Abstract: Under control of a main microcomputer, an LED controller generates two frame-type LED control signals corresponding to two frame image signals arranged in time series in accordance with a panel processing color video signal. Furthermore, the LED controller generates from two frame-type LED control signals, a frame-type LED signal corresponding to an interpolation frame image signal temporally between the two frame image signals.

Abstract: A stack type mobile terminal for enabling the user to easily add only a necessary option cabinet from among different types of option cabinets eliminating the need for electric connection of the user is provided. A stack type mobile terminal 100 includes a main body cabinet 110 functioning as a telephone, a plurality of option cabinets 120 stacked on the rear of the main body cabinet 110, a rotation supporting point shaft in the stack direction, provided in the option cabinet 120 for the main body cabinet 110 and the option cabinet 120 to relatively rotate, rotation supporting point holes into which the rotation supporting point shaft is inserted, and a contact mechanism for electrically connecting the cabinets when the main body cabinet 110 and the option cabinet 120 or the option cabinets 120 are positioned at a predetermined relative angle, wherein the main body cabinet 110 and the option cabinet 120 relatively rotate, whereby the function section of the option cabinet 120 can be exposed.

Abstract: Backlight drive units included in a backlight drive device of at least one embodiment of the present invention each have a plurality of metal pads functioning as a plurality of address setting terminals. To provide a potential for setting a unique address by coming into contact with the metal pads, metal protrusions are provided at corresponding locations of a backlight housing. A backlight drive control unit is directly connected to each unit through an IIC bus by a bus scheme and receives, via the IIC bus, a detected amount of light and temperature from each unit identified by the address. With such a simple configuration, a unique address can be automatically set for each unit, obtaining the commonization of backlight drive units.

Abstract: A liquid crystal display device 100 includes thermistors 28 provided separately from light-emitting diodes 22 in an area where the light-emitting diodes 22 are arranged, and a light emission control section 201 for controlling a voltage to be applied to the light-emitting diodes 22. Based on temperature information obtained from the thermistors 28, the light emission control section 201 decreases a target value v1 of the voltage to be applied to the light-emitting diodes 22 as the temperature increases and increases the target value v1 of the voltage to be applied to the light-emitting diodes 22 as the temperature decreases.

Abstract: A PLL as a clock generation circuit that generates a PWM clock based on a reference clock, which PWM clock is used for controlling, in a pulse width modulation method, a lamp on time and a lamp off time of a light source illuminating a liquid crystal panel by synchronizing with a video signal that performs display in a set period on the liquid crystal panel, includes a configuration that generates a PWM clock that can maintain a fixed ratio of the lamp on time to the lamp off time within one period even if the set period is changed, by changing a pulse interval of the reference clock in conjunction with the change in the set period.

Abstract: There is provided an image display device capable of suppressing the occurrence of a color shift while ensuring a sufficient color reproduction range. An in-area maximum luminance obtaining unit (151) divides an input image (31) into a plurality of areas and obtains, for each of RGB colors, a maximum luminance value (34) in each area. A weighting coefficient calculating unit (152) obtains the maximum luminance values (34) for the respective RGB colors for all of the areas, and determines weighting coefficients (35) which are required upon an LED luminance adjustment process, based on an mean value of the maximum luminances values (34) for each color. An LED luminance adjusting unit (153) adjusts the luminances of respective RGB color LEDs in each area to suppress the occurrence of a color shift, based on the maximum luminance values (34) obtained by the in-area maximum luminance obtaining unit (151) and the weighting coefficients (35) determined by the weighting coefficient calculating unit (152).

Abstract: It is an object of the present invention to provide a display device that can improve the color reproductivity on a displayed image and improve the display quality. A liquid crystal display device (1) is provided with a backlight device (3) and a liquid crystal panel (2) configured to have capability of color display of information by using illumination light from the backlight device (3). The backlight device (3) has a plurality of illumination areas (Ha) with respect to a plurality of display areas provided on the liquid crystal panel (2), and light-emitting diodes (light sources) of RGB (8r, 8g, 8b) mixable with white light are provided for each illumination area (Ha).

Abstract: It is an object to provide a water-soluble preflux containing a low-volatile solubilizing agent excellent in performance to dissolve an imidazole compound in water and capable of bringing out an excellent film-forming property of the imidazole compound and also to provide a treating method for the surface of a metal conductive part which comprises bringing the surface into contact with the above water-soluble preflux.

Abstract: A driving section is provided for a housing. A fan is rotated in the housing by the driving section. Saturated steam, which is supplied to the housing, is separated into a liquid component and a gas component by applying the centrifugal force to the saturated steam by the fan to make the saturated steam pass through a cylindrical separating wall. The liquid component is discharged from an outlet port of the housing by the separating wall and a shielding section. On the other hand, the gas component is discharged from a discharge port formed at an upper portion of the housing.

Abstract: A water-based composition for treating copper or copper alloy surface for lead-free soldering, the composition comprising a compound represented by general formula (1): wherein R1 is hydrogen or methyl, and either R2 and R3 represent chlorine and R4 and R5 represent hydrogen, or R2 and R3 represent hydrogen and R4 and R5 represent chlorine.

Abstract: A stack type mobile terminal for enabling the user to easily add only a necessary option cabinet from among different types of option cabinets eliminating the need for electric connection of the user is provided. A stack type mobile terminal 100 includes a main body cabinet 110 functioning as a telephone, a plurality of option cabinets 120 stacked on the rear of the main body cabinet 110, a rotation supporting point shaft in the stack direction, provided in the option cabinet 120 for the main body cabinet 110 and the option cabinet 120 to relatively rotate, rotation supporting point holes into which the rotation supporting point shaft is inserted, and a contact mechanism for electrically connecting the cabinets when the main body cabinet 110 and the option cabinet 120 or the option cabinets 120 are positioned at a predetermined relative angle, wherein the main body cabinet 110 and the option cabinet 120 relatively rotate, whereby the function section of the option cabinet 120 can be exposed.

Abstract: It is an object to provide a water-soluble preflux containing a low-volatile solubilizing agent excellent in performance to dissolve an imidazole compound in water and capable of bringing out an excellent film-forming property of the imidazole compound and also to provide a treating method for the surface of a metal conductive part which comprises bringing the surface into contact with the above water-soluble preflux. Another object is to provide a printed wiring board wherein the surface of a metal conductive part has been brought into contact with the above water-soluble preflux and a soldering method which comprises bringing the surface of a metal conductive part into contact with the above water-soluble preflux and subsequently soldering the surface.

Abstract: A surface treating agent containing a novel phenylnaphthylimidazole compound represented by the following formula is brought into contact with the surface of copper or a copper alloy. In the formula, when A1 is a phenyl group, then A2 represents a 1-naphthyl group or a 2-naphthyl group, and when A1 is a 1-naphthyl group or a 2-naphthyl group, then A2 represents a phenyl group; and R represents a hydrogen atom or a methyl group.

Abstract: A water-based composition for treating copper or copper alloy surface for lead-free soldering, the composition comprising a compound represented by general formula (1): wherein R1 is hydrogen or methyl, and either R2 and R3 represent chlorine and R4 and R5 represent hydrogen, or R2 and R3 represent hydrogen and R4 and R5 represent chlorine.

Abstract: A driving section is provided for a housing. A fan is rotated in the housing by the driving section. Saturated steam, which is supplied to the housing, is separated into a liquid component and a gas component by applying the centrifugal force to the saturated steam by the fan to make the saturated steam pass through a cylindrical separating wall. The liquid component is discharged from an outlet port of the housing by the separating wall and a shielding section. On the other hand, the gas component is discharged from a discharge port formed at an upper portion of the housing.

Abstract: An electronic substrate is used to mount a plurality of semiconductor chips thereon. The substrate includes a first conductive member, a second conductive member, and an insulating layer. The first conductive member is electrically connected to one of the semiconductor chips. The second conductive member is electrically connected to another one of the semiconductor chips. The insulating layer is arranged to electrically isolate the second conductive member from the first conductive member. The first conductive member is a conductive base that supports the insulating layer, the semiconductor chips and the second conductive member thereon.

Abstract: A power module includes a plurality of first semiconductor devices disposed so as to define a first layer in a substantially common plane, a plurality of second semiconductor devices disposed so as to define a second layer in a substantially same plane, and at least one metal plate electrically connected to at least two semiconductor devices selected from among the plurality of first and second semiconductor devices. The first layer and second layer are stacked such that the plurality of second semiconductor devices do not overlap the plurality of first semiconductor devices.

Abstract: A power module includes a substrate having an insulative surface and a conductive pattern disposed on the insulative surface, a semiconductor device disposed on the substrate, a plate conductor provided on the conductive pattern with an insulating layer interposed therebetween, and a wire arranged to electrically connect the plate conductor and the semiconductor device.

Abstract: An electronic substrate is used to mount a plurality of semiconductor chips thereon. The substrate includes a first conductive member, a second conductive member, and an insulating layer. The first conductive member is electrically connected to one of the semiconductor chips. The second conductive member is electrically connected to another one of the semiconductor chips. The insulating layer is arranged to electrically isolate the second conductive member from the first conductive member. The first conductive member is a conductive base that supports the insulating layer, the semiconductor chips and the second conductive member thereon.

Abstract: A semiconductor device for power control includes a substrate made of aluminum. Lands of copper are formed on the substrate. Semiconductor chips, such as FETs, are mounted on the lands. The semiconductor chips are joined with the lands only through solder layers. A synthetic resin, which includes epoxide, covers the lands, the solder layers and the semiconductor chips on the substrate. Preferably, a coefficient of expansion of the synthetic resin is generally less than a coefficient of expansion of the substrate or a coefficient of expansion of the lands. Each semiconductor chip defines at least two corners positioned generally opposite to each other. Each land defines at least two corners disposed in proximity to the corners of the semiconductor chip. The corners of the land generally confine the corners of the semiconductor chip therein.