Abstract: An electronic package according to the present invention comprises a supporting member, an electronic device, a carrier, a substrate and cooling means. The supporting member includes a plate and a bottom leg for supporting the plate. A first end of the bottom leg is joined to the lower surface of the plate. The carrier has a hole for receiving the bottom leg. The electronic device is connected to the carrier and is attached to the lower surface of the plate. A second end of the bottom leg is inserted into the hole of the carrier. The second end of the bottom leg is joined to the upper surface of the substrate. The electronic device is positioned between the plate of the supporting member and the substrate. The cooling means is attached onto and supported by the upper surface of the plate.

Abstract: A tape carrier for increasing the number of terminals between the tape carrier and a substrate includes a film, a lead, a terminal and a connection. The film has first and second surfaces and includes first and second regions. The first region of the film is covered with a device when the device is received by the first surface of the film. The film has an opening between the first and second regions. The lead is provided on the first surface of the film and extends above the opening of the film. The lead is coupled to the device at the opening of the film when the device is received by the first surface of the film. The terminal is provided on the second surface in the first region of the film. The connection connects the lead to the terminal. The lead and the device are connected together by thermocompression bonding with a thermode inserted into the opening of the film.

Abstract: In a first step, a first substrate is prepared. The first substrate has a first surface, a second surface, and a through-hole therebetween. In a second step, a second substrate is prepared. The second substrate has a first surface, a second surface, and a pad on the first surface of the second substrate. In a third step, a solder is provided on the pad of the second substrate. In a fourth step, the through-hole of the first substrate is positioned on the solder. The second surface of the first substrate and the first surface of the second substrate face each other. In a fifth step, the solder is heated to flow the solder into the through-hole of the first substrate. In the sixth step, an appearance of the solder on the first surface of the first substrate may be confirmed for detection of a connection of the solder.

Abstract: Disclosed are a tympanostomy tube made of pure titanium or a titanium alloy comprising a lumen formed longitudinally in an elongated tubular member and a concavity inwardly formed on said elongated tubular member in a circumferential direction at right angles to a longitudinal direction thereof, said lumen being longitudinally different in diameter and having a larger diameter at a position at which the concavity is not formed than at a position at which the concavity is formed; and a method for producing a tympanostomy tube comprising the steps of drilling a hole longitudinally in a rod member of pure titanium or a titanium alloy to form an elongated tubular member, and forming a concavity on said elongated tubular member in a circumferential direction at right angles to a longitudinal direction thereof.