Abstract: A resonator element includes a base part and a vibrating arm. The vibrating arm includes an arm part and a wide part whose width is larger than that of the arm part. In the arm part, a first groove is formed on the first surface side, and a second groove is formed on the second surface side. 30 ?m?Wa?75 ?m, in which a width of the arm part is Wa, a thickness T between the first surface and the second surface of the arm part satisfies 110 ?m?T?150 ?m. 0.884?(t1+t2)/T?0.990, in which a depth of the first groove is t1, and a depth of the second groove is t2. 0.0056?Wb/T?0.0326, in which a width of the first surface arranged across the first groove and a width of the second surface arranged across the second groove are Wb. A length L1 of the vibrating arm satisfies L1?1000 ?m.

Abstract: The present application relates to a system and a method of monitoring vibrations occurring in a rotary machine. A monitoring device of the vibration monitoring system includes: a display configured to display sensor installation information for a vibration sensor; and a processor configured to process the sensor installation information. The sensor installation information includes: a type image data that represents a type of the rotary machine in a form of image; a model image data that represents a model of the rotary machine, associated with the type of rotary machine, in a form of image; an installation position data that represents a recommended installation position of the vibration sensor, associated with the model of rotary machine, in a form of image; and an installation direction data that represents an appropriate installation orientation of the vibration sensor, associated with the recommended installation position, in a form of image.

Abstract: To provide a novel Cu bonding wire that achieves a favorable FAB shape and a favorable bondability of the 2nd bonded part, and further achieves favorable bond reliability even in a rigorous high-temperature environment. The bonding wire for semiconductor devices includes: a core material of Cu or Cu alloy; and a coating layer containing conductive metal other than Cu formed on a surface of the core material, wherein the coating layer has a region containing Ni as a main component on a core material side, and has a region containing Au and Ni on a wire surface side, in a thickness direction of the coating layer, a thickness of the coating layer is 10 nm or more and 130 nm or less, a ratio CAu/CNi of a concentration CAu (mass %) of Au to a concentration CNi (mass %) of Ni relative to the entire wire is 0.02 or more and 0.

Abstract: In a pipe structure in which an optical fiber passes, miniaturization of the optical module in the longitudinal direction of the optical fiber is prevented. In the optical module according to the present invention, a holding structure of the optical fiber necessary to adopt the pipe structure is moved to a cover extension unit of the package. The optical fiber is adhered and fixed to the cover extension unit protruding from the cover body unit of the package to ensure protection of the optical fiber, and the optical waveguide chip is disposed to be closer to an inner wall of a side surface of the package. By disposing the optical waveguide chip to be close to the inner wall of the package as much as possible and reducing the mounting area in the package to the utmost, it is possible to realize miniaturization of the entire optical module.

Abstract: A cartridge according to an embodiment of the present invention used in a non-combustion suction device having a suction port, has a tank; a first liquid retainer: and a second liquid retainer. The tank is capable of storing liquid. The first liquid retainer is capable of retaining the liquid in the tank and configured to supply the liquid to the heater. The second liquid retainer is in contact with the first liquid retainer and capable of retaining the liquid through the first liquid retainer. The second liquid retainer and the heater are separated from each other.

Abstract: There is provided a novel Cu bonding wire that achieves a favorable FAB shape and achieves a favorable bond reliability of the 2nd bonded part even in a rigorous high-temperature environment. The bonding wire for semiconductor devices is characterized in that the bonding wire includes: a core material of Cu or Cu alloy; and a coating layer containing conductive metal other than Cu formed on a surface of the core material, wherein the coating layer has a region containing Pd as a main component on a core material side, and has a region containing Ni and Pd in a range from a wire surface to a depth of 0.5 d when a thickness of the coating layer is defined as d (nm) in a thickness direction of the coating layer, the thickness d of the coating layer is 10 nm or more and 130 nm or less, a ratio CNi/CPd of a concentration CNi (mass %) of Ni to a concentration CPd (mass %) of Pd relative to the entire wire is 0.02 or more and 0.

Abstract: A method for producing a hydrocarbon, including: preparing a molten salt containing an oxide of a first metal; adding carbon dioxide to the molten salt; obtaining precipitates containing a first metal carbide by applying a voltage to the molten salt containing carbon dioxide; and obtaining a gas containing a hydrocarbon and a hydroxide of the first metal by hydrolyzing the first metal carbide.

Abstract: The bonding wire for semiconductor devices includes a core material of Cu or Cu alloy and a coating layer containing conductive metal other than Cu formed on a surface of the core material. The coating layer has a region containing Pd as a main component on a core material side, and has a region containing Ni and Pd in a range from a wire surface to a depth of 0.5 d, the thickness d (nm) of the coating layer is 10?d?130, a ratio of a concentration CNi (mass %) of Ni to a concentration CPd (mass %) of Pd relative to the entire wire is 0.02<CNi/CPd?0.7, and a position indicating a maximum concentration of Ni which is 10 atomic % or more, is present in the range from the wire surface to a depth of 0.5 d in a concentration profile in a depth direction of the wire.

Abstract: The bonding wire for semiconductor devices includes a core material of Cu or Cu alloy and a coating layer containing conductive metal other than Cu formed on a surface of the core material. The coating layer has a region containing Ni as a main component on a core material side, and has a region containing Au and Ni on a wire surface side, in a thickness direction of the coating layer, a thickness of the coating layer is 10 nm or more and 130 nm or less, a ratio of a concentration CAu (mass %) of Au to a concentration CNi (mass %) of Ni relative to the entire wire is 0.02<CAu/CNi?0.7, and a concentration of Au at the surface of the wire is 10 atomic % or more and 90 atomic % or less.

Abstract: Provided is a method for manufacturing a grain-oriented electrical steel sheet with excellent uniformity of magnetic properties in the sheet transverse direction without increasing production costs. An ignition loss of an annealing separator after drying: IGLOSS (mass %), a storage time of a cold-rolled steel sheet: T (hr), and a carbon dioxide concentration in a storage environment of the cold-rolled steel sheet: A (mass ppm) satisfy the following formula (1): A × IGLOSS ? - 1500 × Ln ? ( T ) + 9000.

Abstract: An information processing apparatus according to an embodiment of the present technology includes a signal processing unit. The signal processing unit extracts, from a plurality of observation signals obtained by a group of microphones, voice signals respectively related to the microphones by machine learning. This allows desired signal output. Moreover, a person on the other end of the line can easily hear the voice of a speaker and cannot hear the voice of other speaker, thereby providing a feeling of security and high confidentiality for users.

Abstract: An optical module according to the present invention includes: an optical device including an optical waveguide chip; an optical fiber block bonded to and arranged on an end face of the optical waveguide chip; an optical fiber that has one end optically connected to the optical waveguide chip via the optical fiber block; an optical fiber holding mechanism for holding the other end of the optical fiber; and an optical fiber carrier. The optical fiber is arranged while being curved from the optical fiber carrier toward the optical fiber block in a U-shape, and a wall structure is formed on the surface of the carrier while being adjacent to the optical fiber at, for example, a position on the outer side of the U-shaped curve of the optical fiber position at which the wall structure reduces a normal force of the optical fiber.

Abstract: The video display system includes a plurality of display devices having mutually different display delay times and a video conversion device that divides an input integrated video signal into a plurality of video signals and respectively outputs the plurality of video signals to the plurality of display devices. At least one of the plurality of video signals is output in a delayed state to make a difference between display timings of the plurality of videos respectively displayed on the plurality of display devices substantially zero, based on the display delay times.

Abstract: This bonded body (10) comprising a mosaic diamond wafer and a semiconductor of a different type is a bonded body in which a mosaic diamond wafer (1) having a coalescence boundary (B1) between a plurality of single-crystal diamond substrates (1A and 1B) and a semiconductor of a different type (2) are bonded together, in which a maximum level difference on a bonding surface (1aa) of the mosaic diamond wafer (1) with the semiconductor of a different type (2) is 10 nm or less.

Abstract: A film forming method of forming a graphene film includes a loading process of loading a substrate into a processing container, a first process of forming the graphene film on the substrate using plasma of a first processing gas that includes a carbon-containing gas, and a second process of forming a doped graphene film on at least one of the substrate and the graphene film using plasma of a second processing gas that includes a dopant gas.

Abstract: In determining the conditions for final annealing, information on the concentration of enriched components over the entire length and width of the steel sheet after decarburization annealing is obtained, the optimum function of product properties in the relationship between enriched components and control conditions for final annealing is obtained in advance, and the distribution of the control conditions for final annealing within the coil were considered while determining the control conditions for final annealing such that the area where the deviation of the product properties from the above optimum function is within a range of ±? is maximized over the entire length and width.

Abstract: A method for providing a hosted portal to facilitate secured payouts is disclosed. The method includes receiving, via the hosted portal, a request from a first user, the request including a refund request from the first user to a second user, user information, and transaction information; generating a hyperlink for the second user based on the transaction information, the hyperlink referencing the hosted portal; validating the request by using the user information; transmitting, via a communication channel, the hyperlink to the second user based on a result of the validating; receiving, via the hosted portal, payout information from the second user; and automatically initiating a transaction based on the transaction information and the payout information.

Abstract: A radio frequency module including a mounting substrate, a first electronic component, a second electronic component and a first connection terminal, a second connection terminal, a first resin layer, and a second resin layer. The second electronic component and the first connection terminal are disposed on a second main surface of the mounting substrate. The second connection terminal is connected to the first connection terminal, and is disposed on a side of the first connection terminal opposite to the mounting substrate side. The first resin layer covers at least a part of the second electronic component, and covers at least a part of the first connection terminals. The second resin layer is disposed on the first resin layer, and covers at least a part of the second connection terminal. The second connection terminal is located inside the first connection terminal in a plan view in a thickness direction of the mounting substrate.

Abstract: To provide a method of producing a grain-oriented electrical steel sheet whereby greater purification of an inhibitor-strengthening element can be promoted by improvement of an annealing separator and, as a result, iron loss can be effectively improved. The annealing separator contains 1 to 10 parts by mass of a composite oxide, relative to 100 parts by mass of MgO, the composite oxide containing at least one selected from a Group 1: Fe, Mn, Al and Ca, and at least one of a Group 2: Zr, Ta, Mo and Nb.