Patents by Inventor Takayuki Kihara
Takayuki Kihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11959892Abstract: A liquid chromatograph is presented which enables automatic resolution of a liquid sending failure when the liquid sending failure caused by a liquid sending pump occurs, and execution of a new analysis with good reproducibility after the liquid sending failure is resolved. The liquid sending failure can be automatically resolved by a purging operation. A sample remaining in the analysis flow path is washed away by a non-injection analysis after the liquid sending failure is resolved, and a new analysis can be executed with good reproducibility.Type: GrantFiled: March 6, 2019Date of Patent: April 16, 2024Assignee: SHIMADZU CORPORATIONInventors: Hiroshi Ohashi, Takayuki Kihara, Hiroshi Miura
-
Patent number: 11955337Abstract: A substrate processing method includes: providing a substrate including a mask; forming a film on the mask; forming a reaction layer on a surface layer of the film; and removing the reaction layer by applying energy to the reaction layer.Type: GrantFiled: July 12, 2019Date of Patent: April 9, 2024Assignee: TOKYO ELECTRON LIMITEDInventors: Toru Hisamatsu, Takayuki Katsunuma, Shinya Ishikawa, Yoshihide Kihara, Masanobu Honda
-
Publication number: 20240085846Abstract: An image forming apparatus includes a rotatable image bearing member, a developing member, a transfer member, and a brush contacting a surface of the image bearing member in a contact portion downstream of a transfer portion and upstream of a developing portion with respect to a rotational direction of the image bearing member. The toner which is not transferred onto a toner image receiving member is collected by the developing member. In a charging series, the toner is positioned on the same side as a normal charge polarity of the toner relative to the brush. In the contact portion, a maximum value of a contact pressure of 0.7 gf/mm2 or more and 3.5 gf/mm2 or less, a maximum contact area ratio is 18% or more and 74% or less, and a Clark-Evans index of the brush is 1 or more.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Inventors: Takayuki Kanazawa, Nobuo Oshima, Takayoshi Kihara, Kuniaki Tamagaki, Shuhei Tokiwa, Taichi Sato
-
Patent number: 11554458Abstract: A polishing head of a wafer polishing apparatus is provided with: a membrane head that can independently control a center control pressure pressing a center portion of a wafer, and an outer periphery control pressure pressing an outer peripheral portion of the wafer; an outer ring integrated with the membrane head so as to configure the outer peripheral portion of the membrane head; and a contact type retainer ring provided outside the membrane head. The membrane head has a central pressure chamber of a single compartment structure that controls the center control pressure, and an outer peripheral pressure chamber that is provided above the central pressure chamber, and that controls the outer periphery control pressure. A position of a lower end of the outer ring reaches at least a position of an inner bottom surface of the central pressure chamber.Type: GrantFiled: February 13, 2019Date of Patent: January 17, 2023Assignee: SUMCO CORPORATIONInventors: Yuki Nakano, Katsuhisa Sugimori, Kazuaki Kozasa, Jiro Kajiwara, Katsutoshi Yamamoto, Takayuki Kihara, Ryoya Terakawa
-
Publication number: 20220187255Abstract: The state between a liquid sending pump and an analysis flow path is switched between a connection state and a disconnection state. In the connection state, a sample is injected into the analysis flow path, and a scheduled analysis is executed. When a variation range of a liquid sending pressure applied by the liquid sending pump exceeds a threshold value, a liquid sending failure is detected. In a case where a liquid sending failure is detected, the sample analysis in execution is interrupted, and the state between the liquid sending pump and the analysis flow path is put in the disconnection state. Further, a purge operation is executed. After the purge operation ends, a confirming operation of confirming whether a liquid sending failure is detected is executed. When a liquid sending failure is not detected, a non-injection analysis in which a mobile phase is sent into the analysis flow path by the liquid sending pump under a condition that enables removal of a sample in the analysis flow path is executed.Type: ApplicationFiled: March 6, 2019Publication date: June 16, 2022Inventors: Hiroshi OHASHI, Takayuki KIHARA, Hiroshi MIURA
-
Publication number: 20220174056Abstract: An information processing system (1) includes an account-opening task server (100) and an agent server (200), wherein the server (100) includes a transmission unit (102) that transmits, to the server (200), when storing personal information of a user in a personal information database (120), first authentication information for logging in the server (100) with respect to the user and a processing unit (104) that executes, when receiving the first authentication information, processing of reading the user information of the user, and the server (200) includes an ID registration unit (202) that stores second authentication information for the user to log in to the server (200) in an ID storage unit (220) in association with the first authentication information and a login unit (204) that reads, when receiving the second authentication information, the first authentication information corresponding to the second authentication information from the ID storage unit (220) and logs in to the server (100).Type: ApplicationFiled: March 5, 2020Publication date: June 2, 2022Applicant: NEC CorporationInventors: Takayuki KIHARA, Shota ONO, Yoshitaka YOSHIMURA, Tomohisa SHIMIZU, Shinichi TORIYAMA, Masahiro KIYOSAWA
-
Publication number: 20220161388Abstract: A polishing head includes a first ring-shaped member having an opening; a plate-shaped member that closes the opening on an upper side of the first ring-shaped member; a membrane that closes the opening on a lower side of the first ring-shaped member; a back pad adhered to a lower surface of the membrane; and a second ring-shaped member located below the back pad and having an opening that holds a polishing target workpiece. A space formed by closing the opening of the first ring-shaped member by the plate-shaped member and the membrane includes: a central region; and an outer peripheral region partitioned from the central region by a partition, and an inner peripheral edge region of the second ring-shaped member is located vertically below an outer peripheral edge of the outer peripheral region. A polishing apparatus includes the polishing head, and is used in a method of manufacturing a semiconductor wafer.Type: ApplicationFiled: December 27, 2019Publication date: May 26, 2022Applicant: SUMCO CORPORATIONInventors: Yuki NAKANO, Ryoya TERAKAWA, Takayuki KIHARA, Hiroki OTA
-
Patent number: 11274371Abstract: Provided is a susceptor, capable of preventing occurrence of scratches on the back surface of a wafer attributable to lift pins, and reducing unevenness of the in-surface temperature distribution of the wafer. A susceptor according to one embodiment of this disclosure has a susceptor main body and a plate-shaped member, and when a wafer is conveyed, the front surface of the plate-shaped member ascended by lift pins supports the central part of the back surface of the wafer by surface contact. A separation space between the plate-shaped member and the susceptor main body, in a state in which the plate-shaped member is placed on the recessed part, enters further into the central side of the plate-shaped member, in a direction from the front surface to the back surface of the susceptor.Type: GrantFiled: April 22, 2016Date of Patent: March 15, 2022Assignee: SUMCO CORPORATIONInventors: Shoji Nogami, Naoyuki Wada, Masaya Sakurai, Takayuki Kihara
-
Publication number: 20210331285Abstract: A polishing head of a wafer polishing apparatus is provided with: a membrane head that can independently control a center control pressure pressing a center portion of a wafer, and an outer periphery control pressure pressing an outer peripheral portion of the wafer; an outer ring integrated with the membrane head so as to configure the outer peripheral portion of the membrane head; and a contact type retainer ring provided outside the membrane head. The membrane head has a central pressure chamber of a single compartment structure that controls the center control pressure, and an outer peripheral pressure chamber that is provided above the central pressure chamber, and that controls the outer periphery control pressure. A position of a lower end of the outer ring reaches at least a position of an inner bottom surface of the central pressure chamber.Type: ApplicationFiled: February 13, 2019Publication date: October 28, 2021Applicant: SUMCO CORPORATIONInventors: Yuki NAKANO, Katsuhisa SUGIMORI, Kazuaki KOZASA, Jiro KAJIWARA, Katsutoshi YAMAMOTO, Takayuki KIHARA, Ryoya TERAKAWA
-
Patent number: 10511501Abstract: An operator creates a function table on an analyzing device, a computer for analysis or a server. In the function table, an instruction is described which includes designation of the computer(s) for analysis or the server, and a process to be executed by the designated computer(s) for analysis or server, and optionally includes parameter information required for execution. For analysis, the function table is displayed on a display screen of the analyzing device. When the operator selects an instruction in the table and instructs execution, the analyzing device causes the designated computer(s) for analysis or server described in the instruction to execute a process associated with the instruction. Such instruction can include a process of powering on the computer(s) for analysis. By previously describing expected processes and the computer(s) for analysis scheduled to perform the processes the processes to be executed can be instructed from the analyzing device.Type: GrantFiled: November 6, 2014Date of Patent: December 17, 2019Assignee: SHIMADZU CORPORATIONInventor: Takayuki Kihara
-
Patent number: 10455239Abstract: In an information display processing device 1 for displaying a predetermined process result on a screen 14 of a display unit, the present device includes an encoding section 34 for creating a code image by encoding a piece of information held in the device and a display control section 35 for displaying, on the screen, the code image created by the encoding section 34 and a single identification header in a predetermined positional relationship to the code image, whereby the device reduces the processing load on a computer caused by an image search in a system which assists user operations through an image recognition process on a software basis.Type: GrantFiled: March 5, 2014Date of Patent: October 22, 2019Assignee: SHIMADZU CORPORATIONInventor: Takayuki Kihara
-
Publication number: 20180100235Abstract: Provided is a susceptor, capable of preventing occurrence of scratches on the back surface of a wafer attributable to lift pins, and reducing unevenness of the in-surface temperature distribution of the wafer. A susceptor according to one embodiment of this disclosure has a susceptor main body and a plate-shaped member, and when a wafer is conveyed, the front surface of the plate-shaped member ascended by lift pins supports the central part of the back surface of the wafer by surface contact. A separation space between the plate-shaped member and the susceptor main body, in a state in which the plate-shaped member is placed on the recessed part, enters further into the central side of the plate-shaped member, in a direction from the front surface to the back surface of the susceptor.Type: ApplicationFiled: April 22, 2016Publication date: April 12, 2018Applicant: SUMCO CORPORATIONInventors: Shoji NOGAMI, Naoyuki WADA, Masaya SAKURAI, Takayuki KIHARA
-
Publication number: 20170317900Abstract: An operator creates a function table on an analyzing device, a computer for analysis or a server. In the function table, an instruction is described which includes designation of the computer(s) for analysis or the server, and a process to be executed by the designated computer(s) for analysis or server, and optionally includes parameter information required for execution. For analysis, the function table is displayed on a display screen of the analyzing device. When the operator selects an instruction in the table and instructs execution, the analyzing device causes the designated computer(s) for analysis or server described in the instruction to execute a process associated with the instruction. Such instruction can include a process of powering on the computer(s) for analysis. By previously describing expected processes and the computer(s) for analysis scheduled to perform the processes the processes to be executed can be instructed from the analyzing device.Type: ApplicationFiled: November 6, 2014Publication date: November 2, 2017Applicant: SHIMADZU CORPORATIONInventor: Takayuki KIHARA
-
Patent number: 9739756Abstract: Based on three-dimensional data of time, wavelength and intensity acquired with a three-dimensional chromatograph, whether or not the peak-top intensity of the peak of a target component exceeds a predetermined upper limit is determined. If the intensity exceeds the limit, two wavelengths ?1 and ?2 are set in a spectrum passing through the peak top, where ?1 is the peak-top wavelength while ?2 is a wavelength which belongs to the peak and at which the intensity is within a predetermined range. For each point in time belonging to the target peak, the ratio between the intensity at ?1 and the intensity at ?2 in the spectrum at that point in time is calculated, and one of the calculated intensity ratios is selected as a correction value. Based on this correction value and a quantitative value calculated from a chromatogram at ?2, the quantitative value of the target component is determined.Type: GrantFiled: April 7, 2014Date of Patent: August 22, 2017Assignee: SHIMADZU CORPORATIONInventor: Takayuki Kihara
-
Publication number: 20170078679Abstract: In an information display processing device 1 for displaying a predetermined process result on a screen 14 of a display unit, the present device includes an encoding section 34 for creating a code image by encoding a piece of information held in the device and a display control section 35 for displaying, on the screen, the code image created by the encoding section 34 and a single identification header in a predetermined positional relationship to the code image, whereby the device reduces the processing load on a computer caused by an image search in a system which assists user operations through an image recognition process on a software basis.Type: ApplicationFiled: March 5, 2014Publication date: March 16, 2017Applicant: SHIMADZU CORPORATIONInventor: Takayuki Kihara
-
Publication number: 20160350137Abstract: Provided is a program for helping the creation of a guide file, such as an electronic manual or operation navigator, for guiding an operator who operates a target program while the target program is running. The program makes a computer function as: an operation target for detecting a target of operation performed by a creator operating the target program; a graphic guide displayer for displaying a graphic guide in the vicinity of the target of operation: a text guide displayer for displaying, on the window of the target program, a preset guiding text related to the target of operation and/or an input field for allowing the creator to type in text; a contents storage processor for storing, into a designated storage section, the target of operation, the graphic guide and other contents; and a guide file creator for creating the guide file using the contents stored in the storage section.Type: ApplicationFiled: May 10, 2016Publication date: December 1, 2016Applicant: SHIMADZU CORPORATIONInventor: Takayuki KIHARA
-
Patent number: 9190267Abstract: Provided is an epitaxial silicon wafer in which the warping is reduced by rendering a cross-sectional form of a silicon wafer for epitaxial growth into an adequate form as compared with the conventional one. An epitaxial silicon wafer comprising a silicon wafer for epitaxial growth and an epitaxial layer is characterized in that the epitaxial layer is formed on a silicon wafer for epitaxial growth having a cross-sectional form satisfying a relation of a given expression.Type: GrantFiled: November 10, 2011Date of Patent: November 17, 2015Assignee: SUMCO CorporationInventors: Takayuki Kihara, Kazushige Takaishi, Yasuyuki Hashimoto
-
Publication number: 20150046857Abstract: Provided is a program for giving an additional GUI to various software products. The program makes a computer function as: a reference image detector for detecting, within a base GUI displayed on a monitor, a detection image which is an image that matches the reference image, and for determining the display position of this image; a target software identifier for identifying, based on the detection image and/or information on the display position of the detection image, a target software program showing the detection image; an additional GUI displayer for superposing the image of the additional GUI component at the display position designated for the additional GUI component; and a command executer for performing, on the target software program, the operation performed by the additional GUI component, with reference to the additional GUI information storage section, in response to an input operation performed on the additional GUI component by the user.Type: ApplicationFiled: July 21, 2014Publication date: February 12, 2015Applicant: SHIMADZU CORPORATIONInventor: Takayuki KIHARA
-
Publication number: 20140303904Abstract: Based on three-dimensional data of time, wavelength and intensity acquired with a three-dimensional chromatograph, whether or not the peak-top intensity of the peak of a target component exceeds a predetermined upper limit is determined. If the intensity exceeds the limit, two wavelengths ?1 and ?2 are set in a spectrum passing through the peak top, where ?1 is the peak-top wavelength while ?2 is a wavelength which belongs to the peak and at which the intensity is within a predetermined range. For each point in time belonging to the target peak, the ratio between the intensity at ?1 and the intensity at ?2 in the spectrum at that point in time is calculated, and one of the calculated intensity ratios is selected as a correction value. Based on this correction value and a quantitative value calculated from a chromatogram at ?2, the quantitative value of the target component is determined.Type: ApplicationFiled: April 7, 2014Publication date: October 9, 2014Applicant: SHIMADZU CORPORATIONInventor: Takayuki KIHARA
-
Patent number: 8765492Abstract: This method of manufacturing a silicon wafer has a step of preparing a wafer, in which a surface of the silicon wafer is surface-treated, a step of setting stress, in which the stress S (MPa) subjected on the wafer is set, a step of inspecting, in which a defect on a surface of the wafer is inspected, and a step of determining, in which the wafer is evaluated if the wafer satisfies a criterion. In this method, it is possible to manufacture a wafer with cracking resistance even if it is subjected to a millisecond annealing by the FLA annealing treatment.Type: GrantFiled: March 24, 2010Date of Patent: July 1, 2014Assignee: Sumco CorporationInventors: Toshiaki Ono, Takayuki Kihara, Yumi Hoshino