Abstract: A fault current is removed at a higher speed. A high-speed introduction device includes: a connection chamber provided in an insulative container; a first electrode and a second electrode disposed to be electrically separated from each other in the connection chamber at least before an introduction operation, each of the first electrode and the second electrode being composed of a conductive material; and an injector to inject at least one of a charged particle and a conductive particle, the injector communicating with the connection chamber, wherein when the introduction operation is started, the injector injects at least one of the charged particle and the conductive particle into the connection chamber.

Abstract: An object of the present disclosure is to provide a switchgear that reduces a cost of periodic replacement of a drive unit and ensures reliability. A switchgear of the present disclosure includes a fixed electrode, a movable electrode provided to face the fixed electrode, the movable electrode being contactable with and separable from the fixed electrode, a piston provided opposite to the fixed electrode to drive the movable electrode via a movable shaft connected to the movable electrode, a container to accommodate the piston, and an arc generation mechanism bridging including metal and provided in the container at a position opposite to the fixed electrode, the arc generation mechanism bridging a terminal unit connected to an external circuit, the arc generation mechanism bridging opening a circuit with the terminal unit when energized to generate an arc at an opened portion.

Abstract: An optical unit for a laser processing system includes a laser diode including a plurality of laser emitters which emit laser light, a lens unit including a plurality of lenses, a holding block having a light-transmitting property, and a light-shielding film. The holding block and the laser diode are bonded to each other with a first adhesive, and the lens unit and the holding block are bonded to each other with a second adhesive. The light-shielding film is located between the lens unit and the holding block.

Abstract: An optical unit for a laser processing system includes a laser diode including a plurality of laser emitters which emit laser light, a lens unit including a plurality of lenses, a holding block having a light-transmitting property, and a light-shielding film. The holding block and the laser diode are bonded to each other with a first adhesive, and the lens unit and the holding block are bonded to each other with a second adhesive. The light-shielding film is located between the lens unit and the holding block.

Abstract: A rolling bearing has an inner ring attached to a rotating shaft out of contact with a first end surface, and an outer ring is fitted onto an inner peripheral surface of a housing in contact with the first end surface. A sliding element is provided between a second end surface and the first end surface. A retaining portion is provided between the sliding element and the first end surface. A biasing portion is provided between the retaining portion and the first end surface to bias the retaining portion toward a second side in a lamination direction. The rotating shaft, the housing, the inner ring, the outer ring, a rolling element, the sliding element, the retaining portion, and the biasing portion are formed of a conductive material. The rotating shaft and the housing are electrically connected by the sliding element, the retaining portion, and the biasing portion.

Abstract: The present technology relates to a circuit substrate, an image sensor, and an electronic apparatus that are capable of suppressing generation of noise in a conductor loop, which is caused due to a change in the conductor loop. A circuit substrate according to the present technology includes a circuit that is formed of a conductor and is capable of forming a conductor loop, at least a part of the dimensions of the conductor loop being variable; and a plurality of conductors that are each formed at a position where an induced electromotive force is generated in the conductor loop by a magnetic field and each have a structure that suppresses a change in the induced electromotive force generated by a change in dimensions of the conductor loop, the magnetic field being generated by the plurality of conductors. The present technology is applicable to, for example, an image sensor and an electronic apparatus.

Abstract: A core segment formed by laminating electrical steel sheets, a coupling hole having a lamination direction as its depth is formed in a portion of a yoke piece on a third side in a circumferential direction. An insulator includes a coupling pin protruding toward a second side in the lamination direction, at a portion of a first covering portion on a fourth side. A stator core formed by coupling core segments in a ring shape where the coupling pin of the insulator mounted on the core segment that is to the third side is inserted in the coupling hole of the core segment that is to the fourth side, and where a side surface on the fourth side of the yoke piece being to the third side and a side surface on the third side of the yoke piece being to the fourth side are in contact with each other.

Abstract: A rolling bearing has an inner ring attached to a rotating shaft out of contact with a first end surface, and an outer ring is fitted onto an inner peripheral surface of a housing in contact with the first end surface. A sliding element is provided between a second end surface and the first end surface. A retaining portion is provided between the sliding element and the first end surface. A biasing portion is provided between the retaining portion and the first end surface to bias the retaining portion toward a second side in a lamination direction. The rotating shaft, the housing, the inner ring, the outer ring, a rolling element, the sliding element, the retaining portion, and the biasing portion are formed of a conductive material. The rotating shaft and the housing are electrically connected by the sliding element, the retaining portion, and the biasing portion.

Abstract: The present technology relates to a circuit substrate, an image sensor, and an electronic apparatus that are capable of suppressing generation of noise in a conductor loop, which is caused due to a change in the conductor loop. A circuit substrate according to the present technology includes a circuit that is formed of a conductor and is capable of forming a conductor loop, at least a part of the dimensions of the conductor loop being variable; and a plurality of conductors that are each formed at a position where an induced electromotive force is generated in the conductor loop by a magnetic field and each have a structure that suppresses a change in the induced electromotive force generated by a change in dimensions of the conductor loop, the magnetic field being generated by the plurality of conductors. The present technology is applicable to, for example, an image sensor and an electronic apparatus.

Abstract: A semiconductor device includes a second oxide film and a pad electrode on a first oxide film that is formed on a front surface of a semiconductor substrate, a contact electrode and a first barrier layer formed in the second oxide film and connected to the pad electrode, a silicide portion formed between the contact electrode and a through-hole electrode layer and connected to the contact electrode and the first barrier layer, a via hole extending from a back surface of the semiconductor substrate to reach the silicide portion and the second oxide film, a third oxide film formed on a sidewall of the via hole and on the back surface of the semiconductor substrate, and a second barrier layer (H) and a rewiring layer formed inside the via hole and on the back surface of the semiconductor substrate and connected to the silicide portion.

Abstract: A digital circuit portion (6) and an analog circuit portion (7) are formed in a surface portion of a semiconductor substrate (4). A via (20) is formed in a region between the digital circuit portion (6) and the analog circuit portion (7). The via (20) extends through the semiconductor substrate (4) from a front surface to a back surface thereof, and is made of a dielectric (2) having its surface covered by a metal (1). The metal (1) is grounded. Signal interference between the analog circuit portion (6) and the digital circuit portion (7) is reduced by the via (20).

Abstract: A fin-semiconductor region (13) is formed on a substrate (11). A first impurity which produces a donor level or an acceptor level in a semiconductor is introduced in an upper portion and side portions of the fin-semiconductor region (13), and oxygen or nitrogen is further introduced as a second impurity in the upper portion and side portions of the fin-semiconductor region (13).

Abstract: In a semiconductor device having a through-hole electrode and a manufacturing method thereof, a dummy groove hole portion for forming insulating portion insulating wirings from each other is provided, to surround a rewiring layer including a through-hole electrode on a back surface of a semiconductor substrate. This allows the wirings to be insulated from each other just by removing the metal layer existing at a bottom portion of the dummy groove hole portion. Thus, a reduction in the processing time can be realized.

Abstract: A base conductive member is formed on a surface and in a hole section of a substrate, and a resist is formed on a part of the base conductive member in which a conductive layer is not to be formed. The conductive layer is formed on a part except for the part in which the resist has been formed, and a mask metal is formed on the conductive layer. Then, the resist is removed, and the base conductive member is etched using the mask metal as a mask to form the conductive layer into a predetermined shape.

Abstract: A semiconductor device includes a second oxide film and a pad electrode on a first oxide film that is formed on a front surface of a semiconductor substrate, a contact electrode and a first barrier layer formed in the second oxide film and connected to the pad electrode, a silicide portion formed between the contact electrode and a through-hole electrode layer and connected to the contact electrode and the first barrier layer, a via hole extending from a back surface of the semiconductor substrate to reach the silicide portion and the second oxide film, a third oxide film formed on a sidewall of the via hole and on the back surface of the semiconductor substrate, and a second barrier layer and a rewiring layer formed inside the via hole and on the back surface of the semiconductor substrate and connected to the silicide portion.

Abstract: To provide an arrangement structure of a sound system in a motorcycle which can ensure the operability of a sound operation unit while ensuring the visibility of a meter. In a motorcycle which arranges a meter indicating information on a vehicle and a sound operation unit for providing a reproduction operation or the like in a sound system in the vicinity of a steering portion, the meter and the sound operation unit are constituted as bodies separate from each other. The meter and the sound operation unit are arranged, as viewed in the axial direction of a head pipe which supports a steering portion, in front of and behind the head pipe.

Abstract: An acceleration sensor includes a weight; a base portion, a beam; and a piezo resistance element. The weight is arranged to displace upon receiving acceleration. The base portion is disposed around the weight apart from the weight. The beam has one end portion connected to the weight and the other end portion connected to the base portion. The beam also has a thick layer portion and a thin layer portion having a thickness smaller than that of the thick layer portion. The piezo resistance element is disposed over the thick layer portion and the thin layer portion.

Abstract: A digital circuit portion (6) and an analog circuit portion (7) are formed in a surface portion of a semiconductor substrate (4). A via (20) is formed in a region between the digital circuit portion (6) and the analog circuit portion (7). The via (20) extends through the semiconductor substrate (4) from a front surface to a back surface thereof, and is made of a dielectric (2) having its surface covered by a metal (1). The metal (1) is grounded. Signal interference between the analog circuit portion (6) and the digital circuit portion (7) is reduced by the via (20).

Abstract: An electrode on a first surface of a semiconductor substrate and a second surface of the semiconductor substrate are connected with each other by a through electrode. A through hole is formed through the semiconductor substrate from the second surface of the semiconductor substrate to an interlayer insulating film on the first surface, and an insulating film is formed on a side surface and a bottom surface of the through hole as well as on the second surface of the semiconductor substrate, so that by simultaneously etching the insulating film on the bottom surface of the through hole and the interlayer insulating film, thus formed, the through hole is formed so as to reach the electrode on the first surface of the semiconductor substrate.

Abstract: A fin-semiconductor region (13) is formed on a substrate (11). A first impurity which produces a donor level or an acceptor level in a semiconductor is introduced in an upper portion and side portions of the fin-semiconductor region (13), and oxygen or nitrogen is further introduced as a second impurity in the upper portion and side portions of the fin-semiconductor region (13).