Patents by Inventor Takayuki Hayashizaki

Takayuki Hayashizaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11378591
    Abstract: An electrical connection device includes: a wiring board in which lands are arranged on a main surface; and probes. Each of the probes has a distal end portion that contacts an object to be measured and a proximal end portion that contacts the land. A material of a surface film of the proximal end portion, which contacts the land, is a metal material different in composition from a material of the land that contacts the surface film.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: July 5, 2022
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Kenichi Tsuruta, Takayuki Hayashizaki, Koichiro Tokumaru, Miyuki Tomooka
  • Publication number: 20220146553
    Abstract: An electrical connecting device (1) includes probes (10), and a probe head (20) including a middle guide plate (23) arranged between a top guide plate (21) and a bottom guide plate (22) and closer to the bottom guide plate (22) so as to lead the probes (10) to penetrate therethrough. The top guide plate (21) and the middle guide plate (23) are provided with guide holes through which the probes (10) are inserted at positions shifted between the top guide plate (21) and the middle guide plate (23) so as to lead the probes (10) to be held in a bent state between the top guide plate (21) and the middle guide plate (23). The probes (10) have a structure easier to bend at a region excluding a maximum stress part than at the maximum stress part defined at a position at which a maximum stress is applied to the probes (10) buckled when tip end parts of the probes (10) are brought into contact with an inspection object.
    Type: Application
    Filed: February 27, 2020
    Publication date: May 12, 2022
    Inventors: Takayuki HAYASHIZAKI, Akihisa AKAHIRA, Hisao NARITA, Mizuho KON, Kenichi SUTO
  • Publication number: 20210140999
    Abstract: An electrical connection device includes: a wiring board in which lands are arranged on a main surface; and probes. Each of the probes has a distal end portion that contacts an object to be measured and a proximal end portion that contacts the land. A material of a surface film of the proximal end portion, which contacts the land, is a metal material different in composition from a material of the land that contacts the surface film.
    Type: Application
    Filed: November 5, 2020
    Publication date: May 13, 2021
    Inventors: Kenichi TSURUTA, Takayuki HAYASHIZAKI, Koichiro TOKUMARU, Miyuki TOMOOKA
  • Patent number: 10859599
    Abstract: An electrical connection device includes: a probe (10); and a probe head (20) including a top portion (21) allowing penetration of the probe (10), a bottom portion (23) disposed closer to a distal end portion than the top portion (21) and allowing penetration of the probe (10), and an upper guide portion (24) and a lower guide portion (25), which are disposed between the top portion (21) and the bottom portion (23) and allow penetration of the probe (10), wherein the probe (10) is held in a curved state between the top portion (21) and the bottom portion (23), the probe (10) buckles by contact of the distal end portion with an inspection object (2), and at least a continuous portion of the probe (10), which ranges from a portion where the probe (10) in a buckling state penetrates the bottom portion (23) to a portion where the probe (10) penetrates the lower guide portion (25), is a high-rigidity portion (101) made to have higher rigidity than a buckling portion of the probe (10).
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: December 8, 2020
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Takayuki Hayashizaki, Hisao Narita
  • Patent number: 10768207
    Abstract: An electrical connection device includes: a probe head (20) including a guide hole (200), in which a shape perpendicular to an extending direction of the guide hole (200) is a shape formed by round-chamfering corner portions of a polygonal shape; and a probe (10) held by the probe head (20) in a state of penetrating the guide hole (200), wherein notches which go along an axial direction of the probe (10) are formed on angle regions of the probe (10), the angle regions facing the corner portions (200C) of the guide hole (200).
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: September 8, 2020
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventor: Takayuki Hayashizaki
  • Publication number: 20200158754
    Abstract: An electrical connection device includes: a probe (10); and a probe head (20) including a top portion (21) allowing penetration of the probe (10), a bottom portion (23) disposed closer to a distal end portion than the top portion (21) and allowing penetration of the probe (10), and an upper guide portion (24) and a lower guide portion (25), which are disposed between the top portion (21) and the bottom portion (23) and allow penetration of the probe (10), wherein the probe (10) is held in a curved state between the top portion (21) and the bottom portion (23), the probe (10) buckles by contact of the distal end portion with an inspection object (2), and at least a continuous portion of the probe (10), which ranges from a portion where the probe (10) in a buckling state penetrates the bottom portion (23) to a portion where the probe (10) penetrates the lower guide portion (25), is a high-rigidity portion (101) made to have higher rigidity than a buckling portion of the probe (10).
    Type: Application
    Filed: April 3, 2018
    Publication date: May 21, 2020
    Inventors: Takayuki HAYASHIZAKI, Hisao NARITA
  • Publication number: 20200124639
    Abstract: An electrical connection device includes: a probe head (20) including a guide hole (200), in which a shape perpendicular to an extending direction of the guide hole (200) is a shape formed by round-chamfering corner portions of a polygonal shape; and a probe (10) held by the probe head (20) in a state of penetrating the guide hole (200), wherein notches which go along an axial direction of the probe (10) are formed on angle regions of the probe (10), the angle regions facing the corner portions (200C) of the guide hole (200).
    Type: Application
    Filed: April 3, 2018
    Publication date: April 23, 2020
    Inventor: Takayuki HAYASHIZAKI
  • Patent number: 9435854
    Abstract: An electrical contactor has a contact portion that is pressed onto a terminal of an electronic device and is electrically connected. When the dimension of the contact portion is S1, the contact dimension of the contact portion and the terminal of the electronic device is V, the amount of sliding of the contact portion is W, and the additional element including at least positional accuracy of the contact portion is X, the dimension of the contact portion S1 satisfies S1>V+W+X. In a contact method for the electrical contactor, when the sum of a clearance on the front end side in the sliding direction in starting contact and a clearance on the back end side in the sliding direction in ending contact is X3, the crushed area S2 of the terminal is set to satisfy a relationship of S2<S1?X3.
    Type: Grant
    Filed: June 11, 2013
    Date of Patent: September 6, 2016
    Assignee: KABUSHIKI KAISHA NIHON MICRONICS
    Inventors: Mika Nasu, Akihiro Karouji, Takayuki Hayashizaki
  • Patent number: 8975908
    Abstract: An embodiment disperses a force acting on a border portion between an extending portion and a pedestal portion or a reinforcing member to prevent breakage of a probe tip portion of a probe. An electrical test probe includes a probe main body, a recess provided at an end of the main body and having an inner surface, and a probe tip having a part received in the recess. The inner surface has a central area and two lateral areas on both sides of the central area, and the part of the probe tip is located at the central area and at least at either one of the lateral areas.
    Type: Grant
    Filed: September 16, 2011
    Date of Patent: March 10, 2015
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Takayuki Hayashizaki, Akira Soma, Hideki Hirakawa
  • Publication number: 20140009182
    Abstract: An electrical contactor has a contact portion that is pressed onto a terminal of an electronic device and is electrically connected. When the dimension of the contact portion is S1, the contact dimension of the contact portion and the terminal of the electronic device is V, the amount of sliding of the contact portion is W, and the additional element including at least positional accuracy of the contact portion is X, the dimension of the contact portion S1 satisfies S1>V+W+X. In a contact method for the electrical contactor, when the sum of a clearance on the front end side in the sliding direction in starting contact and a clearance on the back end side in the sliding direction in ending contact is X3, the crushed area S2 of the terminal is set to satisfy a relationship of S2<S1?X3.
    Type: Application
    Filed: June 11, 2013
    Publication date: January 9, 2014
    Inventors: Mika NASU, Akihiro KAROUJI, Takayuki HAYASHIZAKI
  • Publication number: 20120068726
    Abstract: An embodiment disperses a force acting on a border portion between an extending portion and a pedestal portion or a reinforcing member to prevent breakage of a probe tip portion of a probe. An electrical test probe includes a probe main body, a recess provided at an end of the main body and having an inner surface, and a probe tip having a part received in the recess. The inner surface has a central area and two lateral areas on both sides of the central area, and the part of the probe tip is located at the central area and at least at either one of the lateral areas.
    Type: Application
    Filed: September 16, 2011
    Publication date: March 22, 2012
    Applicant: KABUSHIKI KAISHA NIHON MICRONICS
    Inventors: Takayuki HAYASHIZAKI, Akira SOMA, Hideki HIRAKAWA
  • Patent number: 8063651
    Abstract: A contact for an electrical test comprises a first area to be bonded to a board, a second area extending in the right-left direction from the lower end portion of the first area, a third area projecting downward from the tip end portion of the second area, and a low light reflective film having lower light reflectance than that of the first area. The third area has a probe tip to be contacted an electrode of an electronic device. The low light reflective film is formed on a surface of at least the bonding part of the first area to the board and its proximity.
    Type: Grant
    Filed: April 3, 2009
    Date of Patent: November 22, 2011
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Shoji Kamata, Tomoya Sato, Toshinaga Takeya, Takayuki Hayashizaki
  • Patent number: 7888958
    Abstract: A probe for current test is provided. The probe includes a probe body having a plate-like connection portion whose end face becomes a connection face to a probe board, a solder layer formed on at least one side face of said connection portion, and a guide portion formed on the connection portion. The guide portion penetrates the connection portion in its thickness direction from the one side face with the solder layer formed to the other side face. When the solder layer is melted, the guide portion guides a portion of the melted solder to the other side face.
    Type: Grant
    Filed: January 25, 2006
    Date of Patent: February 15, 2011
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Akira Souma, Yoshikazu Urushiyama, Masahisa Tazawa, Tomoya Sato, Hideki Hirakawa, Takayuki Hayashizaki
  • Patent number: 7862733
    Abstract: The present invention provides a probe manufacturing method in which, after a metal material for a probe is deposited on a base table, the probe can be detached from the base table relatively easily. A sacrificial layer is formed on a base table. The sacrificial layer is partially removed so as to form a recess in the sacrificial layer. A mask that exposes an area formed in a desired probe flat surface shape containing the recess is formed on the sacrificial layer. A probe material exhibiting different etching resistance characteristics from those of the sacrificial layer is deposited in the area exposed from the mask. By the deposition of the material, a coupling portion corresponding to the recess and a probe that is integral with the coupling portion are formed. After the mask is removed, the sacrificial layer is removed with use of etchant. Thereafter, the probe held on the base table at the coupling portion is detached from the base table together with the coupling portion.
    Type: Grant
    Filed: December 19, 2007
    Date of Patent: January 4, 2011
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Takayuki Hayashizaki, Hideki Hirakawa, Akira Soma, Kazuhito Hamada
  • Patent number: 7816931
    Abstract: A contact comprises a contact body at least provided with an arm region extending in the right-left direction, and a tip region extending downward from the front end portion of the arm region. The tip region is provided with a pedestal portion integrally continuous to the lower edge portion on the front end side of the arm region, and a contact portion projecting downward from the lower end portion of the pedestal portion and having a tip to be brought into contact with an electrode of a device under test at the lower end. The pedestal portion includes an underside region having at least four inclined faces located around the contact portion when the tip region is seen from below, and inclined such that a portion closer to the side of the contact portion becomes lower.
    Type: Grant
    Filed: February 18, 2009
    Date of Patent: October 19, 2010
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Hideki Hirakawa, Takayuki Hayashizaki, Akira Soma, Yuko Yamada
  • Publication number: 20100213956
    Abstract: A probe for current test comprising: a probe body having a plate-like connection portion whose end face becomes a connection face to a probe board; a solder layer formed on at least one side face of said connection portion; and a guide portion formed on the connection portion, penetrating the connection portion in its thickness direction from the one side face with the solder layer formed to the other side face, and when the solder layer is melted, capable of guiding a portion thereof to the other side face.
    Type: Application
    Filed: January 25, 2006
    Publication date: August 26, 2010
    Applicant: KABUSHIKI KAISHA NIHON MICRONICS
    Inventors: Akira Souma, Yoshikazu Urushiyama, Masahisa Tazawa, Tomoya Sato, Hideki Hirakawa, Takayuki Hayashizaki
  • Patent number: 7736690
    Abstract: A probe tip section of an electrical test probe has a laminated structure consisting of a first deposition portion and a second deposition portion covering the first deposition portion, and by the laminated structure, a maximum cross-sectional area portion at which the cross-sectional area of the probe tip section is increased to a base portion is provided between a tip end of the probe tip section and the base portion in the probe tip section. At the maximum cross-sectional area portion, a dimension in the X direction as seen on a flat surface perpendicular to a protruding direction of the probe tip section is increased in a one-dimensional way, and in addition, a dimension in the Y direction perpendicular to the X direction is increased from the tip end toward the base portion, as a result of which the cross-sectional area of the probe tip section can be increased in a two-dimensional way.
    Type: Grant
    Filed: January 21, 2008
    Date of Patent: June 15, 2010
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Hideki Hirakawa, Yuko Yamada, Yosuke Yoshizawa, Takayuki Hayashizaki, Akira Soma, Shinji Kuniyoshi
  • Patent number: 7721429
    Abstract: A probe formed on a base table is detached from the base table without giving damage on the probe. The present invention provides a probe manufacturing method comprising the steps of forming on a sacrificial layer on a base table a recess exposing the sacrificial layer with a resist, depositing a probe material in the recess to form a probe and then removing the resist, leaving part of the sacrificial layer and removing the rest by an etching process, and detaching from the base table the probe held on the base table by the remaining part of the sacrificial layer. In the recess of the resist are formed a main body part corresponding to a flat surface shape of the probe and an auxiliary part continuing into the main body part. The probe is formed by deposition of the material at the main body part, and a holding portion is formed by deposition of the material at the auxiliary part.
    Type: Grant
    Filed: January 21, 2008
    Date of Patent: May 25, 2010
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Akira Soma, Takayuki Hayashizaki, Yosuke Yoshizawa, Hideki Hirakawa
  • Patent number: 7679389
    Abstract: A probe includes an arm region extending in the back and forth direction, and a tip region extending downward from the front end portion of the arm region. The tip region has a pedestal portion integrally continuous to a lower edge portion at the front end side of the arm region and having an underside inclined to an imaginary axis extending in the vertical direction; and a contact portion projected from the underside of the pedestal portion and having a tip orthogonal to an imaginary axis. Thus, the position of the tip can be accurately determined.
    Type: Grant
    Filed: March 7, 2005
    Date of Patent: March 16, 2010
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Shinji Kuniyoshi, Hideki Hirakawa, Akira Soma, Takayuki Hayashizaki
  • Patent number: 7629807
    Abstract: A probe for electrical test comprises a plate-shaped main portion having a base end to be attached to a support board and a tip end opposite the base end, and a probe tip portion arranged at the tip end of the main portion and having a probe tip to contact an electrode of a device under test, the main portion being made of a tenacity material. The main portion includes a conductive material extending from the base end to the tip end and at least part of which is buried within the tenacity material, and the tenacity material has higher resiliency than that of the conductive material while the conductive material has higher conductivity than that of the tenacity material. As a result, disorder of a signal provided via the probe is decreased without losing elastic deformation.
    Type: Grant
    Filed: August 9, 2005
    Date of Patent: December 8, 2009
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Hideki Hirakawa, Akira Soma, Takayuki Hayashizaki, Shinji Kuniyoshi, Masahisa Tazawa