Patents by Inventor Takashi Yamada

Takashi Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12388044
    Abstract: There is provided an Al bonding wire which can achieve a sufficient bonding reliability of bonded parts of the bonding wire under a high temperature state where a semiconductor device using the Al bonding wire is operated. The Al bonding wire is characterized in that the wire contains 0.02 to 1% by mass of Fe, further contains 0.05 to 0.5% by mass in total of at least one or more of Mn and Cr, and the balance includes Al and inevitable impurities, wherein a total content of Fe, Mn and Cr in solid solution is 0.01 to 1% by mass. The Al bonding wire contains Mn and Cr in addition to Fe, so that Fe, Mn and Cr can be promoted to form a solid solution in quenching treatment after the solution treatment. Accordingly, the Al bonding wire can achieve an effect of solid-solution strengthening of the wire due to the increase in the total content of Fe, Mn and Cr in solid solution and an effect of preventing recrystallization from proceeding during use of the semiconductor device at a high temperature for a long time.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: August 12, 2025
    Assignees: NIPPON MICROMETAL CORPORATION, NIPPON STEEL Chemical & Material Co., Ltd.
    Inventors: Takashi Yamada, Akihito Nishibayashi, Teruo Haibara, Daizo Oda, Motoki Eto, Tetsuya Oyamada, Takayuki Kobayashi, Tomohiro Uno
  • Patent number: 12362831
    Abstract: One aspect of the present invention is a optical main signal processing node apparatus including: an input port for inputting an optical multiplexed with signals pertaining to a plurality of services from an optical transmission path; an output port for outputting an optical signal multiplexed with signals pertaining to a plurality of services to an optical transmission path; a optical main signal processer configured to perform optical main signal processing on an optical signal input from the input port; and a path switch configured to switch a path of the optical signal input from the input port to one of a first path for guiding the optical signal to the output port and a second path for guiding the optical signal to the optical main signal processer.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: July 15, 2025
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Kota Asaka, Keita Nishimoto, Yukio Toyoshima, Takashi Yamada, Junichi Kani
  • Publication number: 20250207731
    Abstract: An equipment maintenance method that allows prevention of nitrogen gas from solidifying is provided when separating the equipment from a flow path for liquefied hydrogen. In the equipment maintenance method, an operator allows hydrogen gas to flow into a first section, a second section, a third section, and a fourth section, and discharges liquefied hydrogen. Thereafter, the operator allows the nitrogen gas to flow into the second section and the third section, and discharges the hydrogen gas. With the second section and the third section filled with the nitrogen gas, the operator decouples the flow path at a first joint part and a second joint part, and detaches the pump.
    Type: Application
    Filed: March 22, 2023
    Publication date: June 26, 2025
    Applicant: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Tomonori TAKASE, Takashi YAMADA, Atsushi MAEDA, Kyohei TAKESHITA, Seiji YAMASHITA, Yasunobu NOMOTO
  • Publication number: 20250181017
    Abstract: Disclosed is an image forming apparatus including: an image creator that creates an image; a transferer that transfers the image created by the image creator onto a recording medium by causing the image and the recording medium to pass through a transfer nip formed by transfer members in a pressure contact state; and a hardware processor that acquires level difference information of a level difference in the recording medium, and changes a pressure contact force of the transfer members in the pressure contact state based on the acquired level difference information.
    Type: Application
    Filed: November 12, 2024
    Publication date: June 5, 2025
    Inventor: Takashi YAMADA
  • Patent number: 12316289
    Abstract: A power amplifying circuit includes multi-stage power amplifiers, bias circuits, and a control circuit. The bias circuits output corresponding bias currents based on corresponding control currents. The control circuit outputs the control currents to the bias circuits based on a control voltage. The power amplifiers include a first stage of first and second power amplifiers connected in parallel electrically. The bias circuits include first and second bias circuits. The control circuit includes first and second current output units. The first current output unit outputs, to the first bias circuit, a first control current which has a first current value when the control voltage is a first threshold voltage, and which increases linearly with the control voltage, and the second current output unit outputs, to the second bias circuit, a second control current, having a second constant current value, when the control voltage is the first threshold voltage or greater.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: May 27, 2025
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takashi Yamada
  • Patent number: 12300658
    Abstract: In a copper alloy bonding wire for semiconductor devices, the bonding longevity of a ball bonded part under high-temperature and high-humidity environments is improved. The copper alloy bonding wire for semiconductor devices includes in total 0.03% by mass or more to 3% by mass or less of at least one or more kinds of elements selected from Ni, Zn, Ga, Ge, Rh, In, Ir, and Pt (first element), with the balance Cu and inevitable impurities. The inclusion of a predetermined amount of the first element suppresses production of an intermetallic compound susceptible to corrosion under high-temperature and high-humidity environments at the wire bonding interface and improves the bonding longevity of a ball bonded part.
    Type: Grant
    Filed: September 12, 2022
    Date of Patent: May 13, 2025
    Assignees: NIPPON MICROMETAL CORPORATION, NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    Inventors: Daizo Oda, Takashi Yamada, Motoki Eto, Teruo Haibara, Tomohiro Uno
  • Publication number: 20250149989
    Abstract: In a flyback power supply circuit, electric power for driving semiconductor switching elements constituting a three-phase inverter circuit is generated by a plurality of transformers having primary windings and secondary windings. The primary windings of the multiple transformers are connected in series. The control unit controls a semiconductor switch that turns on and off the current flowing from the input power supply to the primary winding. A rectifier circuit is connected to each secondary winding.
    Type: Application
    Filed: September 10, 2024
    Publication date: May 8, 2025
    Inventor: Takashi YAMADA
  • Publication number: 20250150387
    Abstract: Provided is a communication system in which a plurality of networks each having a detour within an end-to-end distance are formed, the communication system including: a plurality of section control units that perform path control for each of sections with a network having a detour, the sections being obtained by partitioning the communication system; and an integrated control unit that controls the plurality of section control units, in which the integrated control unit includes an optimization unit that determines an optimal guaranteed delay time for each section to satisfy an end-to-end guaranteed delay time provided by a service, and a notification unit that notifies the plurality of section control units of the optimal guaranteed delay time for each section determined by the optimization unit, and the plurality of section control units each include a switching destination instruction unit that instructs a switching destination to switch to a path satisfying the optimal guaranteed delay time notified from
    Type: Application
    Filed: February 17, 2022
    Publication date: May 8, 2025
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Tomoya HATANO, Hiroshi O, Takashi YAMADA, Hirotaka UJIKAWA, Yushi KOYASAKO
  • Patent number: 12248181
    Abstract: An optical module is provided with a columnar protrusion over the entire pickup area (EP) for automatic suction by a mounting device at the center of the upper surface of a fiber holding carrier. The protrusion secures a dedicated pickup area (EP1) on a top surface. When an extra length of an optical fiber extending from an optical device is routed and held between a pair of wall portions, the extra length including a tip portion is held in a storage area of the fiber holding carrier by a restoring force caused by being pressed against the wall portions.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: March 11, 2025
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Yuriko Kawamura, Takashi Yamada, Yusuke Nasu, Yuichiro Ikuma
  • Patent number: 12233428
    Abstract: A dispenser, which has a pump chamber formed by a body including a depression, and a lid body covering an opening of the body, where a liquid in the pump chamber is discharged from a nozzle portion by performing a discharge operation that presses the lid body to an inside of the pump chamber to deform the lid body, and a liquid is caused to flow into the pump chamber by releasing the discharge operation. The dispenser includes a pressing support portion disposed to face away from a top surface of the lid body, and a discharge operation is performed by pinching a top portion of the lid body and the pressing support portion with fingers from lateral sides of the body.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: February 25, 2025
    Assignee: Kao Corporation
    Inventor: Takashi Yamada
  • Patent number: 12222567
    Abstract: An optical circuit module in which an optical fiber array and an optical circuit substrate are connected, the optical fiber array including a groove substrate in which a groove for optical fiber alignment is formed, a pressing plate stacked on and bonded to the groove substrate, and an optical fiber bonded to and fixed in the groove of the groove substrate, and the optical circuit substrate including an input/output waveguide. In a connection surface of the optical circuit module, an area of a common portion in a cross section of the optical circuit substrate and the pressing plate is larger than an area of a common portion in a cross section of the optical circuit substrate and the groove substrate.
    Type: Grant
    Filed: November 28, 2019
    Date of Patent: February 11, 2025
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Yuichiro Ikuma, Yusuke Nasu, Takashi Yamada
  • Publication number: 20250044523
    Abstract: An optical waveguide substrate, which includes a substrate main body; and an optical waveguide formed in the substrate main body, is configured in a manner that the substrate main body includes a through-hole which includes one end surface of the substrate main body and penetrates the substrate main body in a thickness-wise direction, and a long groove portion which communicates with the through-hole and extends in parallel with a main surface of the substrate main body, the through-hole is formed at a position corresponding to the optical waveguide, and an inner surface of the long groove portion includes an inclined surface which is in contact with an optical fiber when the optical fiber is inserted through the long groove portion via the through-hole.
    Type: Application
    Filed: December 9, 2021
    Publication date: February 6, 2025
    Inventors: Takashi Yamada, Kiyofumi Kikuchi, Yuriko Kawamura
  • Publication number: 20250035868
    Abstract: This optical module includes a cable including an optical fiber, and a connector module. The connector module includes: a circuit board having a first surface and a second surface; a metal housing in which the circuit board is disposed and which includes a plate-shaped portion facing the second surface; a resin housing in which the metal housing is disposed; and a heat transfer member which is disposed on the second surface. The plate-shaped portion of the metal housing includes a first region overlapping with the heat transfer member in plan view, and a second region located around the first region. The first region is closer to the second surface than the second region, and is in contact with the heat transfer member. A heat insulating region is disposed between the first region and the resin housing.
    Type: Application
    Filed: December 5, 2022
    Publication date: January 30, 2025
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Taisuke NAGASAKI, Takeshi INOUE, Kensaku SHIMADA, Toshihisa YOKOCHI, Tatsuhiko NAITO, Takashi YAMADA
  • Publication number: 20250021373
    Abstract: A control device includes an activation unit configured to cause another virtual machine or another container to activate an application that is activated in a virtual machine or a container constructed in a server and periodically transmits control information to a control target device, a communication setting unit configured to perform, in a case where the application has been activated, setting for enabling communication between the activated application and the control target device, and a deriving unit configured to derive, as a timing at which the activation unit activates the application, a timing at which the setting is not performed between transmission of the control information from the application and reception of the control information by the control target device, wherein the activation unit causes the another virtual machine or the another container to activate the application at the derived timing.
    Type: Application
    Filed: November 25, 2021
    Publication date: January 16, 2025
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Sei KOU, Takashi YAMADA, Tomoya HATANO
  • Publication number: 20250004997
    Abstract: An aspect of the present invention is a database management device including: a generation unit for generating a database; a monitoring unit for monitoring a physical quantity having a positive correlation with a usage of the database generated by the generation unit; and a management unit instructing the generation unit to generate a new database as the database to be used subsequent to the database currently in use when the physical quantity monitored by the monitoring unit exceeds a threshold value, and the generation unit reserves a region for storing the new database within a storage device and generates the new database in the reserved region when instructed to generate the new database by the management unit.
    Type: Application
    Filed: December 6, 2021
    Publication date: January 2, 2025
    Inventors: Sei KOU, Takashi YAMADA
  • Publication number: 20240387085
    Abstract: A transformer includes a printed circuit board and a core. The printed circuit board includes wiring layers and an insulating layer sandwiched between the adjacent wiring layers. The core penetrates the printed circuit board. Each of the wiring layers includes a first winding pattern and a second winding pattern arranged to surround the core, and the first winding pattern and the second winding pattern in each of the wiring layers are insulated from each other. The first winding patterns of the adjacent wiring layers are connected by a first via in the insulating layer, and the first winding patterns of the wiring layers are connected in series to constitute a first coil. The second winding patterns of the adjacent wiring layers are connected by a second via in the insulating layer, and the second winding patterns of the wiring layers are connected in series to constitute a second coil.
    Type: Application
    Filed: April 10, 2024
    Publication date: November 21, 2024
    Inventor: TAKASHI YAMADA
  • Patent number: 12140133
    Abstract: A dispenser, which has a pump chamber formed by a body including a depression, and a lid body covering an opening of the body, where a liquid in the pump chamber is discharged front a nozzle portion by performing a discharge operation that presses the lid body toward an inside of the pump chamber to deform the lid body, and a liquid is caused to flow into the pump chamber when the discharge operation is released. A coil spring that urges the lid body to an outside of the pump chamber is included in the pump chamber, a diameter of the coil spring is larger than a radius of the lid body, and a deformation amount of the lid body is equal to or more than ? of a diameter of the lid body.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: November 12, 2024
    Assignee: Kao Corporation
    Inventor: Takashi Yamada
  • Patent number: 12132025
    Abstract: There is provided a metal-coated Al bonding wire which can provide a sufficient bonding reliability of bonded parts of the bonding wire under a high temperature state where a semiconductor device using the metal-coated Al bonding wire is operated. The bonding wire includes a core wire of Al or Al alloy, and a coating layer of Ag, Au or an alloy containing them formed on the outer periphery of the core wire, and the bonding wire is characterized in that when measuring crystal orientations on a cross-section of the core wire in a direction perpendicular to a wire axis of the bonding wire, a crystal orientation <111> angled at 15 degrees or less to a wire longitudinal direction has a proportion of 30 to 90% among crystal orientations in the wire longitudinal direction. Preferably, the surface roughness of the wire is 2 ?m or less in terms of Rz.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: October 29, 2024
    Assignees: NIPPON MICROMETAL CORPORATION, NIPPON STEEL Chemical & Material Co., Ltd.
    Inventors: Takashi Yamada, Akihito Nishibayashi, Teruo Haibara, Daizo Oda, Motoki Eto, Tetsuya Oyamada, Takayuki Kobayashi, Tomohiro Uno
  • Publication number: 20240354947
    Abstract: Objective discrimination of a disease label of a depressive symptom with respect to an active state of a brain is achieved. One means for solving the problems of the present invention is to provide a discriminating device for assisting in determination of whether a subject has a depressive symptom. The discriminating device includes a storage device for storing information for identifying a classifier generated by classifier generation processing based on a signal obtained by using a brain activity detecting apparatus to measure, in advance and time-sequentially, a signal indicating a brain activity of a plurality of predetermined regions of each brain of a plurality of participants in a resting state, the plurality of participants including healthy individuals and patients with depression.
    Type: Application
    Filed: April 22, 2024
    Publication date: October 24, 2024
    Applicants: ADVANCED TELECOMMUNICATIONS RESEARCH INSTITUTE INTERNATIONAL, HIROSHIMA UNIVERSITY
    Inventors: Giuseppe LISI, Jun MORIMOTO, Mitsuo KAWATO, Takashi YAMADA, Naho ICHIKAWA, Yasumasa OKAMOTO
  • Publication number: 20240353627
    Abstract: An optical module according to the present invention includes: an optical device including an optical waveguide chip; an optical fiber block bonded to and arranged on an end face of the optical waveguide chip; an optical fiber that has one end optically connected to the optical waveguide chip via the optical fiber block; an optical fiber holding mechanism for holding the other end of the optical fiber; and an optical fiber carrier. The optical fiber is arranged while being curved from the optical fiber carrier toward the optical fiber block in a U-shape, and a wall structure is formed on the surface of the carrier while being adjacent to the optical fiber at, for example, a position on the outer side of the U-shaped curve of the optical fiber position at which the wall structure reduces a normal force of the optical fiber.
    Type: Application
    Filed: July 1, 2024
    Publication date: October 24, 2024
    Inventors: Yuriko Kawamura, Takashi Yamada, Yusuke Nasu