Abstract: The prepreg comprises: a reinforcing fiber layer including reinforcing fibers and a resin composition with which the space between fibers of the reinforcing fibers is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and a surface layer provided on a surface of the reinforcing fiber layer and containing (A) a benzoxazine resin, (B) an epoxy resin, (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule, and (D) polyamide resin particles having an average particle size of 5 to 50 ?m, wherein the polyamide resin particles include a polyamide 12 resin particle and a polyamide 1010 resin particle.

Abstract: The prepreg comprises: a reinforcing fiber layer including reinforcing fibers and a resin composition with which the space between fibers of the reinforcing fibers is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and a surface layer provided on a surface of the reinforcing fiber layer and containing (A) to (C) components, and (D) polyamide resin particles having an average particle size of 5 to 50 ?m, wherein the polyamide resin particles include polyamide resin particles made of copolymers in which caprolactam and laurolactam are copolymerized at a molar ratio of 1:9 to 3:7 and at a molar ratio of 9:1 to 7:3, respectively.

Abstract: A method and apparatus for sealing an opening of a processing chamber are provided. In one embodiment, the invention generally provides a closure member integrated within a wall of a process chamber for sealing an opening within the wall of the chamber. In another embodiment, the invention provides a closure member configured to seal an opening in the wall of a processing chamber from the inside of the chamber.

Abstract: The prepreg comprises: a reinforcing fiber layer including reinforcing fibers and a resin composition with which the space between fibers of the reinforcing fibers is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and a surface layer provided on a surface of the reinforcing fiber layer and containing the (A) to (C) components, and (D) polyamide resin particles having an average particle size of 5 to 50 ?m, wherein the polyamide resin particles include a polyamide 12 resin particle and a polyamide resin particle made of a copolymer in which caprolactam and laurolactam are copolymerized at a molar ratio of 9:1 to 7:3.

Abstract: A wiring substrate includes a resin substrate in which first and second through holes are formed, a metallic foil on one surface of the resin substrate coating the through holes and separated into first and second side metallic foils by a border, a first connecting portion formed by a plating film inside the first through hole, a second connecting portion formed by a plating film inside the second through hole, a first slit facing the border and penetrating through the metallic foil and the first connecting portion, a second slit facing the border and penetrating through the metallic foil and the second connecting portion, first and second plating layers on front surfaces of the first and second side metallic foils, bottom surfaces of the first and second connecting portions, and side surfaces inside the first and second slits of the first and second side metallic foils.

Abstract: A wiring substrate includes a resin substrate in which first and second through holes are formed, a metallic foil on one surface of the resin substrate coating the through holes and separated into first and second side metallic foils by a border, a first connecting portion formed by a plating film inside the first through hole, a second connecting portion formed by a plating film inside the second through hole, a first slit facing the border and penetrating through the metallic foil and the first connecting portion, a second slit facing the border and penetrating through the metallic foil and the second connecting portion, first and second plating layers on front surfaces of the first and second side metallic foils, bottom surfaces of the first and second connecting portions, and side surfaces inside the first and second slits of the first and second side metallic foils.

Abstract: A prepreg 10 comprises: a reinforcing fiber layer 3 including reinforcing fibers 1 and a resin composition 2 with which the space between fibers of the reinforcing fibers 1 is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and a surface layer 6a or 6b provided on at least one surface of the reinforcing fiber layer 3 and containing (A) a benzoxazine resin, (B) an epoxy resin, (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule, and (D) polyamide resin particles 4 having an average particle size of 5 to 50 ?m, wherein the polyamide resin particles 4 include a particle made of a polyamide 11.

Abstract: A production method for a fiber-reinforced composite material comprises: a first step of stacking a prepreg including: a reinforcing fiber layer including reinforcing fibers and a resin composition with which the space between fibers of the reinforcing fibers is impregnated and a surface layer provided on at least one surface of the reinforcing fiber layer and containing polyamide resin particles having an average particle size of 5 to 50 ?m and a melting point of 175 to 210° C. plurally and performing heating at a temperature of 120° C. or more and less than M1° C. when the melting point of the polyamide resin particles measured in the composition forming the surface layer is denoted by M1° C.; and a second step of performing heating at a temperature of M1° C. or more after the first step to cure the resin.

Abstract: In a method for manufacturing a cleaning member comprising opened fiber bundle, in order to correct twisting of fiber bundle in the path for feeding the fiber bundle from a storage container to a driving roller to thereby stabilize manufacturing process, and in order to pre-open the fiber bundle in the path from a driving roller to the opening step to thereby speed-up the opening step, fiber bundle drawn out continuously from a storage container in a first direction is wound onto a non-rotational bar, and after being fed in a second direction, is fed to a first driving roller, and the fiber bundle fed from the first driving roller in a third direction is wound onto a second non-rotational bar, and after being fed in a fourth direction, is fed to a second driving roller and to the following opening step.

Abstract: A light-emitting element mounting package including a first wiring forming a first light-emitting element mounting portion, which is provided on one surface of a substrate to mount a light-emitting element, and a first through wiring having one end and another end, the one end being electrically connected to the first light-emitting element mounting portion so as to be thermally transferable, and the other end protruding from another surface of the substrate.

Abstract: A prepreg 10 comprises: a reinforcing fiber layer 3 including reinforcing fibers 1 and a resin composition 2 with which the space between fibers of the reinforcing fibers is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent represented by the following formula (C-1); and surface layers 6a and 6b provided on the surfaces of the reinforcing fiber layer 3 and containing (A) a benzoxazine resin, (B) an epoxy resin, (C) a curing agent represented by the following formula (C-1), and (D) polyamide resin particles 4 having an average particle size of 5 to 50 wherein the polyamide resin particles 4 include a polyamide 12 resin particle or a polyamide 1010 resin particle.

Abstract: A prepreg 10 comprises: a reinforcing fiber layer 3 including reinforcing fibers 1 and a resin composition 2 with which the space between fibers of the reinforcing fibers is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and surface layers 6a and 6b provided on the surfaces of the reinforcing fiber layer 3 and containing (A) a benzoxazine resin, (B) an epoxy resin, (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule, and (D) polyamide resin particles 4 having an average particle size of 5 to 50 ?m, wherein the polyamide resin particles 4 include the polyamide 1010 resin particle.

Abstract: A soldering portion (4) and a Ni plating mark (5) are simultaneously forming by plating on a wiring pattern (2) of an insulating substrate (1). A semiconductor chip (6) is mounted on the insulating substrate (1). A position of the insulating substrate (1) is recognized by the Ni plating mark (5) and a wire (7) is bonded to the semiconductor chip (6). An electrode (8) is joined to the soldering portion (4) by solder (9). The insulating substrate (1), the semiconductor chip (6), the wire (7), and the electrode (8) are encapsulated in an encapsulation material (13).

Abstract: A prepreg 10 comprises: a reinforcing fiber layer 3 including reinforcing fibers 1 and a resin composition 2 with which the space between fibers thereof is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups; and surface layers 6a and 6b provided on the surfaces of the reinforcing fiber layer 3 and containing (A) a benzoxazine resin, (B) an epoxy resin, (C) a curing agent having 2 or more phenolic hydroxy groups, and (D) polyamide resin particles 4 having an average particle size of 5 to 50 wherein the polyamide resin particles 4 include a particle made of a copolymer in which caprolactam and laurolactam are copolymerized at a molar ratio of 9:1 to 7:3 and having a melting point of 180° C. or more.

Abstract: A package for mounting a light emitting device thereon. The package includes a substrate, a light emitting device mounting part including a wiring formed on one surface of the substrate, the wiring including two areas that are arranged facing each other and being separated a predetermined interval apart from each other in a plan view, first and second through-wirings that penetrate the substrate and are provided on the two areas, respectively, each of the first and second through-wirings including one end electrically connected to the light emitting device mounting part and another end exposed from another surface of the substrate. A part of each of the first and second through-wirings includes a maximum part having a plan-view shape that is larger than a plan-view shape of the one end of each of the first and second through-wirings.

Abstract: A stacking device which stacks together web members which drop down while drawing a parabolic arc, this is provided with a horizontal movement limit part which limits movement of web members in a horizontal direction, a temporary supporting unit which can take a projecting position where it projects from the horizontal movement limit part and a retracted position where it is pulled in from the projecting position and does not stick out from the horizontal movement limit part, and a receiving table which is positioned under the temporary supporting means at the projecting position and stacks the web members. The temporary supporting unit temporarily supports a web member at the projecting position and, after that, shifts to the retracted position to make the web member drop under the temporary supporting unit, so that the stacking device stacks the web members on the receiving table.

Abstract: Provided are a novel production method and production system suitable for producing a cleaning member having excellent cleaning performance, said production method and production system enabling the cleaning member to be efficiently produced. This production method involves the following steps.

Abstract: The present invention is a method for manufacturing cleaning members obtained by cutting multi-layer webs formed by: spreading fiber bundles, the lengthwise directions of which are parallel to the direction in which said fiber bundles are conveyed; and layering together at least the spread fiber bundles and non-woven fabric strips. Said method includes a step in which, before spreading, two or more fiber bundles are joined together, forming one or more join sections. Said joins are performed by joining the back end (with respect to the conveyance direction) of one fiber bundle to the front end (with respect to the conveyance direction) of the next fiber bundle.

Abstract: This manufacturing method for manufacturing a cleaning member comprises: a fiber bundle conveying step for conveying a fiber bundle to a merging part that overlays the fiber bundle on nonwoven fabric strips a nonwoven fabric conveying step for conveying the nonwoven fabric strips to the merging part; a multilayer web forming step for forming a multilayer web by overlaying, in the merging part, the fiber bundle conveyed in the fiber bundle conveying step on the nonwoven fiber strips conveyed in the nonwoven fabric conveying step; and a joining step for joining the fiber bundle and the nonwoven fabric strips to each other in the multilayer web. In the fiber bundle conveying step, the fiber bundle is conveyed at a tension at which there is no width shrinkage in the fiber bundle, and in the multilayer web forming step, the multilayer web is formed by overlaying the fiber bundle on the nonwoven strips while applying a tension that does not cause width shrinkage in the fiber bundle.

Abstract: A wiring substrate includes an insulation substrate including a first surface, a second surface on an opposite side of the first surface, and first and second through-holes penetrating the insulation substrate from the first surface to the second surface; a wiring layer formed on the first surface of the insulation substrate; a first via formed in the first through-hole and connected to the wiring layer; a bus line positioned away from the wiring layer and the first via, and formed on the first surface of the insulation substrate; and a second via formed in the second through-hole and connected to the bus line.