Patents by Inventor Takashi Tominaga

Takashi Tominaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5145726
    Abstract: A sheet for formation of a burned pattern, which comprises a laminated layer structure comprising a glass powder-containing layer comprising glass powder and a resin binder, an adhesive layer and a combustible substrate layer, the combustible substrate layer being provided on the surface and/or in the interior of the glass powder-containing layer in the laminate layer structure, or the combustible substrate layer being provided on the glass powder-containing layer having a pattern when the glass powder-containing layer is provided with a pattern comprising heat-resistant ink. A burning label is also disclosed, the burning label comprising a sheet for formation of a burned pattern, the sheet being provided with a pattern comprising heat-resistant ink, or a pattern made of pores or irregularities or obtained by punching the sheet.
    Type: Grant
    Filed: April 2, 1991
    Date of Patent: September 8, 1992
    Assignee: Nitto Denko Corporation
    Inventors: Takafumi Sakuramoto, Takashi Tominaga, Itsuroh Takenoshita, Megumi Ashida
  • Patent number: 5089071
    Abstract: An adhesive film comprising a ceramic powder and an adhesive composition having pressure-sensitive properties at room temperature (20.degree. C.), and a process for producing a multilayered ceramic structure, such as multilayered ceramic substrates, laminated ceramic capacitors, etc. using the adhesive film, are disclosed.
    Type: Grant
    Filed: May 1, 1990
    Date of Patent: February 18, 1992
    Assignee: Nitto Electrical Industrial
    Inventors: Takashi Tominaga, Takahumi Sakuramoto, Souji Nishiyama, Kiyohiro Kamei, Yoshiki Kobayashi, Gosei Uemura
  • Patent number: 5008151
    Abstract: A glass powder adhesive sheet used for a surface coating of inorganic structures comprising ceramics, metals, glasses, etc., a glazed ceramic substrate such as a substrate of electronic circuit, etc. or a heat-resistant label, etc., which comprises a glass powder molding comprising as main components, a glass powder and a resin binder, and an adhesive layer having a thermal decomposition initiation temperature higher than that of the resin binder, provided on the surface of the glass powder molding.
    Type: Grant
    Filed: August 12, 1988
    Date of Patent: April 16, 1991
    Assignee: Nitto Denko Corporation
    Inventors: Takashi Tominaga, Souji Nishiyama, Takahumi Sakuramoto, Makoto Honda
  • Patent number: 4830819
    Abstract: A composition for fixing a metal powder molding at sintering, which is used, in the case of disposing a metal powder molding formed by rolling a mixture of a metal powder and a synthetic resin-based binder on a metal base material and sintering the metal powder molding in a non-oxidizing atmosphere, to adhere and fix the metal powder molding onto the base material until the metal powder molding is sintered interposing between the metal powder molding and the base material, comprising a polyimide liquid composition containing a polyimide precursor and an organic solvent as the essential components.
    Type: Grant
    Filed: August 4, 1986
    Date of Patent: May 16, 1989
    Assignee: Nitto Denko Corporation
    Inventors: Takahumi Sakuramoto, Makoto Kojima, Eishi Asoshina, Takashi Tominaga
  • Patent number: 4797251
    Abstract: A composition for fixing metal powder molding at sintering, which is used, in the case of disposing a metal powder molding formed by rolling a mixture of a metal powder and a synthetic resin-based binder on a metal base material and sintering the metal powder molding in a non-oxidizing atmosphere, to adhere and fix the metal powder molding onto the base material until the metal powder molding is sintered by interposing between the metal powder molding and the base material, comprising a thermosetting resin composition containing a mixture of a thermosetting resin and at least one member selected from the group consisting of a metal fine powder, a thermoplastic resin and an adhesive material, wherein the amount of the residual carbon of the composition after completion of sintering is at least about 0.5% by weight.
    Type: Grant
    Filed: December 5, 1986
    Date of Patent: January 10, 1989
    Assignee: Nitto Electric Industrial Co., Ltd.
    Inventors: Takahumi Sakuramoto, Eishi Asoshina, Takashi Tominaga, Ichiro Ijichi, Kiyohiro Kamei, Toshiharu Konishi
  • Patent number: 4608225
    Abstract: A composition for fixing a metal powder molding at sintering, which is used, in the case of disposing a metal powder molding formed by rolling a mixture of a metal powder and a synthetic resin-based binder on a metal base material and sintering the metal powder molding in a non-oxidizing atmosphere, by interposing between the metal powder molding and the base material, comprising a thermosetting resin composition containing a thermosetting resin as the essential component, the amount of the residual carbon of which after the completion of sintering is at least about 0.5% by weight.
    Type: Grant
    Filed: April 26, 1985
    Date of Patent: August 26, 1986
    Assignees: Nitto Electric Industrial Co. Ltd., Mazda Motor Corporation
    Inventors: Takahumi Sakuramoto, Eishi Asoshina, Takashi Tominaga, Yukio Shimizu, Tsuyoshi Morishita, Sigemi Osaki, Noriyuki Sakai
  • Patent number: 4444818
    Abstract: A thermosetting adhesive sheet is described, comprising a thermosetting resin sheet-shaped prepreg with a reinforcing material embedded therein, and a flattened tubular material provided on one side of the prepeg, said flattened tubular material being capable of nearly recovering the original tubular form on heating and being narrower in width than the prepreg. The prepreg may be of the two-layer structure comprising a first thermosetting resin composition layer and a second thermosetting resin composition layer.
    Type: Grant
    Filed: January 31, 1983
    Date of Patent: April 24, 1984
    Assignee: Nitto Electric Industrial Co., Ltd.
    Inventors: Takashi Tominaga, Toshihiko Ariyoshi, Eishi Asoshina
  • Patent number: 4378395
    Abstract: A material for reinforcing a panel or plate includes a first resin layer having a high tensile modulus of elasticity after hardening; a second resin layer having a low tensile modulus of elasticity after hardening; an expandable member disposed between the second resin layer side and the panel to be reinforced. The expandable member is narrower than the reinforcing resin sheet. The first and second resin layers are combined in an unhardened or semi-hardened state to form a reinforcing resin sheet. The expandable member expands into a bead-like projection when heated and then hardens. The edges of the reinforcing resin sheet extend beyond the edges of the bead-forming member or expandable member is such a manner that the second resin layer of the reinforcing resin sheet can be attached to the panel or plate.
    Type: Grant
    Filed: March 9, 1982
    Date of Patent: March 29, 1983
    Assignees: Nissan Motor Company, Limited, Nitto Electric Industrial Company, Limited
    Inventors: Eishi Asoshina, Takashi Tominaga, Tadahiro Muguruma, Masato Shimizu, Yukio Nagata, Toshikatu Miura, Yukio Okada
  • Patent number: 4374890
    Abstract: An adhesive-sheet for the reinforcement of metal plate, and a method of reinforcing metal plates using an adhesive-sheet, are described. The adhesive-sheet comprises a first epoxy resin composition layer and a second epoxy resin composition layer laminated thereon wherein the first epoxy resin composition layer, when cured by heating, has a modulus of elasticity in tension sufficient to increase the stiffness of the metal plate, whereas the second epoxy resin composition layer, when cured by heating, has a modulus of elasticity in tension insufficient to increase the stiffness of the metal plate.
    Type: Grant
    Filed: November 25, 1981
    Date of Patent: February 22, 1983
    Assignee: Nitto Electric Industrial Co., Ltd.
    Inventors: Masato Shimizu, Eishi Asoshina, Takashi Tominaga, Tadahiro Muguruma