Abstract: An input apparatus according to the present embodiment includes a detector, a vibration element, and an element controller. The detector detects a touch on an operation surface. The vibration element vibrates the operation surface. The element controller reduces or stops a vibration of the vibration element based on a continuation time of the touch that is detected by the detector in a state where the operation surface is being vibrated.

Abstract: A plating method includes forming a catalyst layer 118 on a surface of a substrate including an inner surface of a recess 112; drying the substrate having the catalyst layer formed thereon such that an inside of the recess is dried as well; removing the catalyst layer at least on the surface of the substrate at the outside of the recess by supplying a processing liquid, which is configured to dissolve a material of the surface of the substrate, onto the surface of the substrate while rotating the dried substrate and while preventing or suppressing the processing liquid from being introduced into the dried inside of the recess; and forming a plating layer 119 on the inside of the recess, at which the catalyst layer is not removed, by an electroless plating process.

Abstract: According to one embodiment, a limited section controller includes a traffic information update unit, a determination unit, a standby position setting unit, and a traveling restart setting unit. The traffic information update unit updates delay information of the traveling vehicle near the junction. The determination unit determines whether to permit the traveling vehicle to pass based on whether there is the traveling vehicle in the limited section. The standby position setting unit sets a standby position of each of the traveling vehicles of a limited number or less present in a standby section. The traveling restart setting unit determines an approach direction into the limited section.

Abstract: An input device according to an embodiment includes a vibration element, an acquisition unit, and an element controller. The vibration element causes an operation surface to vibrate. The acquisition unit acquires information on at least one of a traveling state and a traveling environment of the moving body. The element controller causes the vibration element to vibrate at a vibration strength according to at least the one of the traveling state and the traveling environment.

Abstract: Catalytic metal nanoparticles can be attached on a base. A pre-treatment method for plating includes a catalytic particle-containing film forming process of forming a catalytic particle-containing film on a surface of a substrate by supplying, onto the substrate, a catalytic particle solution which is prepared by dispersing the catalytic metal nanoparticles and a dispersing agent in a solvent containing water; a first heating process of removing moisture contained at least in the catalytic particle-containing film by heating the substrate to a first temperature; and a second heating process of polymerizing the dispersing agent to have a sheet shape by heating the substrate to a second temperature higher than the first temperature after the first heating process and fixing the catalytic metal nanoparticles on a base layer by covering the catalytic metal nanoparticles with the sheet-shaped dispersing agent.

Abstract: A metal wiring layer can be formed within a recess of a substrate while suppressing the metal wiring layer from being formed at the outside of the recess. A metal wiring layer forming method includes forming a catalyst layer 5 formed of Pd on a tungsten layer W on a bottom surface 3a of the recess 3 of the substrate 2 without forming the catalyst layer 5 on a surface 3b of an insulating layer of the recess 3; and forming a Ni-based metal wiring layer 7 on the catalyst layer 5 of the recess 3.

Abstract: A substrate processing apparatus can remove, from a substrate having a copper wiring formed by a dry etching process using an organic etching gas, e.g., one or more kinds of organic etching gases selected from a methane gas, a CF-based gas, a carboxylic acid-based gas containing a methyl group and an alcohol-based gas, an organic polymer which is originated from the organic etching gas and generated in the dry etching process and adheres to a surface of the substrate. In a substrate processing apparatus 1, a first processing unit 4 includes a first cleaning liquid supply unit 43a configured to supply a first cleaning liquid L1 selected from a chemical liquid containing hydrogen peroxide and a chemical liquid containing a polar organic solvent, and the first cleaning liquid L1 is supplied onto a substrate W1 from the first cleaning liquid supply unit 43a.

Abstract: A plating apparatus 20 includes a substrate holding device 110 configured to hold and rotate the substrate 2; a first discharge device 30 configured to discharge a plating liquid toward the substrate 2 held on the substrate holding device 110; and a top plate 21 that is provided above the substrate 2 and has an opening 22. The first discharge device 30 includes a first discharge unit 33 configured to discharge the plating liquid toward the substrate 2, and the first discharge unit 33 is configured to be moved between a discharge position where the plating liquid is discharged and a standby position where the plating liquid is not discharged. Further, the first discharge unit 33 is configured to be overlapped with the opening 22 of the top plate 21 at the discharge position.

Abstract: A power generating device is provided, which includes a matrix converter device, a power transmission path for transmitting electric power between the matrix converter device and an electric power system, and at least one inductor for phase adjustment, bridged between the power transmission path and a neutral point.

Abstract: Reliability of a plating process and reliability of a component manufactured through the plating process can be improved by suppressing peeling between plating layers formed by electroless plating. In a plating method, a plated component manufactured by the plating method, and a plating system 1 configured to manufacture the plated component by the plating method, a second electroless plating layer 39, which is made of a copper alloy and formed by the electroless plating, is formed on a surface of a first electroless plating layer 38 formed by the electroless plating. The first electroless plating layer 38 is a barrier layer configured to suppress diffusion of copper and is made of cobalt or a cobalt alloy. The second electroless plating layer 39 is a seed layer for forming an electrolytic plating layer of copper on a surface thereof and is made of an alloy of copper and nickel.

Abstract: A pre-treatment method for plating can form a plating layer having sufficient adhesivity on an inner surface of a recess and on a surface of a substrate at an outside of the recess even when the recess has a high aspect ratio. The pre-treatment method for plating includes a preparation process of preparing the substrate having the recess; a first coupling layer forming process of forming a first coupling layer 21a at least on the inner surface of the recess of the substrate by using a first coupling agent; and a second coupling layer forming process of forming a second coupling layer 21b at least on the surface of the substrate at the outside of the recess by using a second coupling agent after the first coupling layer forming process.

Abstract: A plating apparatus of performing a plating process by supplying a plating liquid onto a substrate includes a substrate holding/rotating device configured to hold and rotate the substrate; a discharging device configured to discharge the plating liquid toward the substrate; a plating liquid supplying device configured to supply the plating liquid to the discharging device; and a controller configured to control the discharging device and the plating liquid supplying device. Further, the discharging device includes a first nozzle having a discharge opening, and a second nozzle having a discharge opening configured to be positioned closer to a central portion of the substrate than the discharge opening of the first nozzle. Furthermore, the plating liquid supplying device is configured to set a temperature of the plating liquid supplied to the first nozzle to be higher than a temperature of the plating liquid supplied to the second nozzle.

Abstract: An electroless plating process is performed on an Al layer, which is made of aluminum or an aluminum alloy, with an electroless plating liquid which is alkaline and contains a complexing agent. A plating method includes preparing a substrate 10 having a surface (for example, bottom surface of TSV 12) at which an Al layer 22 made of aluminum or an aluminum alloy is exposed; forming a zincate film 30 on a surface of the Al layer by performing a zincate treatment on the substrate; and forming a first electroless plating layer (for example, Co barrier layer 14a) on the surface of the Al layer with an electroless plating liquid (for example, Co-based plating liquid) which is alkaline and contains a complexing agent.

Abstract: The purpose of the present invention is to provide an injector for an intraocular lens, whereby it is possible to easily set a lens support part to an appropriate position on a lens holder, and to safely carry out insertion work. A lens holder (404) is provided with a base part (441), a release-side guide part (442), and a passing part (443). A concave part (450) for housing the tip of a first lens support part (92) is formed on the release-side guide part (442). The concave part (450) holds the first lens support part (92) above the passing part (443). The release-side guide part (442) guides the first lens support part (92) along the circumference of an optical part (91).

Abstract: A plating apparatus 20 includes a substrate holding device 110 configured to hold a substrate W; a discharging device 21 configured to discharge a plating liquid 35 toward the substrate W held by the substrate holding device 110; and a plating liquid supplying device 30 connected to the discharging device 21 and configured to supply the plating liquid 35 to the discharging device 21. A gas supplying device 170 is configured to heat a heating gas G having a higher specific heat capacity than air and supply the heated heating gas G toward the substrate W held by the substrate holding device 110. Further, a controller 160 is configured to control at least the discharging device 21, the plating liquid supplying device 30, and the gas supplying device 170.

Abstract: A plating method includes forming a catalyst layer 118 on a surface of a substrate including an inner surface of a recess 112; drying the substrate having the catalyst layer formed thereon such that an inside of the recess is dried as well; removing the catalyst layer at least on the surface of the substrate at the outside of the recess by supplying a processing liquid, which is configured to dissolve a material of the surface of the substrate, onto the surface of the substrate while rotating the dried substrate and while preventing or suppressing the processing liquid from being introduced into the dried inside of the recess; and forming a plating layer 119 on the inside of the recess, at which the catalyst layer is not removed, by an electroless plating process.

Abstract: A carburized steel part having excellent low cycle bending fatigue strength which is comprised of a steel material which contains, by mass %, C: 0.1 to 0.6%, Si: 0.01 to 1.5%, Mn: 0.3 to 2.0, P: 0.02% or less, S: 0.001 to 0.15%, N: 0.001 to 0.03%, Al: 0.001 to 0.06%, and O: 0.005% or less and has a balance of substantially iron and unavoidable impurities and which is carburized and quenched, and then tempered, which steel part has a surface hardness of HV550 to HV800 and a core hardness of HV400 to HV500.

Abstract: An adhesion layer formed of a thin film can be formed on a surface of a substrate. An adhesion layer forming method of forming the adhesion layer on the substrate includes supplying a coupling agent onto the substrate 2 while rotating the substrate 2. The substrate 2 is rotated at a low speed equal to or less than 300 rpm and the coupling agent diluted with IPA is supplied onto the substrate 2.

Abstract: The present invention increases tire formation precision and is a tire manufacturing method, which comprises a step S1 for forming a green tire on the outer surface of a rigid inner mold and a vulcanization step S2 for vulcanizing the green tire. The rigid inner mold comprises: an inner mold body, which is obtained from multiple segments; a core, which substantially binds the various segments; and an outer diameter adjusting means for changing the outer diameter of the core by changing the temperature of the core. Moreover. the rigid inner mold performs changes such that by expansion of the outer diameter of the core 5, the various segments move outward in the radial direction of the tire and gaps between the segments are enlarged, while by reducing the outer diameter of the core, the various segments move inward in the radial direction of the tire and the level differences R on the outer surface between adjacent segments increase.

Abstract: An LED unit includes: a plurality of LED modules each having an LED chip for generating ultraviolet ray provided in a package which has an opening formed on one surface and a lens formed to cover the opening of the package; a substrate-shaped base block where the LED modules are mounted in a first direction; and a heat radiation member where a plurality of the base blocks is provided in a second direction perpendicular to the first direction. The heat radiation member has a plurality of inclined surfaces where each of the base blocks is disposed. Further, one inclined surface and the other inclined surface of the heat radiation member are inclined to face each other in the second direction.