Patents by Inventor Takayuki Kai

Takayuki Kai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210231933
    Abstract: An optical unit for a laser processing system includes a laser diode including a plurality of laser emitters which emit laser light, a lens unit including a plurality of lenses, a holding block having a light-transmitting property, and a light-shielding film. The holding block and the laser diode are bonded to each other with a first adhesive, and the lens unit and the holding block are bonded to each other with a second adhesive. The light-shielding film is located between the lens unit and the holding block.
    Type: Application
    Filed: November 11, 2020
    Publication date: July 29, 2021
    Inventors: TAKAYUKI KAI, KOUKI ICHIHASHI
  • Patent number: 10218243
    Abstract: A rolling bearing has an inner ring attached to a rotating shaft out of contact with a first end surface, and an outer ring is fitted onto an inner peripheral surface of a housing in contact with the first end surface. A sliding element is provided between a second end surface and the first end surface. A retaining portion is provided between the sliding element and the first end surface. A biasing portion is provided between the retaining portion and the first end surface to bias the retaining portion toward a second side in a lamination direction. The rotating shaft, the housing, the inner ring, the outer ring, a rolling element, the sliding element, the retaining portion, and the biasing portion are formed of a conductive material. The rotating shaft and the housing are electrically connected by the sliding element, the retaining portion, and the biasing portion.
    Type: Grant
    Filed: August 10, 2015
    Date of Patent: February 26, 2019
    Assignee: TOP CO., LTD.
    Inventors: Takayuki Kai, Kenji Sasaki, Hiroaki Asakura
  • Patent number: 10211248
    Abstract: The present technology relates to a circuit substrate, an image sensor, and an electronic apparatus that are capable of suppressing generation of noise in a conductor loop, which is caused due to a change in the conductor loop. A circuit substrate according to the present technology includes a circuit that is formed of a conductor and is capable of forming a conductor loop, at least a part of the dimensions of the conductor loop being variable; and a plurality of conductors that are each formed at a position where an induced electromotive force is generated in the conductor loop by a magnetic field and each have a structure that suppresses a change in the induced electromotive force generated by a change in dimensions of the conductor loop, the magnetic field being generated by the plurality of conductors. The present technology is applicable to, for example, an image sensor and an electronic apparatus.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: February 19, 2019
    Assignee: Sony Corporation
    Inventors: Kenichi Shigenami, Takayuki Kai, Natsuhiro Aota, Atsushi Muto, Yoshiyuki Akiyama, Takashi Miyamoto, Takayuki Sekihara, Tomohiro Takahashi
  • Publication number: 20170201135
    Abstract: A core segment formed by laminating electrical steel sheets, a coupling hole having a lamination direction as its depth is formed in a portion of a yoke piece on a third side in a circumferential direction. An insulator includes a coupling pin protruding toward a second side in the lamination direction, at a portion of a first covering portion on a fourth side. A stator core formed by coupling core segments in a ring shape where the coupling pin of the insulator mounted on the core segment that is to the third side is inserted in the coupling hole of the core segment that is to the fourth side, and where a side surface on the fourth side of the yoke piece being to the third side and a side surface on the third side of the yoke piece being to the fourth side are in contact with each other.
    Type: Application
    Filed: June 29, 2015
    Publication date: July 13, 2017
    Applicant: TOP CO., LTD.
    Inventors: Takayuki KAI, Kenji SASAKI, Hiroaki ASAKURA
  • Publication number: 20170187262
    Abstract: A rolling bearing has an inner ring attached to a rotating shaft out of contact with a first end surface, and an outer ring is fitted onto an inner peripheral surface of a housing in contact with the first end surface. A sliding element is provided between a second end surface and the first end surface. A retaining portion is provided between the sliding element and the first end surface. A biasing portion is provided between the retaining portion and the first end surface to bias the retaining portion toward a second side in a lamination direction. The rotating shaft, the housing, the inner ring, the outer ring, a rolling element, the sliding element, the retaining portion, and the biasing portion are formed of a conductive material. The rotating shaft and the housing are electrically connected by the sliding element, the retaining portion, and the biasing portion.
    Type: Application
    Filed: August 10, 2015
    Publication date: June 29, 2017
    Applicant: TOP CO., LTD.
    Inventors: Takayuki KAI, Kenji SASAKI, Hiroaki ASAKURA
  • Publication number: 20170133425
    Abstract: The present technology relates to a circuit substrate, an image sensor, and an electronic apparatus that are capable of suppressing generation of noise in a conductor loop, which is caused due to a change in the conductor loop. A circuit substrate according to the present technology includes a circuit that is formed of a conductor and is capable of forming a conductor loop, at least a part of the dimensions of the conductor loop being variable; and a plurality of conductors that are each formed at a position where an induced electromotive force is generated in the conductor loop by a magnetic field and each have a structure that suppresses a change in the induced electromotive force generated by a change in dimensions of the conductor loop, the magnetic field being generated by the plurality of conductors. The present technology is applicable to, for example, an image sensor and an electronic apparatus.
    Type: Application
    Filed: June 16, 2015
    Publication date: May 11, 2017
    Inventors: Kenichi SHIGENAMI, Takayuki KAI, Natsuhiro AOTA, Atsushi MUTO, Yoshiyuki AKIYAMA, Takashi MIYAMOTO, Takayuki SEKIHARA, Tomohiro TAKAHASHI
  • Patent number: 8471367
    Abstract: A semiconductor device includes a second oxide film and a pad electrode on a first oxide film that is formed on a front surface of a semiconductor substrate, a contact electrode and a first barrier layer formed in the second oxide film and connected to the pad electrode, a silicide portion formed between the contact electrode and a through-hole electrode layer and connected to the contact electrode and the first barrier layer, a via hole extending from a back surface of the semiconductor substrate to reach the silicide portion and the second oxide film, a third oxide film formed on a sidewall of the via hole and on the back surface of the semiconductor substrate, and a second barrier layer (H) and a rewiring layer formed inside the via hole and on the back surface of the semiconductor substrate and connected to the silicide portion.
    Type: Grant
    Filed: November 1, 2010
    Date of Patent: June 25, 2013
    Assignee: Panasonic Corporation
    Inventors: Daishiro Saito, Takayuki Kai, Takafumi Okuma, Hitoshi Yamanishi
  • Patent number: 8450836
    Abstract: A digital circuit portion (6) and an analog circuit portion (7) are formed in a surface portion of a semiconductor substrate (4). A via (20) is formed in a region between the digital circuit portion (6) and the analog circuit portion (7). The via (20) extends through the semiconductor substrate (4) from a front surface to a back surface thereof, and is made of a dielectric (2) having its surface covered by a metal (1). The metal (1) is grounded. Signal interference between the analog circuit portion (6) and the digital circuit portion (7) is reduced by the via (20).
    Type: Grant
    Filed: July 12, 2011
    Date of Patent: May 28, 2013
    Assignee: Panasonic Corporation
    Inventors: Shinichiro Uemura, Yukio Hiraoka, Takayuki Kai
  • Patent number: 8324685
    Abstract: A fin-semiconductor region (13) is formed on a substrate (11). A first impurity which produces a donor level or an acceptor level in a semiconductor is introduced in an upper portion and side portions of the fin-semiconductor region (13), and oxygen or nitrogen is further introduced as a second impurity in the upper portion and side portions of the fin-semiconductor region (13).
    Type: Grant
    Filed: January 20, 2010
    Date of Patent: December 4, 2012
    Assignee: Panasonic Corporation
    Inventors: Tomohiro Okumura, Takayuki Kai, Yuichiro Sasaki
  • Publication number: 20120119384
    Abstract: In a semiconductor device having a through-hole electrode and a manufacturing method thereof, a dummy groove hole portion for forming insulating portion insulating wirings from each other is provided, to surround a rewiring layer including a through-hole electrode on a back surface of a semiconductor substrate. This allows the wirings to be insulated from each other just by removing the metal layer existing at a bottom portion of the dummy groove hole portion. Thus, a reduction in the processing time can be realized.
    Type: Application
    Filed: March 28, 2011
    Publication date: May 17, 2012
    Applicant: PANASONIC CORPORATION
    Inventors: Yoshimasa Takii, Takayuki Kai, Daishiro Saito, Takafumi Okuma
  • Publication number: 20120115323
    Abstract: A base conductive member is formed on a surface and in a hole section of a substrate, and a resist is formed on a part of the base conductive member in which a conductive layer is not to be formed. The conductive layer is formed on a part except for the part in which the resist has been formed, and a mask metal is formed on the conductive layer. Then, the resist is removed, and the base conductive member is etched using the mask metal as a mask to form the conductive layer into a predetermined shape.
    Type: Application
    Filed: February 17, 2011
    Publication date: May 10, 2012
    Inventors: Isao Muragishi, Takayuki Kai, Daishiro Saito, Daisuke Yamamoto, Takeshi Koiwasaki
  • Publication number: 20120104563
    Abstract: A semiconductor device includes a second oxide film and a pad electrode on a first oxide film that is formed on a front surface of a semiconductor substrate, a contact electrode and a first barrier layer formed in the second oxide film and connected to the pad electrode, a silicide portion formed between the contact electrode and a through-hole electrode layer and connected to the contact electrode and the first barrier layer, a via hole extending from a back surface of the semiconductor substrate to reach the silicide portion and the second oxide film, a third oxide film formed on a sidewall of the via hole and on the back surface of the semiconductor substrate, and a second barrier layer and a rewiring layer formed inside the via hole and on the back surface of the semiconductor substrate and connected to the silicide portion.
    Type: Application
    Filed: November 1, 2010
    Publication date: May 3, 2012
    Inventors: Daishiro Saito, Takayuki Kai, Takafumi Okuma, Hitoshi Yamanishi
  • Patent number: 8121308
    Abstract: To provide an arrangement structure of a sound system in a motorcycle which can ensure the operability of a sound operation unit while ensuring the visibility of a meter. In a motorcycle which arranges a meter indicating information on a vehicle and a sound operation unit for providing a reproduction operation or the like in a sound system in the vicinity of a steering portion, the meter and the sound operation unit are constituted as bodies separate from each other. The meter and the sound operation unit are arranged, as viewed in the axial direction of a head pipe which supports a steering portion, in front of and behind the head pipe.
    Type: Grant
    Filed: January 4, 2008
    Date of Patent: February 21, 2012
    Assignee: Honda Motor Co., Ltd.
    Inventors: Takayuki Kai, Kazuhiko Mori, Atsushi Hatayama, Junichi Sakamoto
  • Patent number: 8067812
    Abstract: An acceleration sensor includes a weight; a base portion, a beam; and a piezo resistance element. The weight is arranged to displace upon receiving acceleration. The base portion is disposed around the weight apart from the weight. The beam has one end portion connected to the weight and the other end portion connected to the base portion. The beam also has a thick layer portion and a thin layer portion having a thickness smaller than that of the thick layer portion. The piezo resistance element is disposed over the thick layer portion and the thin layer portion.
    Type: Grant
    Filed: February 15, 2007
    Date of Patent: November 29, 2011
    Assignee: Oki Semiconductor Co., Ltd.
    Inventor: Takayuki Kai
  • Publication number: 20110266646
    Abstract: A digital circuit portion (6) and an analog circuit portion (7) are formed in a surface portion of a semiconductor substrate (4). A via (20) is formed in a region between the digital circuit portion (6) and the analog circuit portion (7). The via (20) extends through the semiconductor substrate (4) from a front surface to a back surface thereof, and is made of a dielectric (2) having its surface covered by a metal (1). The metal (1) is grounded. Signal interference between the analog circuit portion (6) and the digital circuit portion (7) is reduced by the via (20).
    Type: Application
    Filed: July 12, 2011
    Publication date: November 3, 2011
    Applicant: Panasonic Corporation
    Inventors: Shinichiro UEMURA, Yukio Hiraoka, Takayuki Kai
  • Publication number: 20110057326
    Abstract: An electrode on a first surface of a semiconductor substrate and a second surface of the semiconductor substrate are connected with each other by a through electrode. A through hole is formed through the semiconductor substrate from the second surface of the semiconductor substrate to an interlayer insulating film on the first surface, and an insulating film is formed on a side surface and a bottom surface of the through hole as well as on the second surface of the semiconductor substrate, so that by simultaneously etching the insulating film on the bottom surface of the through hole and the interlayer insulating film, thus formed, the through hole is formed so as to reach the electrode on the first surface of the semiconductor substrate.
    Type: Application
    Filed: December 1, 2009
    Publication date: March 10, 2011
    Inventors: Takayuki Kai, Kazushi Higashi, Takeshi Kita, Hitoshi Yamanishi, Takafumi Okuma
  • Publication number: 20110049628
    Abstract: A fin-semiconductor region (13) is formed on a substrate (11). A first impurity which produces a donor level or an acceptor level in a semiconductor is introduced in an upper portion and side portions of the fin-semiconductor region (13), and oxygen or nitrogen is further introduced as a second impurity in the upper portion and side portions of the fin-semiconductor region (13).
    Type: Application
    Filed: January 20, 2010
    Publication date: March 3, 2011
    Inventors: Tomohiro Okumura, Takayuki Kai, Yuichiro Sasaki
  • Patent number: 7705412
    Abstract: According to the present invention, a SOI substrate includes a first silicon substrate having first and second surfaces; a second silicon substrate having first and second surfaces; and a first insulating layer formed between first surface of the first silicon substrate and the first surface of the second silicon substrates. The first surface of the first silicon substrate is partly depressed to form a thin-layer region thereat. The first insulating layer is formed at least in the thin-layer region.
    Type: Grant
    Filed: August 15, 2008
    Date of Patent: April 27, 2010
    Assignee: Oki Semiconductor Co., Ltd.
    Inventor: Takayuki Kai
  • Publication number: 20100095889
    Abstract: There are installed, on a surface of an window on a vacuum chamber side, an insulating side face portion, which extends radially from the center of a generating unit of a plasma generating device and is disposed so as to be orthogonal to a substrate mounting face of an electrode, and a conductive layer, which is made of a material identical to that for the substrate and placed in an area corresponding to the generating unit on the surface of the window on the vacuum chamber side.
    Type: Application
    Filed: August 12, 2009
    Publication date: April 22, 2010
    Inventors: Takayuki Kai, Tomohiro Okumura, Hisao Nagai
  • Publication number: 20100009469
    Abstract: During a plasma discharging process, a laser beam having a certain exciting wavelength is applied to a surface of a process substrate, so as to measure, using scattered light, an impurity density and a crystal state on the surface of the process substrate.
    Type: Application
    Filed: March 5, 2009
    Publication date: January 14, 2010
    Inventors: Takayuki Kai, Tomohiro Okumura, Hisao Nagai, Cheng-Guo Jin, Bunji Mizuno