Abstract: A computer executes a display procedure of displaying a list of character strings registered in advance in response to a predetermined operation for data forming a part of a web page; and a storage procedure of storing a character string selected by a user from the list into a storage device in association with the data, to thereby achieve more efficient labeling of data.

Abstract: A heat trace area extraction method executed by a computer, includes: generating a first differential image with respect to a visible image of a background of a certain range for a visible image in which the certain range is captured; generating a second differential image with respect to a thermal image of the background for a thermal image in which the certain range is captured by a thermal camera; and extracting a heat trace area by removing an area of a real object from the thermal image on the basis of the first differential image and the second differential image.

Abstract: A heat trace region extraction device includes an information output unit 181 that outputs information indicating a heat trace region which is a region of a trace of heat, extracted based on an actual object image which is an image of an actual object, obtained by photographing a certain range with an actual object camera for photographing the actual object and a thermal image which is an image of the heat emitted by the actual object, obtained by photographing a certain range with a thermal camera for photographing the heat emitted by the actual object. The information output unit 181 displays information indicating the heat trace region on a transmissive display so that the heat trace region existing in the certain range and information indicating the heat trace region displayed on the transmissive display are aligned with each other.

Abstract: A heat trace region extraction device includes: a difference actual object image generation unit 130 that generates a difference actual object image which is an image of a difference between an actual object image which is an image of an actual object obtained by photographing a certain range with an actual object camera for photographing the actual object and a background actual object image which is an actual object image of a background of the certain range; a difference thermal image generation unit 16 that generates a difference thermal image which is an image of a difference between a thermal image which is an image of heat emitted by the actual object obtained by photographing the certain range with a thermal camera for photographing the heat emitted by the actual object and a background thermal image which is a thermal image of the background; and a heat trace region extraction unit 17 that extracts a heat trace region by removing a region of the actual object from the thermal image based on the diffe

Abstract: A heat trace region extraction device includes a heat trace cause identification unit 31 executing: a first identification process of identifying a heat trace region due to a cause different from a cause by which the heat trace region extracted by past processing of the heat trace region extraction unit 17 among the heat trace regions extracted by latest processing of the heat trace region extraction unit 17; a second identification process of identifying a causal region which is a region which became the cause by which the heat trace region identified in the first identification process became the heat trace using the difference thermal image extracted by past processing of the heat trace region extraction unit 17; and a third identification process of identifying a temperature of the causal region identified in the second identification process from the thermal image corresponding to the difference thermal image used for identifying the causal region.

Abstract: A heat trace region extraction device includes: a difference actual object image generation unit 130 that generates a difference actual object image which is an image of a difference between an actual object image which is an image of an actual object obtained by photographing a certain range with an actual object camera for photographing the actual object and a background actual object image which is an actual object image of a background of the certain range; a difference cold image generation unit 161 that generates a difference cold image which is an image including a region of a difference between a thermal image which is an image of heat emitted by the actual object obtained by photographing the certain range with a thermal camera for photographing the heat emitted by the actual object and a background thermal image which is a thermal image of the background, the region where a temperature in the thermal image is lower than a temperature in the background thermal image being a low temperature region; an

Abstract: The availability of decompression of compressed data can be determined when a computer executes a compression procedure for generating compressed data by compressing input data using an encoder of an auto-encoder which has completed learning, a decompression procedure for generating decompressed data by decompressing the compressed data using a decoder of the auto-encoder, a determination procedure for determining whether the input data has been learned by the auto-encoder based on a difference between the input data and the decompressed data, and a transmission procedure for transmitting the compressed data via a network if it is determined that the input data has been learned, and transmitting the input data via the network if it is determined that the input data has not been learned.

Abstract: Provided is a sensor network capable of acquiring, from a data center, learning data composed of a pair of sensor data (input) and a classification label (output) necessary for adding/changing a classification label for updating a classifier while reducing the volume of communication between a sensor and the center. One aspect of the present invention relates to a sensor network, including one or more sensor nodes and a data center. The sensor node includes: an encoding unit for encoding sensor data by an encoder part of an autoencoder; and a transmission unit for transmitting the encoded data. The data center includes: a reception unit for receiving data encoded from sensor data by the encoder part of the autoencoder; a decoding unit for decoding the encoded data by a decoder part of the autoencoder; and a storage unit for storing the decoded data therein.

Abstract: Performing, by a computer, an identification procedure for identifying a partial region in a thermal image corresponding to a visible light image in accordance with a threshold for a temperature; and a processing procedure for processing the region of the visible light image identified in the identification procedure prevents privacy leakage from an image captured by a camera.

Abstract: A computes executes a first transmission procedure for transmitting first information including information on a web page displayed on a web browser to an information processing device connected via a network, a first reception procedure for receiving second information on a screen of a game using the web page, the second information being generated on the basis of the first information by the information processing device, a display procedure for displaying the screen on the basis of the second information, and a control procedure for controlling a process according to an operation of a user with respect to the web page after the screen is displayed, thereby efficiently realizing a game on any web page.

Abstract: A computer executes a display procedure of displaying a list of character strings registered in advance in response to a predetermined operation for data forming a part of a web page; and a storage procedure of storing a character string selected by a user from the list into a storage device in association with the data, to thereby achieve more efficient labeling of data.

Abstract: A sensor node connected to a server device through a communication network includes an acquisition unit configured to acquire sensor data from a sensor included in the sensor node, an identification unit configured to classify the sensor data into a plurality of classes to identify occurrence of a predetermined event based on the sensor data and an identification model created by the server device in advance, a certainty degree calculation unit configured to calculate a degree of certainty of the sensor data as an indicator representing uncertainty of a result of the identification based on the result of the identification, and a transmission unit configured to select sensor data having a minimum degree of certainty from a transmission buffer in which the sensor data and the degree of certainty of the sensor data are stored in association with each other, and transmit the selected sensor data to the server device.

Abstract: Provided is a sensor network capable of acquiring, from a data center, learning data composed of a pair of sensor data (input) and a classification label (output) necessary for adding/changing a classification label for updating a classifier while reducing the volume of communication between a sensor and the center. One aspect of the present invention relates to a sensor network, including one or more sensor nodes and a data center. The sensor node includes: an encoding unit for encoding sensor data by an encoder part of an autoencoder; and a transmission unit for transmitting the encoded data. The data center includes: a reception unit for receiving data encoded from sensor data by the encoder part of the autoencoder; a decoding unit for decoding the encoded data by a decoder part of the autoencoder; and a storage unit for storing the decoded data therein.

Abstract: A multichip module of the present invention includes a substrate having an upper surface, a hole provided on the upper surface of the substrate and a chip provided in the hole. The upper surface of the chip and the upper surface of the substrate forms an even, or substantially even, surface. A first insulating layer is formed on the upper surface of the chip and the upper surface of the substrate and a first wiring layer is formed on the first dielectric layer. A method for manufacturing a multichip module, which includes a substrate having a cavity provided thereon, and a chip, includes providing the chip in the cavity so that the upper surface of the chip and the upper surface of the substrate becomes even, or substantially even. The method also includes forming a first insulating layer on the upper surface of the chip and the upper surface of the substrate, and forming a first wiring layer on the first insulating layer.

Abstract: A multichip module of the present invention includes a substrate having an upper surface, a hole provided on the upper surface of the substrate and a chip provided in the hole. The upper surface of the chip and the upper surface of the substrate forms an even, or substantially even, surface. A first insulating layer is formed on the upper surface of the chip and the upper surface of the substrate and a first wiring layer is formed on the first dielectric layer. A method for manufacturing a multichip module, which includes a substrate having a cavity provided thereon, and a chip, includes providing the chip in the cavity so that the upper surface of the chip and the upper surface of the substrate becomes even, or substantially even. The method also includes forming a first insulating layer on the upper surface of the chip and the upper surface of the substrate, and forming a first wiring layer on the first insulating layer.

Abstract: A multichip module of the present invention includes a substrate having an upper surface, a hole provided on the upper surface of the substrate and a chip provided in the hole. The upper surface of the chip and the upper surface of the substrate forms an even, or substantially even, surface. A first insulating layer is formed on the upper surface of the chip and the upper surface of the substrate and a first wiring layer is formed on the first dielectric layer. A method for manufacturing a multichip module, which includes a substrate having a cavity provided thereon, and a chip, includes providing the chip in the cavity so that the upper surface of the chip and the upper surface of the substrate becomes even, or substantially even. The method also includes forming a first insulating layer on the upper surface of the chip and the upper surface of the substrate, and forming a first wiring layer on the first insulating layer.

Abstract: A PCB is fixed to a PCB stiffener to be held thereby, while an LSI is fixed to an LSI stiffener to be held thereby. The distal ends of four supporting bars provided in the LSI stiffener are screwed on the PCB stiffener, whereby the two stiffeners are firmly integrated with each other to be prevented from being warped. Since a heat sink can be mounted through tapped holes provided in the LSI stiffener, even if the PCB is a thin board such as a build-up substrate, it is possible to mount the heat sink without any difficulties.

Abstract: An electronic device assembly (and method for forming the same) including a first substrate having a first surface, a second surface, and a first pad on the first surface thereof; a second substrate having a first surface, a second surface, and a second pad on the second surface thereof, the first pad facing the second pad; a rigid spherical core interposed between the first and second pads; and solder connecting the first and second pads. The first substrate has a through-hole which is provided through the first substrate at a position of the first pad, at least a part of the solder is positioned in the through-hole and at least a part of the spherical core is received in the through-hole. The through-hole has an inner wall which is continuously tapered from the first surface of the first substrate to the second surface of the first substrate.

Abstract: An electronic device assembly includes a rigid, first substrate and a second substrate. The first substrate has a first pad on the upper surface, and a through-hole at a position of the first pad. The second substrate has a second pad on the upper surface thereof. The first and second pads are connected via solder. At least a part of the solder is positioned in the through-hole of the first substrate. The first substrate may include a flexible substrate and a rigid plate. The through-hole is provided in the flexible substrate. The first pad is provided on the lower surface of the flexible substrate. The rigid plate is attached to the flexible substrate. The plate has a hole at a position of the through-hole to make the first pad reachable.

Abstract: An electronic package includes a supporting member, an electronic device, a carrier, a substrate a cooling means. The supporting member includes a plate and a bottom leg for supporting the plate. A first end of the bottom leg is joined to the lower surface of the plate. The carrier has a hole for receiving the bottom leg. The electronic device is connected to the carrier and is attached to the lower surface of the plate. A second end of the bottom leg is inserted into the hole of the carrier. The second end of the bottom leg is joined to the upper surface of the substrate. The electronic device is positioned between the plate of the supporting member and the substrate. The cooling is attached onto and supported by the upper surface of the plate.