Abstract: An object of the present invention is to provide a method of fabricating a semiconductor device having a relatively small package structure and hence a relatively small mounting area. Another object of the present invention is to provide a method of fabricating a semiconductor device relatively inexpensively. An insulating board with a plurality of device carrier areas thereon is prepared, and islands and leads are formed on the device carrier areas electrically connected via through holes to external electrodes on the back of the insulating board. The external electrodes are spaced or retracted inwardly from edges of the device carrier areas. Semiconductor chips are mounted on the respective device carrier areas by die bonding and wire bonding, and then covered with a common resin layer. The resin layer and the insulating board are separated along cutting lines into segments including the device carrier areas thereby to produce individual semiconductor devices.

Abstract: The present invention provides a method for manufacturing a semiconductor device comprising steps of: bonding one semiconductor chip to each of multiple mounting portions of a substrate; covering the semiconductor chips bonded to the mounting portions with a common resin layer; bringing the substrate into contact with the resin layer and gluing the substrate to an adhesive sheet; and performing dicing and measurement for the semiconductor chips that are glued to the adhesive sheet.

Abstract: An object of the present invention is to provide a method of fabricating a semiconductor device having a relatively small package structure and hence a relatively small mounting area. Another object of the present invention is to provide a method of fabricating a semiconductor device relatively inexpensively. An insulating board with a plurality of device carrier areas thereon is prepared, and islands and leads are formed on the device carrier areas electrically connected via through holes to external electrodes on the back of the insulating board. The external electrodes are spaced or retracted inwardly from edges of the device carrier areas. Semiconductor chips are mounted on the respective device carrier areas by die bonding and wire bonding, and then covered with a common resin layer. The resin layer and the insulating board are separated along cutting lines into segments including the device carrier areas thereby to produce individual semiconductor devices.

Abstract: An object of the present invention is to provide a method of fabricating a semiconductor device having a relatively small package structure and hence a relatively small mounting area. An insulating board with a plurality of device carrier areas thereon is prepared, and semiconductor chips are mounted on the respective device carrier areas and then covered with a common resin layer. The resin layer and said insulating board are separated along dicing lines into segments including the device carrier areas thereby to produce individual semiconductor devices. External electrodes connected to electrodes of the semiconductor chips are mounted on the back of the insulating board. The external electrodes are positioned symmetrically with respect to central lines of the packaged semiconductor device for preventing various problems which would otherwise be caused when such a small package is mounted.

Abstract: An object of the present invention is to provide a method of fabricating a semiconductor device having a relatively small package structure and hence a relatively small mounting area. An insulating board with a plurality of device carrier areas thereon is prepared, and semiconductor chips are mounted on the respective device carrier areas and then covered with a common resin layer. The resin layer and said insulating board are separated along dicing lines into segments including the device carrier areas thereby to produce individual semiconductor devices. External electrodes connected to electrodes of the semiconductor chips are mounted on the back of the insulating board. The external electrodes are positioned symmetrically with respect to central lines of the packaged semiconductor device for preventing various problems which would otherwise be caused when such a small package is mounted.

Abstract: An object of the present invention is to provide a method of manufacturing a semiconductor device which enables a decrease in mounting area on a printed circuit board and an increase in space efficiency on the printed circuit board.

Abstract: An insulated door for a refrigerator or other appliance having an external panel of an open box configuration without integrally molded inwardly directed flange portions, a plurality of separately installed trim pieces arranged around an edge perimeter of the external panel, the trim pieces having a socket region for snap engagement with the edge of the external panel, and a flange portion extending therefrom inwardly. An inside liner is applied over the trim pieces and a gasket is applied around the edge of the inside liner captured between the inside liner and the trim pieces. The invention allows for the economical molding of the external panel and the assembly of the inside liner and gasket to the external panel before a foamed-in place operation to apply the inside insulation which will unitize the structure.

Abstract: A first high energy beam is projected against a first flank surface of a substantially V-shaped steel surface, and simultaneously thereto a second a high energy beam is projected against a second flank surface of the V-shaped surface. The high energy beams may be electron beams or laser beams and may be provided from a single source or separate sources. The separate high energy beams are projected against the respective flank surfaces at angles as close as possible to vertical thereto, thereby subjecting the flank surfaces to a heat treatment to form a hardened layer.

Abstract: A single laser beam transmitter directs a substantially parallel laser beam toward a substantially V-shaped steel surface including first and second flank surfaces. A convex lens has a focal length (f) which meets the condition of r/f.gtoreq.0.268, wherein (r) is the diameter of the laser beam, and such convex lens is positioned in the path of the laser beam such that the focal point of the convex lens is between the convex lens and the V-shaped surface. The convex lens thus diffuses and diverges the laser beam from the focal point and projects the laser beam against the first and second flank surfaces at angles as close as possible to perpendicular thereto.