Patents by Inventor Takayasu Ito
Takayasu Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110204957Abstract: The semiconductor integrated circuit is provided, in which an external temperature control or temperature monitoring is possible, with little influence by the noise of a system board which mounts the semiconductor integrated circuit. The semiconductor integrated circuit includes the temperature detection circuit which detects the chip temperature, and the functional module which flows a large operating current. An external terminal which supplies operating voltage, and an external terminal which supplies ground voltage are coupled to the functional module. The temperature detection circuit generates a temperature detection signal and a reference signal. The reference signal and the temperature detection signal are led out to the exterior of the semiconductor integrated circuit via a first external output terminal and a second external output terminal, respectively, and are supplied to an external temperature control/monitoring circuit which has a circuitry type of a differential amplifier circuit.Type: ApplicationFiled: May 6, 2011Publication date: August 25, 2011Inventors: TADASHI KAMEYAMA, Takayasu Ito, Seiichi Saito, Koji Sato
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Patent number: 7948298Abstract: The semiconductor integrated circuit is provided, in which an external temperature control or temperature monitoring is possible, with little influence by the noise of a system board which mounts the semiconductor integrated circuit. The semiconductor integrated circuit includes the temperature detection circuit which detects the chip temperature, and the functional module which flows a large operating current. An external terminal which supplies operating voltage, and an external terminal which supplies ground voltage are coupled to the functional module. The temperature detection circuit generates a temperature detection signal and a reference signal. The reference signal and the temperature detection signal are led out to the exterior of the semiconductor integrated circuit via a first external output terminal and a second external output terminal, respectively, and are supplied to an external temperature control/monitoring circuit which has a circuitry type of a differential amplifier circuit.Type: GrantFiled: August 5, 2010Date of Patent: May 24, 2011Assignee: Renesas Electronics CorporationInventors: Tadashi Kameyama, Takayasu Ito, Seiichi Saito, Koji Sato
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Publication number: 20110090605Abstract: An integrated circuit formed on a semiconductor chip includes voltage regulators for stepping down an externally-supplied power voltage to produce an internal power voltage, and internal circuits which operate based on the internal power voltage. The voltage regulators are laid in the area of the buffers and protective elements for the input/output signals and power voltages so that the overhead area due to the on-chip provision of the voltage regulators is minimized. The internal power voltage is distributed to the internal circuits through a looped main power line, with an electrode pad for connecting an external capacitor for stabilizing the internal power voltage being provided on it, so that the internal power voltage is stabilized and the power consumption of the integrated circuit is minimized.Type: ApplicationFiled: December 23, 2010Publication date: April 21, 2011Inventors: Takayasu ITO, Mitsuru Hiraki, Koichi Ashiga
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Publication number: 20110090001Abstract: A semiconductor integrated circuit device which substantially reduces drop in a supply voltage generated by a regulator and ensures stable supply of a supply voltage with high efficiency and high accuracy. In the device, a memory power supply includes a plurality of transistors and an error amplifier. In the transistors, source pads and drain pads are alternately arranged in a row along one edge of a semiconductor chip in a peripheral area of the chip. Transistor gates are formed in parallel with the alternately arranged source pads and drain pads (so that the longitudinal direction of the gates is parallel to the direction of the arrangement of the source pads and drain pads). Consequently, the length of wirings coupled to drains and sources is shortened and the sheet resistance is decreased.Type: ApplicationFiled: December 28, 2010Publication date: April 21, 2011Applicant: RENESAS ELECTRONICS CORPORATIONInventors: Naoya ARISAKA, Takayasu ITO
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Patent number: 7881026Abstract: An integrated circuit formed on a semiconductor chip includes voltage regulators for stepping down an externally-supplied power voltage to produce an internal power voltage, and internal circuits which operate based on the internal power voltage. The voltage regulators are laid in the area of the buffers and protective elements for the input/output signals and power voltages so that the overhead area due to the on-chip provision of the voltage regulators is minimized. The internal power voltage is distributed to the internal circuits through a looped main power line, with an electrode pad for connecting an external capacitor for stabilizing the internal power voltage being provided on it, so that the internal power voltage is stabilized and the power consumption of the integrated circuit is minimized.Type: GrantFiled: October 27, 2009Date of Patent: February 1, 2011Assignees: Renesas Electronics Corporation, Hitachi Device Engineering Co., Ltd.Inventors: Takayasu Ito, Mitsuru Hiraki, Koichi Ashiga
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Patent number: 7872520Abstract: A semiconductor integrated circuit device which substantially reduces drop in a supply voltage generated by a regulator and ensures stable supply of a supply voltage with high efficiency and high accuracy. In the device, a memory power supply includes a plurality of transistors and an error amplifier. In the transistors, source pads and drain pads are alternately arranged in a row along one edge of a semiconductor chip in a peripheral area of the chip. Transistor gates are formed in parallel with the alternately arranged source pads and drain pads (so that the longitudinal direction of the gates is parallel to the direction of the arrangement of the source pads and drain pads). Consequently, the length of wirings coupled to drains and sources is shortened and the sheet resistance is decreased.Type: GrantFiled: June 1, 2009Date of Patent: January 18, 2011Assignee: Renesas Electronics CorporationInventors: Naoya Arisaka, Takayasu Ito
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Publication number: 20100327841Abstract: The present invention provides a technique for reducing current consumption in a reference voltage forming circuit without a significant increase in area while suppressing considerable degradative difference in reference voltage accuracy between a normal operation mode and a standby mode. In the standby mode, by using a clock signal fed from an oscillator circuit, the frequency-division control circuit produces an enable signal VREFON for determining ON/OFF states of the reference voltage generator circuit, the reference voltage forming circuit, and the capacitance charging regulator, and also produces a sampling/holding signal CHOLDSW for performing control so that a holding capacitor CH in a holding capacitance circuit is charged during an ON period of the reference voltage generator circuit, the reference voltage forming circuit, and the capacitance charging regulator, and so that any paths other than a leak current path are made unavailable to the holding capacitor CH during an OFF period thereof.Type: ApplicationFiled: June 8, 2010Publication date: December 30, 2010Applicant: RENESAS ELECTRONICS CORPORATIONInventors: Takayasu ITO, Mitsuru HIRAKI, Masashi HORIGUCHI
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Publication number: 20100301924Abstract: The semiconductor integrated circuit is provided, in which an external temperature control or temperature monitoring is possible, with little influence by the noise of a system board which mounts the semiconductor integrated circuit. The semiconductor integrated circuit includes the temperature detection circuit which detects the chip temperature, and the functional module which flows a large operating current. An external terminal which supplies operating voltage, and an external terminal which supplies ground voltage are coupled to the functional module. The temperature detection circuit generates a temperature detection signal and a reference signal. The reference signal and the temperature detection signal are led out to the exterior of the semiconductor integrated circuit via a first external output terminal and a second external output terminal, respectively, and are supplied to an external temperature control/monitoring circuit which has a circuitry type of a differential amplifier circuit.Type: ApplicationFiled: August 5, 2010Publication date: December 2, 2010Inventors: TADASHI KAMEYAMA, Takayasu Ito, Seiichi Saito, Koji Sato
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Patent number: 7782119Abstract: The semiconductor integrated circuit is provided, in which an external temperature control or temperature monitoring is possible, with little influence by the noise of a system board which mounts the semiconductor integrated circuit. The semiconductor integrated circuit includes the temperature detection circuit which detects the chip temperature, and the functional module which flows a large operating current. An external terminal which supplies operating voltage, and an external terminal which supplies ground voltage are coupled to the functional module. The temperature detection circuit generates a temperature detection signal and a reference signal. The reference signal and the temperature detection signal are led out to the exterior of the semiconductor integrated circuit via a first external output terminal and a second external output terminal, respectively, and are supplied to an external temperature control/monitoring circuit which has a circuitry type of a differential amplifier circuit.Type: GrantFiled: April 13, 2009Date of Patent: August 24, 2010Assignee: Renesas Technology Corp.Inventors: Tadashi Kameyama, Takayasu Ito, Seiichi Saito, Koji Sato
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Publication number: 20100045368Abstract: An integrated circuit formed on a semiconductor chip includes voltage regulators for stepping down an externally-supplied power voltage to produce an internal power voltage, and internal circuits which operate based on the internal power voltage. The voltage regulators are laid in the area of the buffers and protective elements for the input/output signals and power voltages so that the overhead area due to the on-chip provision of the voltage regulators is minimized. The internal power voltage is distributed to the internal circuits through a looped main power line, with an electrode pad for connecting an external capacitor for stabilizing the internal power voltage being provided on it, so that the internal power voltage is stabilized and the power consumption of the integrated circuit is minimized.Type: ApplicationFiled: October 27, 2009Publication date: February 25, 2010Inventors: Takayasu Ito, Mitsuru Hiraki, Koichi Ashiga
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Publication number: 20100019835Abstract: A semiconductor integrated circuit device which substantially reduces drop in a supply voltage generated by a regulator and ensures stable supply of a supply voltage with high efficiency and high accuracy. In the device, a memory power supply includes a plurality of transistors and an error amplifier. In the transistors, source pads and drain pads are alternately arranged in a row along one edge of a semiconductor chip in a peripheral area of the chip. Transistor gates are formed in parallel with the alternately arranged source pads and drain pads (so that the longitudinal direction of the gates is parallel to the direction of the arrangement of the source pads and drain pads). Consequently, the length of wirings coupled to drains and sources is shortened and the sheet resistance is decreased.Type: ApplicationFiled: June 1, 2009Publication date: January 28, 2010Applicant: RENESAS TECHNOLOGY CORP.Inventors: Naoya ARISAKA, Takayasu ITO
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Patent number: 7652863Abstract: In order to set with a high precision the value of rush current flowing in the power switch circuit at the time of turning “on” the power, the internal circuit Int_Cir of the LSI is supplied with the internal source voltage Vint from the output transistor MP1 of the regulator VReg of the power switch circuit PSWC. The power switch circuit PSWC includes a control circuit CNTRLR and a start-up circuit STC. During the initial period Tint following the turning “on” of the power supply, the start-up circuit STC controls the output transistor MP1 and reduces the primary rush current so that the output current Isup of the output transistor MP1 may represent an approximately constant increment as the time passes. The difference ?V between the internal current voltage due to the charge of load capacitance C with the output current Isup controlled by the start-up circuit STC and the current voltage Vint from the regulator VReg is set within the predetermined limit to reduce the secondary rush current.Type: GrantFiled: October 15, 2008Date of Patent: January 26, 2010Assignee: Renesas Technology Corp.Inventors: Takayasu Ito, Mitsuru Hiraki, Satoshi Baba, Kenichi Fukui
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Patent number: 7630178Abstract: An integrated circuit formed on a semiconductor chip includes voltage regulators for stepping down an externally-supplied power voltage to produce an internal power voltage, and internal circuits which operate based on the internal power voltage. The voltage regulators are laid in the area of the buffers and protective elements for the input/output signals and power voltages so that the overhead area due to the on-chip provision of the voltage regulators is minimized. The internal power voltage is distributed to the internal circuits through a looped main power line, with an electrode pad for connecting an external capacitor for stabilizing the internal power voltage being provided on it, so that the internal power voltage is stabilized and the power consumption of the integrated circuit is minimized.Type: GrantFiled: July 25, 2008Date of Patent: December 8, 2009Assignees: Renesas Technology Corp., Hitachi Device Engineering Co., Ltd.Inventors: Takayasu Ito, Mitsuru Hiraki, Koichi Ashiga
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Publication number: 20090295458Abstract: The semiconductor integrated circuit is provided, in which an external temperature control or temperature monitoring is possible, with little influence by the noise of a system board which mounts the semiconductor integrated circuit. The semiconductor integrated circuit includes the temperature detection circuit which detects the chip temperature, and the functional module which flows a large operating current. An external terminal which supplies operating voltage, and an external terminal which supplies ground voltage are coupled to the functional module. The temperature detection circuit generates a temperature detection signal and a reference signal. The reference signal and the temperature detection signal are led out to the exterior of the semiconductor integrated circuit via a first external output terminal and a second external output terminal, respectively, and are supplied to an external temperature control/monitoring circuit which has a circuitry type of a differential amplifier circuit.Type: ApplicationFiled: April 13, 2009Publication date: December 3, 2009Inventors: Tadashi KAMEYAMA, Takayasu ITO, Seiichi SAITO, Koji SATO
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Publication number: 20090039846Abstract: In order to set with a high precision the value of rush current flowing in the power switch circuit at the time of turning “on” the power, the internal circuit Int_Cir of the LSI is supplied with the internal source voltage Vint from the output transistor MP1 of the regulator VReg of the power switch circuit PSWC. The power switch circuit PSWC includes a control circuit CNTRLR and a start-up circuit STC. During the initial period Tint following the turning “on” of the power supply, the start-up circuit STC controls the output transistor MP1 and reduces the primary rush current so that the output current Isup of the output transistor MP1 may represent an approximately constant increment as the time passes. The difference ?V between the internal current voltage due to the charge of load capacitance C with the output current Isup controlled by the start-up circuit STC and the current voltage Vint from the regulator VReg is set within the predetermined limit to reduce the secondary rush current.Type: ApplicationFiled: October 15, 2008Publication date: February 12, 2009Inventors: Takayasu Ito, Mitsuru Hiraki, Satoshi Baba, Kenichi Fukui
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Publication number: 20080285185Abstract: An integrated circuit formed on a semiconductor chip includes voltage regulators for stepping down an externally-supplied power voltage to produce an internal power voltage, and internal circuits which operate based on the internal power voltage. The voltage regulators are laid in the area of the buffers and protective elements for the input/output signals and power voltages so that the overhead area due to the on-chip provision of the voltage regulators is minimized. The internal power voltage is distributed to the internal circuits through a looped main power line, with an electrode pad for connecting an external capacitor for stabilizing the internal power voltage being provided on it, so that the internal power voltage is stabilized and the power consumption of the integrated circuit is minimized.Type: ApplicationFiled: July 25, 2008Publication date: November 20, 2008Inventors: TAKAYASU ITO, Mitsuru Hiraki, Koichi Ashiga
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Patent number: 7450361Abstract: In order to set with a high precision the value of rush current flowing in the power switch circuit at the time of turning “on” the power, the internal circuit Int_Cir of the LSI is supplied with the internal source voltage Vint from the output transistor MP1 of the regulator VReg of the power switch circuit PSWC. The power switch circuit PSWC includes a control circuit CNTRLR and a start-up circuit STC. During the initial period Tint following the turning “on” of the power supply, the start-up circuit STC controls the output transistor MP1 and reduces the primary rush current so that the output current Isup of the output transistor MP1 may represent an approximately constant increment as the time passes. The difference ?V between the internal current voltage due to the charge of load capacitance C with the output current Isup controlled by the start-up circuit STC and the current voltage Vint from the regulator VReg is set within the predetermined limit to reduce the secondary rush current.Type: GrantFiled: November 30, 2006Date of Patent: November 11, 2008Assignee: Renesas Technology Corp.Inventors: Takayasu Ito, Mitsuru Hiraki, Satoshi Baba, Kenichi Fukui
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Publication number: 20080228414Abstract: The present invention provides a semiconductor device capable of realizing power saving and improvement in reliability or reduction in area. A semiconductor device includes: a power switch connecting an internal power supply in which power is not shut down and an internal power supply in which power is shut down; and an internal voltage determining circuit for determining voltage of the internal power supply in which power is shut down. Voltage of the internal power supply in which power is shut down is generated from voltage of an external power supply by using a regulator circuit. When the power of the internal power supply is interrupted, the power switch is turned off, the regulator circuit is turned off, and an output of the regulator circuit is shorted to a ground potential.Type: ApplicationFiled: May 18, 2008Publication date: September 18, 2008Inventors: Takayasu ITO, Mitsuru Hiraki, Masashi Horiguchi, Toyohiro Shimogawa
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Patent number: 7417838Abstract: An integrated circuit formed on a semiconductor chip includes voltage regulators for stepping down an externally-supplied power voltage to produce an internal power voltage, and internal circuits which operate based on the internal power voltage. The voltage regulators are laid in the area of the buffers and protective elements for the input/output signals and power voltages so that the overhead area due to the on-chip provision of the voltage regulators is minimized. The internal power voltage is distributed to the internal circuits through a looped main power line, with an electrode pad for connecting an external capacitor for stabilizing the internal power voltage being provided on it, so that the internal power voltage is stabilized and the power consumption of the integrated circuit is minimized.Type: GrantFiled: December 29, 2006Date of Patent: August 26, 2008Assignees: Renesas Technology Corp., Hitachi Device Engineering Co., Ltd.Inventors: Takayasu Ito, Mitsuru Hiraki, Koichi Ashiga
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Semiconductor integrated circuit with selectable power supply according to different operation modes
Patent number: RE41270Abstract: For an internal circuit having a first operation mode consuming a first operational current and a second operation mode consuming a second operational current, which is smaller than the first operational current, a first power source regulator for stepping down a predefined output power supply voltage from an input power supply voltage and having a current supply ability corresponding to the first operational current of the internal circuit and a second power source gulator having a current supply ability corresponding to the second operational current are combined in order to, under the control of a power supply control unit, operate the first step-down type regulator in response to a first control signal instructing the first operation mode in the internal circuit and to operate the second step-down type regulator in response to a second control signal instructing the second operation mode.Type: GrantFiled: December 28, 2006Date of Patent: April 27, 2010Assignee: Renesas Technology Corp.Inventors: Mitsuru Hiraki, Takayasu Ito