Patents by Inventor Takayuki Moriwaki

Takayuki Moriwaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOLDER ALLOY FOR BONDING OXIDE MATERIAL, AND SOLDER JOINT USING THE SAME
    Publication number: 20090104071
    Abstract: The invention provides a solder alloy for bonding an oxide material, including more than 0% but not more than 1.0% of Mg and the balance being substantially Bi and Sn. Preferably, the alloy includes 0.01 to 0.6% of Mg, 35 to 86% of Bi, and the balance being substantially Sn. The invention can be used for bonding an oxide material, such as bonding glasses to each other. According to the invention, a low-cost solder joint of an oxide material is also provided.
    Type: Application
    Filed: October 2, 2008
    Publication date: April 23, 2009
    Applicant: HITACHI METAL, LTD.
    Inventors: Minoru YAMADA, Nobuhiko CHIWATA, Takayuki MORIWAKI