. The columnar structure includes at least one of silicon, germanium, gallium phosphide, aluminum oxide, cerium oxide, hafnium oxide, indium oxide, tin oxide, niobium pentoxide, magnesium oxide, tantalum pentoxide, titanium pentoxide, titanium oxide, tungsten oxide, yttrium oxide, zinc oxide, zirconia, cerium fluoride, gadolinium fluoride, lanthanum fluoride, and neodymium fluoride.

Abstract: A system for coating ceramic fibers for use in manufacturing a ceramic matric composite (CMC) article includes a frame having a plurality of frame members arranged so as to create a void therebetween. At least one of frame members includes a hollow body and at least one perforated hole defined in the hollow body. Thus, the ceramic fibers are securable at respective ends of the frame and extend across the void. The frame also includes an inlet in fluid communication with the perforated hole(s) so as to allow a coating material to flow into and through the hollow body and out of the perforated hole(s) at a location of at least a portion of one of the ceramic fibers. As such, the coating material is configured to cause the portion of one of the ceramic fibers to separate from the frame such that the portion is uniformly coated with the coating material.

Abstract: A plating apparatus, a plating method and a recording medium can allow a temperature of a wafer to be uniform within a surface thereof. A plating apparatus 1 includes a substrate holding unit 52 configured to hold a substrate W; a plating liquid supply unit 53 configured to supply a plating liquid M1 to the substrate W; and a solvent supply unit 55a configured to supply a solvent N1 having a different temperature from a temperature of the plating liquid M1 to the substrate W. The solvent N1 is supplied to a preset position on the substrate W from the solvent supply unit 55a after the plating liquid M1 is supplied to the substrate W from the plating liquid supply unit 53.