Patents by Inventor Takayuki Matsumoto

Takayuki Matsumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200258832
    Abstract: An electronic device includes a first metal plate including a first wiring and a second wiring, an electronic component mounted on a lower surface of the first wiring so as to overlap the second wiring in plan view, a second metal plate including an electrode electrically connected to the lower surface of the first wiring, and an insulation layer filling a space between the first metal plate, the second metal plate, and the electronic component and covering the electronic component. The upper surface of the second wiring is exposed from the insulation layer.
    Type: Application
    Filed: February 3, 2020
    Publication date: August 13, 2020
    Inventors: Takayuki MATSUMOTO, Tsukasa Nakanishi, Tadaaki Katsuyama
  • Publication number: 20200216484
    Abstract: A purification agent which includes a compound having a betaine structure, and which is for a sugar chain having a length equal to or longer than that of a monosaccharide or for a glycopeptide having a sugar chain having a length equal to or longer than that of a monosaccharide.
    Type: Application
    Filed: October 31, 2018
    Publication date: July 9, 2020
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Masaaki Toyoda, Takayuki Matsumoto, Midori Sakaguchi, Takahiro Katayama
  • Publication number: 20200185315
    Abstract: A semiconductor module includes: an insulating substrate; a metal pattern provided on the insulating substrate; a solder resist provided on the metal pattern; a semiconductor chip mounted on the metal pattern at an opening portion of the solder resist; and a sealing material sealing the metal pattern, the solder resist and the semiconductor chip, wherein a suction area surrounded by a groove is provided in a portion of the solder resist.
    Type: Application
    Filed: November 17, 2017
    Publication date: June 11, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takayuki MATSUMOTO, Yukimasa HAYASHIDA
  • Publication number: 20200152556
    Abstract: An electronic component includes a metal member, an inductor, and a encapsulating resin. The metal member has an outer lead, an inner lead provided at a position opposed to the outer lead, and a post connecting the outer lead with the inner lead. The inductor is provided between the outer lead and the inner lead and connected to the outer lead or the inner lead. The encapsulating resin encapsulates the metal member and the inductor.
    Type: Application
    Filed: November 1, 2019
    Publication date: May 14, 2020
    Inventors: Takayuki Matsumoto, Tsukasa Nakanishi, Tadaaki Katsuyama
  • Publication number: 20200141502
    Abstract: The present invention provides a flow channel switching valve with a reduced number of components as well as a reduced weight, and a method for assembling the same. A valve shaft adapted to be coupled to a valve element so as to transmit torque of a rotary drive portion to the valve element is inserted through a vertical through-hole, which penetrates through the valve element in the direction of the rotation axis O (i.e., vertical direction), and through a fit-insertion hole provided in a valve body. Then, a drive gear that forms the rotary drive portion is fixed to the upper coupling portion of the valve shaft protruding from the fit-insertion hole so that the valve shaft is rotatably supported with respect to the valve body.
    Type: Application
    Filed: November 9, 2017
    Publication date: May 7, 2020
    Applicant: Fujikoki Corporation
    Inventors: Daisuke KONDO, Kenichi MOCHIZUKI, Masashi YAMASHITA, Seiichi HARA, Takayuki MATSUMOTO
  • Patent number: 10638908
    Abstract: The present invention is a method for manufacturing cleaning members obtained by cutting multi-layer webs formed by: spreading fiber bundles, the lengthwise directions of which are parallel to the direction in which said are conveyed; and layering together at least the spread and non-woven fabric strips. Said method includes a step in which, before spreading, two or more are joined together, forming one or more join sections. Said joins are performed by joining the back end (with respect to the conveyance direction) of one to the front end (with respect to the conveyance direction) of the next fiber bundle.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: May 5, 2020
    Assignee: UNICHARM CORPORATION
    Inventors: Hiroaki Goto, Takayuki Matsumoto, Shigetomo Takahashi, Yuji Yamashita
  • Publication number: 20200128675
    Abstract: A laminated circuit board includes a base having a first surface, and a second surface on an opposite side from the first surface, a first metal layer provided in the base and including a first electrode exposed from the first surface, and a second metal layer provided in the base and including a second electrode exposed from the second surface. The first metal layer includes an inductor electrically connected to the first electrode, and the first electrode and the second electrode are bonded and electrically connected to each other.
    Type: Application
    Filed: October 7, 2019
    Publication date: April 23, 2020
    Inventors: Takayuki MATSUMOTO, Tsukasa NAKANISHI
  • Publication number: 20200105479
    Abstract: A method for manufacturing an electrolytic capacitor includes a first step, a second step, and a third step. In the first step, a capacitor element is formed. The capacitor element includes an anode body, a cathode body, and a separator. The anode body includes a dielectric layer formed on a surface of the anode body. And the separator is disposed between the anode body and the cathode body. In the second step, the capacitor element is impregnated with a treatment solution containing an acid component and a base component. In the third step, the capacitor element is, after the second step, impregnated with a conductive polymer dispersion in a state that a part of the treatment solution remains in the capacitor element. The conductive polymer dispersion is obtained by dispersing, in a solvent, conductive polymer particles each including polyanion. A pH of the treatment solution is higher than a pH of the conductive polymer dispersion.
    Type: Application
    Filed: September 5, 2019
    Publication date: April 2, 2020
    Inventors: SHUMPEI MATSUSHITA, TOMOYUKI TASHIRO, TAKAYUKI MATSUMOTO, TATSUJI AOYAMA
  • Publication number: 20200075219
    Abstract: An inductor includes a magnetic body, and a conductor embedded in the magnetic body. The conductor includes a first conductor, and a second conductor covering a periphery of the first conductor.
    Type: Application
    Filed: August 7, 2019
    Publication date: March 5, 2020
    Inventors: Takayuki MATSUMOTO, Tsukasa NAKANISHI
  • Patent number: 10577470
    Abstract: A prepreg 10 comprises: a reinforcing fiber layer 3 including reinforcing fibers 1 and a resin composition 2 with which the space between fibers of the reinforcing fibers is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and surface layers 6a and 6b provided on the surfaces of the reinforcing fiber layer 3 and containing (A) a benzoxazine resin, (B) an epoxy resin, (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule, and (D) polyamide resin particles 4 having an average particle size of 5 to 50 ?m, wherein the polyamide resin particles 4 include the polyamide 1010 resin particle.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: March 3, 2020
    Assignees: SUBARU CORPORATION, JXTG NIPPON OIL & ENERGY CORPORATION
    Inventors: Yoshihiro Fukuda, Takayuki Matsumoto, Masaki Minami, Naoyuki Sekine, Masanori Nakajima
  • Patent number: 10568484
    Abstract: A method for continuously producing a cleaning member obtained from a multilayer web that includes at least a fiber bundle with hollow fibers, and non-woven fabric strips includes at least: a step for preparing a guide member provided with a pair of width-adjusting member, and having a predetermined interval; a step for conveying a fiber bundle strip, such as the fiber bundle with hollow fibers, between the pair of width-adjusting members of the guide member, and adjusting the width of the fiber bundle strip so as to match the aforementioned interval; a step for forming the multilayer web by overlaying the strip-like fiber bundle, the width of which has been adjusted, on the non-woven fabric strips; and a step for joining the components of the multilayer web.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: February 25, 2020
    Assignee: UNICHARM CORPORATION
    Inventors: Shigetomo Takahashi, Hiroaki Goto, Takayuki Matsumoto, Yuji Yamashita
  • Publication number: 20200051728
    Abstract: An inductor includes a first conductor, a second conductor, an insulation film, and a magnetic body. The first conductor spirally extends in a plane. The second conductor spirally extends in a plane. The second conductor is stacked on and joined to the first conductor. The insulation film covers a surface of the first conductor and a surface of the second conductor. The magnetic body covers a surface of the insulation film and embeds the first conductor and the second conductor. The first conductor and the second conductor are connected to form a helical coil.
    Type: Application
    Filed: August 6, 2019
    Publication date: February 13, 2020
    Inventors: Takayuki MATSUMOTO, Tsukasa NAKANISHI
  • Publication number: 20200013557
    Abstract: An electrolytic capacitor includes a capacitor element, a case housing the capacitor element, and a first heat radiation layer having an insulating property. The first heat radiation layer covers at least part of the capacitor element. A thermal conductivity ?C of the case in a thickness direction is greater than or equal to 1 W/m·K. A thermal emissivity ?1 of the first heat radiation layer is greater than or equal to 0.7.
    Type: Application
    Filed: September 18, 2019
    Publication date: January 9, 2020
    Inventors: TAKAYUKI MATSUMOTO, HONAMI NISHINO, SHIN FUJITA, TOMOYUKI TASHIRO, MASATO MORI, HIROHISA HINO
  • Publication number: 20190206757
    Abstract: A wiring board (2) is provided on a heat radiation plate (1). A semiconductor chip (8) is provided on the wiring board (2). A case housing (10) is provided on the heat radiation plate (1) and surrounds the wiring board (2) and the semiconductor chip (8). Adhesive agent (11) bonds a lower surface of the case housing (10) and an upper surface peripheral portion of the heat radiation plate (1). A sealing material (13) is filled in the case housing (10) and covers the wiring board (2) and the semiconductor chip (8). A step portion (16,17) is provided to at least one of the lower surface of the case housing (10) and the upper surface peripheral portion of the heat radiation plate (1). A side surface of the heat radiation plate (1) and an outer side surface of the case housing (10) are flush with each other.
    Type: Application
    Filed: September 20, 2016
    Publication date: July 4, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yukimasa HAYASHIDA, Daisuke OYA, Takayuki MATSUMOTO, Ryutaro DATE
  • Publication number: 20190206611
    Abstract: An inductor includes a magnetic material containing a magnetic powder and an insulating resin, a conductive line embedded in the magnetic material, a first electrode partially exposed from the magnetic material and connected to one end of the conductive line, and a second electrode partially exposed from the magnetic material and connected to another end of the conductive line.
    Type: Application
    Filed: December 6, 2018
    Publication date: July 4, 2019
    Inventors: Takayuki MATSUMOTO, Tsukasa NAKANISHI
  • Patent number: 10316158
    Abstract: A production method for a fiber-reinforced composite material comprises: a step of stacking a prepreg plurally to obtain a prepreg-stacked body; and a step of heating the prepreg-stacked body to cure a resin, wherein the prepreg comprises: a reinforcing fiber layer including reinforcing fibers and a resin composition with which the space between fibers of the reinforcing fibers is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and a surface layer provided on at least one surface of the reinforcing fiber layer and containing (A) to (C) components, and (D) polyamide resin particles having an average particle size of 5 to 50 ?m.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: June 11, 2019
    Assignees: JXTG NIPPON OIL & ENERGY CORPORATION, SUBARU CORPORATION
    Inventors: Masaki Minami, Takayuki Matsumoto, Yoshihiro Fukuda, Naoyuki Sekine, Masanori Nakajima
  • Publication number: 20190160910
    Abstract: The sealing member includes a first sealing part and a second sealing part and a joining part connecting together the first sealing part and the second sealing part. The first sealing part extends to surround a peripheral edge of the first opening hole on the main body inner peripheral surface side. The second sealing part extends to surround a peripheral edge of the second opening hole on the main body inner peripheral surface side. The joining part is placed at a position where a mutual interval between the first sealing part and the second sealing part is the smallest in the circumferential direction. Each of the first joining end portion and the second joining end portion of the joining part is pressed outward in the valve radial direction by the valve body outer peripheral surface to be resiliently deformed.
    Type: Application
    Filed: April 13, 2017
    Publication date: May 30, 2019
    Inventors: Takamitsu MANO, Yasumitsu OMI, Kenichi MOCHIZUKI, Takayuki MATSUMOTO
  • Patent number: 10265868
    Abstract: Embodiments of the present invention provide a transfer robot having a cooling plate attached thereto for cooling a substrate during transfer between a processing chamber and a load lock chamber. In one embodiment, the cooling plate is a single, large area cooling plate attached to the transfer robot beneath the substrate being transferred. In another embodiment, the cooling plate is an array of substrates attached to the transfer robot beneath the substrate being transferred. The cooling plate may include a conduit path for circulating a cooling fluid throughout the cooling plate. The cooling plate may have an upper surface with a high emissivity coating applied thereto.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: April 23, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Shinichi Kurita, Makoto Inagawa, Takayuki Matsumoto
  • Publication number: 20190070947
    Abstract: A power transmission device outputting torque from a first power source and a second power source to axles, is provided with: a first shaft coupled with the first power source; a differential configured to differentially distribute the torque to the axles; a first gear set configured to drivingly couple the first shaft with the differential; a second shaft coupled with the second power source; a second gear set drivingly coupled with the second shaft; a clutch configured to receive fluid pressure to drivingly and releasably couple the second gear set with the first gear set; and a pump driven by a third power source at least independent of the first power source and the clutch to generate the fluid pressure, the pump being disposed separate from the clutch and in fluid connection with the clutch to supply the fluid pressure.
    Type: Application
    Filed: October 30, 2018
    Publication date: March 7, 2019
    Inventors: Masashi Aikawa, Takayuki Matsumoto, Atsushi Kawano, Son Duy Nguyen
  • Publication number: 20190031993
    Abstract: A cell accommodating chip is adapted for use in a screening apparatus for searching for a predetermined cell based on optical information emitted from a substance on the cell accommodating chip and selectively collecting the cell searched for. The cell accommodating chip includes a substrate composed of a light-transmitting material, and a plurality of wells capable of accommodating cells, the plurality of wells being provided on at least one of main faces of the substrate. A surface of the cell accommodating chip having the plurality of wells is coated with a specific polymer having a crosslinked structure.
    Type: Application
    Filed: September 28, 2018
    Publication date: January 31, 2019
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Mariko MATSUNAGA, Ken TSUKll, Kenichi KIMURA, Toru TAKAHASHI, Jie XU, Takayuki MATSUMOTO, Kohta IGARASHI