Abstract: An endoscope operation portion includes: an operation portion body provided being connected to a grasping portion; a joystick-type bending operation lever provided on a back side of the operation portion body, including a lever shaft body, and configured to perform a bending operation of a bending portion; and a suction button provided on a front side of the operation portion body so that an angle formed by an operation axis in a pressing-down operation direction relative to a central axis of the lever shaft body is an obtuse angle, and an intersection point between the central axis and the operation axis is positioned inside the operation portion body.

Abstract: An endoscope according to one aspect of the present invention includes: an operation lever portion that is provided in an operation portion, includes an operation shaft, and is capable of adjusting a bending angle of a bending portion in conjunction with a tilting operation; and an exterior cover that is water-tightly fixed to the operation portion so as to cover an outer periphery of the operation shaft, and is formed in a stair shape in cross section, including a hardly deformed region and an easily deformed region that is formed at a predetermined angle with respect to the hardly deformed region.

Abstract: An endoscope operation portion includes: an operation portion body provided being connected to a grasping portion; a joystick-type bending operation lever provided on a back side of the operation portion body, including a lever shaft body, and configured to perform a bending operation of a bending portion; and a suction button provided on a front side of the operation portion body so that an angle formed by an operation axis in a pressing-down operation direction relative to a central axis of the lever shaft body is an obtuse angle, and an intersection point between the central axis and the operation axis is positioned inside the operation portion body.

Abstract: An endoscope operation portion includes: an operation portion body provided being connected to a grasping portion; a joystick-type bending operation lever provided on a back side of the operation portion body, including a lever shaft body, and configured to perform a bending operation of a bending portion; and a suction button provided on a front side of the operation portion body so that an angle formed by an operation axis in a pressing-down operation direction relative to a central axis of the lever shaft body is an obtuse angle, and an intersection point between the central axis and the operation axis is positioned inside the operation portion body.

Abstract: An endoscope according to one aspect of the present invention includes: an operation lever portion that is provided in an operation portion, includes an operation shaft, and is capable of adjusting a bending angle of a bending portion in conjunction with a tilting operation; and an exterior cover that is water-tightly fixed to the operation portion so as to cover an outer periphery of the operation shaft, and is formed in a stair shape in cross section, including a hardly deformed region and an easily deformed region that is formed at a predetermined angle with respect to the hardly deformed region.

Abstract: A dividing wall member is provided inside a specific bending piece selected from a plurality of bending pieces, an internal space of the bending piece is divided by the dividing wall member into a first space that opens corresponding to one rotating shaft, of rotating shafts that form a left and right pair, and a second space that is larger than the first space and opens corresponding to another rotating shaft, of the rotating shafts that form a left and right pair, and rotating shafts that form an upper and lower pair, a signal cable is inserted as a first internal component inside a first space, and a pair of light guides and a treatment instrument insertion channel are inserted as second internal components inside the second space.

Abstract: An endoscope operation portion includes: an operation portion body provided being connected to a grasping portion; a joystick-type bending operation lever provided on a back side of the operation portion body, including a lever shaft body, and configured to perform a bending operation of a bending portion; and a suction button provided on a front side of the operation portion body so that an angle formed by an operation axis in a pressing-down operation direction relative to a central axis of the lever shaft body is an obtuse angle, and an intersection point between the central axis and the operation axis is positioned inside the operation portion body.

Abstract: To suppress an increase in the number of voltage comparators with an expansion in a chip temperature detection range, a temperature sensor in a semiconductor device includes a temperature detection circuit for outputting a voltage according to the chip temperature, a reference voltage generating circuit for generating a plurality of reference voltages, and a plurality of voltage comparators for comparing each reference voltage obtained by the reference voltage generating circuit with an output voltage of the temperature detection circuit and thereby generating a chip temperature detection signal configured with multiple bits. Further, the temperature sensor includes a control circuit for controlling the reference voltages generated by the reference voltage generating circuit based on the chip temperature detection signal and thereby changing correspondence between the chip temperature detection signal and the chip temperature to shift a chip temperature detection range.

Abstract: A temperature sensor in a semiconductor device includes a temperature detection circuit for outputting a voltage according to the chip temperature, a reference voltage generating circuit for generating a plurality of reference voltages, and a plurality of voltage comparators for comparing each reference voltage with an output voltage of the temperature detection circuit and thereby generating a chip temperature detection signal configured with multiple bits. Further, the temperature sensor includes a control circuit for controlling the reference voltages generated by the reference voltage generating circuit based on the chip temperature detection signal and thereby changing correspondence between the chip temperature detection signal and the chip temperature to shift a chip temperature detection range.

Abstract: A semiconductor device with improved temperature detection accuracy includes a coefficient calculation circuitry which calculates a plurality of N-th order coefficients, where N is an integer equal to or greater than one, of a correction function as an N-th order approximation of a characteristic function which relates temperature data measured by the temperature sensor and the actual temperature. The coefficient calculation circuitry uses N+1 pieces of the temperature data including a theoretical value at absolute zero in the characteristic function and N measured values of the temperature data measured by the temperature sensor unit at N points of temperature. A corrected temperatures are output using the correction function with the calculated coefficients and measured temperature values.

Abstract: The present invention provides a semiconductor device including a first terminal and a second terminal respectively coupled to both ends of a crystal resonator, an inverter circuit having an input coupled to the first terminal and an output coupled to the second terminal, a feedback resistor which couples between the first terminal and the second terminal, a variable capacitor coupled to at least one of the first and second terminals, and a control circuit. The control circuit performs control to increase both of the drive capability of the inverter circuit and the capacitance value of the variable capacitor in a second mode rather than a first mode.

Abstract: The present invention provides a semiconductor device including a first terminal and a second terminal respectively coupled to both ends of a crystal resonator, an inverter circuit having an input coupled to the first terminal and an output coupled to the second terminal, a feedback resistor which couples between the first terminal and the second terminal, a variable capacitor coupled to at least one of the first and second terminals, and a control circuit. The control circuit performs control to increase both of the drive capability of the inverter circuit and the capacitance value of the variable capacitor in a second mode rather than a first mode.

Abstract: The present invention provides a semiconductor device including a first terminal and a second terminal respectively coupled to both ends of a crystal resonator, an inverter circuit having an input coupled to the first terminal and an output coupled to the second terminal, a feedback resistor which couples between the first terminal and the second terminal, a variable capacitor coupled to at least one of the first and second terminals, and a control circuit. The control circuit performs control to increase both of the drive capability of the inverter circuit and the capacitance value of the variable capacitor in a second mode rather than a first mode.

Abstract: An integrated circuit formed on a semiconductor chip includes voltage regulators for stepping down an externally-supplied power voltage to produce an internal power voltage, and internal circuits which operate based on the internal power voltage. The voltage regulators are laid in the area of the buffers and protective elements for the input/output signals and power voltages so that the overhead area due to the on-chip provision of the voltage regulators is minimized. The internal power voltage is distributed to the internal circuits through a looped main power line, with an electrode pad for connecting an external capacitor for stabilizing the internal power voltage being provided on it, so that the internal power voltage is stabilized and the power consumption of the integrated circuit is minimized.

Abstract: A temperature sensor in a semiconductor device includes a temperature detection circuit for outputting a voltage according to the chip temperature, a reference voltage generating circuit for generating a plurality of reference voltages, and a plurality of voltage comparators for comparing each reference voltage with an output voltage of the temperature detection circuit and thereby generating a chip temperature detection signal configured with multiple bits. Further, the temperature sensor includes a control circuit for controlling the reference voltages generated by the reference voltage generating circuit based on the chip temperature detection signal and thereby changing correspondence between the chip temperature detection signal and the chip temperature to shift a chip temperature detection range.

Abstract: Improvement in the accuracy of a temperature sensor is aimed at, suppressing the number of the test temperature in a test process. The semiconductor device comprises a coefficient calculation unit which calculates up to the N-th order coefficient (N is an integer equal to or greater than one) of a correction function as an N-th order approximation of a characteristic function indicating correspondence relation of temperature data measured by a temperature sensor unit and temperature, based on N+1 pieces of the temperature data including a theoretical value at a predetermined temperature in the characteristic function and N measured values of the temperature data measured by the temperature sensor unit at N points of temperature; and a correction operation unit which generates data including information on temperature, by performing calculation using the correction function to which the coefficients calculated are applied, based on temperature data measured by the temperature sensor unit.

Abstract: An integrated circuit formed on a semiconductor chip includes voltage regulators for stepping down an externally-supplied power voltage to produce an internal power voltage, and internal circuits which operate based on the internal power voltage. The voltage regulators are laid in the area of the buffers and protective elements for the input/output signals and power voltages so that the overhead area due to the on-chip provision of the voltage regulators is minimized. The internal power voltage is distributed to the internal circuits through a looped main power line, with an electrode pad for connecting an external capacitor for stabilizing the internal power voltage being provided on it, so that the internal power voltage is stabilized and the power consumption of the integrated circuit is minimized.

Abstract: An integrated circuit formed on a semiconductor chip includes voltage regulators for stepping down an externally-supplied power voltage to produce an internal power voltage, and internal circuits which operate based on the internal power voltage. The voltage regulators are laid in the area of the buffers and protective elements for the input/output signals and power voltages so that the overhead area due to the on-chip provision of the voltage regulators is minimized. The internal power voltage is distributed to the internal circuits through a looped main power line, with an electrode pad for connecting an external capacitor for stabilizing the internal power voltage being provided on it, so that the internal power voltage is stabilized and the power consumption of the integrated circuit is minimized.

Abstract: A semiconductor device which includes a power switch connecting an internal power supply in which power is not shut down and an internal power supply in which power is shut down, and an internal voltage determining circuit for determining the voltage of the internal power supply in which power is shut down. When the power of the internal power supply is interrupted, the power switch is turned off, the regulator circuit is turned off, and an output of the regulator circuit is shorted to a ground potential. When the power of the internal power supply is resumed, the regulator circuit is turned on, shorting is cancelled, the increased voltage of the internal power supply is determined by the internal voltage determining circuit, operation of a circuit block is started, and the switch is turned on.

Abstract: A semiconductor integrated circuit device which substantially reduces drop in a supply voltage generated by a regulator and ensures stable supply of a supply voltage with high efficiency and high accuracy. In the device, a memory power supply includes a plurality of transistors and an error amplifier. In the transistors, source pads and drain pads are alternately arranged in a row along one edge of a semiconductor chip in a peripheral area of the chip. Transistor gates are formed in parallel with the alternately arranged source pads and drain pads (so that the longitudinal direction of the gates is parallel to the direction of the arrangement of the source pads and drain pads). Consequently, the length of wirings coupled to drains and sources is shortened and the sheet resistance is decreased.