Patents by Inventor Takashi Yamada

Takashi Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210141328
    Abstract: An image forming apparatus includes a printhead configured to add energy to an image material; and a control unit configured to output, based on image data, a signal pattern for controlling energy to be added by the printhead to the image material including a plurality of color development layers that have different color development characteristic and develop colors in accordance with the added energy. When causing at least two of the plurality of color development layers to develop colors, the control unit generates, based on at least two signal patterns generated to cause the at least two color development layers to develop colors, a signal pattern of an OR of the at least two signal patterns and outputs the signal pattern.
    Type: Application
    Filed: December 11, 2020
    Publication date: May 13, 2021
    Inventors: Takeru Sasaki, Hiroaki Ogawa, Takashi Fujita, Okinori Tsuchiya, Akitoshi Yamada
  • Patent number: 11001071
    Abstract: A liquid ejection head includes a pair of electrodes disposed on a first surface of a substrate forming part of a flow path for a liquid. The electrodes of the pair of electrodes are adjacent to each other in a transverse direction of the electrodes, and the liquid moves in the transverse direction upon application of a voltage across the electrodes. The electrodes each include a ridge portion disposed on the first surface and an electrode wiring line connected to a power source for applying the voltage. The electrode wiring line covers an upper surface of the ridge portion and side surfaces of the ridge portion and extends from parts covering the side surfaces of the ridge portion to a downstream side and an upstream side with respect to a direction in which the liquid moves, so as to cover the first surface.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: May 11, 2021
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takashi Sugawara, Masafumi Morisue, Yoshiyuki Nakagawa, Kazuhiro Yamada, Takuro Yamazaki, Ryo Kasai, Tomoko Kudo
  • Patent number: 11002686
    Abstract: A corrugated board sheet defect detecting device detects a defect in a single-faced cardboard sheet guided by a guide member with corrugated core paper facing outwards. The device includes a radiating device, an image capturing device, an image processing device, and an assessing device. The radiating device is configured to radiate light toward the core paper at a radiation angle relative to the single-faced cardboard sheet. The image capturing device is configured to capture an image of a portion of the core paper irradiated with the light. The image processing device is configured to a light portion and a dark portion in a direction in which the single-faced cardboard sheet is transported based on the captured image. The assessing device is configured to assess a quality by comparing a length of the light portion and a length of the dark portion.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: May 11, 2021
    Assignee: MITSUBISHI HEAVY INDUSTRIES MACHINERY SYSTEMS, LTD.
    Inventors: Masahiro Yamada, Takashi Toyohara, Hiroshi Ishibuchi, Hideki Mizutani, Akira Ogino, Shuichi Takemoto, Naoyuki Fukushige
  • Publication number: 20210129405
    Abstract: In a temperature control device, a resin flow channel is formed from a nozzle section and a cylinder section that is connected to the nozzle section and the device controls the temperature of the resin that flows in the resin flow channel. The temperature control device is provided with: a first temperature sensor for detecting the nozzle temperature of the resin flowing through the nozzle section; a first temperature control unit for performing PID control so that the nozzle temperature achieves a first target temperature; multiple second temperature sensors for detecting the cylinder temperature of the resin flowing through the cylinder section; and second temperature control units for performing PID control so that the cylinder temperature achieves a second target temperature. The second temperature control units perform PID control of the cylinder temperature using temperature control information from the first temperature control unit.
    Type: Application
    Filed: December 20, 2018
    Publication date: May 6, 2021
    Applicant: OMRON Corporation
    Inventors: Takaaki YAMADA, Takashi SAKAGUCHI
  • Patent number: 10991672
    Abstract: The present invention provides a bonding wire for a semiconductor device, where the bonding wire can inhibit wear of capillary. In a Cu alloy bonding wire for a semiconductor device, a total of abundance ratios of a crystal orientations <110> and <111> having an angular difference of 15 degrees or less from a direction perpendicular to one plane including a wire center axis is to crystal orientations on a wire surface 40% or more and 90% or less, in average area percentage.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: April 27, 2021
    Assignees: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD., NIPPON MICROMETAL CORPORATION
    Inventors: Tetsuya Oyamada, Tomohiro Uno, Takashi Yamada, Daizo Oda
  • Patent number: 10985130
    Abstract: It is an object to provide a Cu alloy bonding wire for a semiconductor device that can satisfy required performance in high-density LSI applications. In the Cu alloy bonding wire for a semiconductor device according to the present invention, each of abundance ratios of crystal orientations <100>, <110> and <111> having an angular difference of 15 degrees or less from a direction perpendicular to one plane including a wire center axis out of crystal orientations on a wire surface is 3% or more and less than 27% in average area percentage.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: April 20, 2021
    Assignees: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD., NIPPON MICROMETAL CORPORATION
    Inventors: Tetsuya Oyamada, Tomohiro Uno, Takashi Yamada, Daizo Oda
  • Publication number: 20210107571
    Abstract: The rear frame includes an inclined part that is inclined inward in, a vehicle width direction in going rearward and a horizontal part that extends rearward from a rear end of the inclined part. A rear part of the side sill includes a first enlarged width portion that increases in width inwardly in the vehicle width direction via a bent portion. A front part of the rear frame inclined part includes a second enlarged width portion that increases in width outwardly in the vehicle width direction. A rear end of the first enlarged width portion and a front end of the second enlarged width portion are connected. An inner wall in the vehicle width direction of the first enlarged width portion and an inner wall in the vehicle width direction of the inclined part are linearly continuous in plan view.
    Type: Application
    Filed: April 10, 2019
    Publication date: April 15, 2021
    Inventors: Kota Fujisawa, Takashi Yamada, Kanji Kaneko
  • Patent number: 10971237
    Abstract: A semiconductor device has stored therein a plurality of bits of fixed data. The semiconductor device includes a plurality of memory elements that correspond, respectively, to the plurality of bits of the fixed data, and that acquire, store, and output the value of each bit received at an input terminal of each of the memory elements according to a timing signal. An initialization control unit feeds, to the plurality of memory elements, an initialization signal upon receipt of a fixed data setting signal, each of the plurality of memory elements being initialized to a state of storing a corresponding value represented by a bit of the fixed data according to the initialization signal.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: April 6, 2021
    Assignee: LAPIS SEMICONDUCTOR CO., LTD.
    Inventor: Takashi Yamada
  • Patent number: 10959892
    Abstract: A management device, comprising a controller that controls communication between a movable first terminal device and a second terminal device in which a moving range is narrower than the first terminal device, and a detector that detects that the first terminal device arrives at a target point by movement, wherein in a case where the detector detects the arrival at the target point, the controller ends the communication between the first terminal device and the second terminal device.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: March 30, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takashi Yamada, Atsunobu Kato, Dongdong Wang
  • Patent number: 10955781
    Abstract: A fixing apparatus, an image forming apparatus, and a nip width controlling method, capable of preventing deterioration in fixing quality by controlling the nip width with high accuracy, are provided. The fixing apparatus includes a pair of fixing members that are in pressure-contact with each other and in which at least one of the members rotates to thereby form a fixing nip that sandwiches and conveys a recording medium; a moving section that moves the pair of fixing members relative to each other in a direction in which the pair of fixing members are brought into pressure-contact with each other or in a direction opposite thereto; a detector that detects rotational torque for rotating any one of the pair of fixing members; and a control section that controls the moving section such that the pair of fixing members are moved relative to each other corresponding to the detected rotational torque.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: March 23, 2021
    Assignee: KONICA MINOLTA, INC.
    Inventors: Masanori Murakami, Takashi Yamada
  • Patent number: 10948436
    Abstract: A wavelength dispersive X-ray fluorescence spectrometer includes a single one-dimensional detector (10) having detection elements (7) arranged linearly, and includes a detector position change mechanism (11) for setting a position of the one-dimensional detector (10) to either a parallel position at which an arrangement direction of the detection elements (7) is parallel to a spectral angle direction of a spectroscopic device (6) or an intersection position at which the arrangement direction intersects the spectral angle direction. At the parallel position, a receiving surface of the one-dimensional detector (10) is located at a focal point of focused secondary X-rays (42). At the intersection position, a receiving slit (9) is disposed at the focal point of the focused secondary X-rays (42), and the receiving surface is located at a traveling direction side of the focused secondary X-rays (42) farther from the spectroscopic device (6) than the receiving slit (9).
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: March 16, 2021
    Assignee: Rigaku Corporation
    Inventors: Shuichi Kato, Takashi Yamada, Yoshiyuki Kataoka
  • Patent number: 10950571
    Abstract: The present invention provides a bonding wire for a semiconductor device suitable for cutting-edge high-density LSIs and on-vehicle LSIs by improving the formation rate of Cu—Al IMC in ball bonds. A bonding wire for a semiconductor device contains Pt of 0.1 mass % to 1.3 mass %, at least one dopant selected from a first dopant group consisting of In, Ga, and Ge, for a total of 0.05 mass % to 1.25 mass %, and a balance being made up of Cu and incidental impurities.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: March 16, 2021
    Assignees: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD., NIPPON MICROMETAL CORPORATION
    Inventors: Tetsuya Oyamada, Tomohiro Uno, Takashi Yamada, Daizo Oda, Motoki Eto
  • Publication number: 20210043599
    Abstract: It is an object to provide a Cu alloy bonding wire for a semiconductor device that can satisfy required performance in high-density LSI applications. In the Cu alloy bonding wire for a semiconductor device according to the present invention, each of abundance ratios of crystal orientations <100>, <110> and <111> having an angular difference of 15 degrees or less from a direction perpendicular to one plane including a wire center axis out of crystal orientations on a wire surface is 3% or more and less than 27% in average area percentage.
    Type: Application
    Filed: September 20, 2019
    Publication date: February 11, 2021
    Inventors: Tetsuya Oyamada, Tomohiro UNO, Takashi YAMADA, Dizo ODA
  • Publication number: 20210041631
    Abstract: A fiber module (1B) according to the present disclosure includes an input-side optical fiber (11), an output-side optical fiber (12), a ferrule (20) in which the input-side optical fiber and the output-side optical fiber are insertable in both ends and a groove (32) is formed in a direction orthogonal to a longitudinal direction (D1) in the middle of the longitudinal direction, a dielectric multilayer film filter (30) inserted in the groove, and an input-side GI fiber (15) and an output-side GI fiber (16) joined by fusion to respective terminal portions of the input-side optical fiber and the output-side optical fiber. The dielectric multilayer film filter is interposed between an end surface (15f) of the input-side GI fiber and an end surface (16f) of the output-side GI fiber in the longitudinal direction.
    Type: Application
    Filed: February 28, 2019
    Publication date: February 11, 2021
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Kengo HORIKOSHI, Takashi YAMADA, Hisao YOSHINAGA, Shunsuke KANAI, Manabu KUBOTA
  • Publication number: 20210034912
    Abstract: Objective discrimination of a disease label of a depressive symptom with respect to an active state of a brain is achieved. One means for solving the problems of the present invention is to provide a discriminating device for assisting in determination of whether a subject has a depressive symptom. The discriminating device includes a storage device for storing information for identifying a classifier generated by classifier generation processing based on a signal obtained by using a brain activity detecting apparatus to measure, in advance and time-sequentially, a signal indicating a brain activity of a plurality of predetermined regions of each brain of a plurality of participants in a resting state, the plurality of participants including healthy individuals and patients with depression.
    Type: Application
    Filed: October 2, 2018
    Publication date: February 4, 2021
    Applicants: ADVANCED TELECOMMUNICATIONS RESEARCH INSTITUTE INTERNATIONAL, HIROSHIMA UNIVERSITY
    Inventors: Giuseppe LISI, Jun MORIMOTO, Mitsuo KAWATO, Takashi YAMADA, Naho ICHIKAWA, Yasumasa OKAMOTO
  • Publication number: 20210006032
    Abstract: A method for manufacturing a monolithically integrated semiconductor optical integrated element comprising a DFB laser, an EA modulator, and a SOA disposed in a light emitting direction, comprising the step of forming a semiconductor wafer on which the elements are two-dimensionally arrayed and aligned the optical axes; cleaving the semiconductor wafer along a plane orthogonal to the light emitting direction to form a semiconductor bar including a plurality of the elements arranged one-dimensionally along a direction orthogonal to the light emitting direction such that the elements adjacent to each other share an identical cleavage end face as a light emission surface; inspecting the semiconductor bar by driving the SOA and the DFB laser through a connection wiring part together; and separating out the semiconductor bar after the inspection to cut the connection wiring part connecting the electrode of the SOA and the DFB laser to isolate from each other.
    Type: Application
    Filed: February 28, 2019
    Publication date: January 7, 2021
    Inventors: Takahiko Shindo, Naoki Fujiwara, Kimikazu Sano, Hiroyuki Ishii, Hideaki Matsuzaki, Takashi Yamada, Kengo Horikoshi
  • Publication number: 20200410890
    Abstract: Neurofeedback training executed by a brain activity training apparatus for performing a training to change the correlation of connectivity between brain areas utilizing correlation of measured connectivity between brain areas involves repetition of a plurality of trials. Each trial includes a resting period Trest, a self-regulation period TNF and a presenting period TScore presenting feedback information. The brain activity training apparatus calculates, from signals detected from a trainee in the resting period by a brain activity detecting device, a baseline level of degrees of activity of prescribed regions corresponding to the functional connectivity as the object of training, calculates, from signals detected in the self-regulation period and from the baseline level, time correlation of degrees of activity of the prescribed regions corresponding to the functional connectivity as the object of training, and calculates information to be fedback.
    Type: Application
    Filed: March 5, 2019
    Publication date: December 31, 2020
    Applicant: ADVANCED TELECOMMUNICATIONS RESEARCH INSTITUTE INTERNATIONAL
    Inventors: Takashi YAMADA, Takanori KOCHIYAMA, Mitsuo KAWATO, Toshinori YOSHIOKA
  • Patent number: 10877189
    Abstract: A mirror panel includes a semitransmissive diffusion part and a reflecting surface. The semitransmissive diffusion part is configured to diffuse first part of incident light via an incident surface and linearly transmit second part of the incident light. The reflecting surface is disposed in contact with or adjacent to the semitransmissive diffusion part, and reflects light transmitted through the semitransmissive diffusion part toward the semitransmissive diffusion part.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: December 29, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takashi Yamada, Hiroshi Yamaguchi
  • Patent number: 10859469
    Abstract: A tire deformation calculator includes a processor. The processor (i) detects a contour of a side face of a tire attached to a wheel of a vehicle in a captured image; (ii) calculates load deformation of the contour of the side face, the load corresponding to a weight of the vehicle; (iii) identifies a circular or polygonal shape or pattern on a plane parallel to the contour of the side face; (iv) determines a conversion value for converting the identified shape or pattern in the captured image to a perfect circle or a regular polygon; (v) calculates a predetermined value indicating the load deformation of the tire in the captured image based on the conversion value; and (vi) calculates the load deformation based on the predetermined value.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: December 8, 2020
    Assignee: KONICA MINOLTA, INC.
    Inventors: Asahi Ebe, Takashi Yamada, Toru Kikuchi
  • Publication number: 20200373226
    Abstract: Provided is a Pd coated Cu bonding wire for a semiconductor device capable of sufficiently obtaining bonding reliability of a ball bonded portion in a high temperature environment of 175° C. or more, even when the content of sulfur in the mold resin used in the semiconductor device package increases. The bonding wire for a semiconductor device comprises a Cu alloy core material; and a Pd coating layer formed on a surface of the Cu alloy core material; and contains 0.03 to 2% by mass in total of one or more elements selected from Ni, Rh, Ir and Pd in the bonding wire and further 0.002 to 3% by mass in total of one or more elements selected from Li, Sb, Fe, Cr, Co, Zn, Ca, Mg, Pt, Sc and Y. The bonding wire can be sufficiently obtained bonding reliability of a ball bonded portion in a high temperature environment of 175° C. or more, even when the content of sulfur in the mold resin used in the semiconductor device package increases by being used.
    Type: Application
    Filed: December 28, 2017
    Publication date: November 26, 2020
    Inventors: Daizo ODA, Takashi YAMADA, Motoki ETO, Taruo HAIBARA, Tomohiro UNO