Abstract: A system for processing a substrate using a plurality of vacuum processing chambers is provided. The system comprises: an atmospheric transfer chamber in an atmospheric atmosphere; a vacuum transfer chamber in a vacuum atmosphere; a plurality of processing modules configured by vertically arranging the vacuum processing chamber and a supplementary device; and a load lock chamber configured to switch an atmosphere therein between the atmospheric atmosphere and the vacuum atmosphere. The vacuum transfer chamber and the load lock chamber are arranged at a height position where a worker can enter thereunder, the load lock chamber and the plurality of vacuum processing chambers are connected to side surfaces of the vacuum transfer chamber, and a space below the vacuum transfer chamber is blocked from outside except for the side surface to which the load lock chamber is connected, and a space below the load lock chamber serves as a maintenance passage.

Abstract: There is provided a connected processing container comprising: a first processing container and a second processing container arranged side by side in a horizontal direction with a gap therebetween and respectively accommodating a substrate for vacuum processing; a first block portion fixed to the first processing container; a second block portion fixed to the second processing container and arranged side by side in the horizontal direction with respect to the first block portion; and a rail portion to which the first block portion and the second block portion are slidably connected, the rail portion being provided so as to straddle the first processing container and the second processing container.

Abstract: A processing module includes: a processing container including therein processing spaces in which stages are disposed, respectively, wherein a center of each of the processing spaces is located on a same circumference; a rotation arm including holders configured to hold wafers, which are placed on the stages of the processing spaces, respectively, wherein the rotation arm is rotatable around a center of the circumference as a rotation axis; and a sensor located between adjacent processing spaces and configured to detect positions of the wafers held by the rotation arm during rotational operation of the rotation arm.

Abstract: A process module includes four stages arranged in a two-row and two-column layout inside the process module, wherein a row interval and a column interval that constitute the two-row and two-column layout have different dimensions.

Abstract: A film forming apparatus includes: a processing container; a stage arranged inside the processing container and configured to place a substrate thereon, the stage including a plurality of film forming portions configured to form a film on a back surface of the substrate opposite to a surface of the substrate on which an element is formed, with a material gas supplied to the back surface via a supply port having a shape forming at least a portion of a film forming pattern for reducing stress applied to the substrate; and a control device configured to independently control film formations on the back surface by the plurality of film forming portions.

Abstract: Coupled processing containers include a first processing container and a second processing container provided side by side in a horizontal direction to form a gap therebetween, the first processing container and the second processing container being configured to store substrates, respectively, in order to perform vacuum processing, and a connecting part provided across the gap so as to connect the first processing container and the second processing container to each other, the connecting part being configured to be slidable in the horizontal direction with respect to at least one of the first processing container and the second processing container.

Abstract: There is provided a vacuum processing apparatus for performing a vacuum process by supplying a processing gas onto a substrate arranged in a processing space kept in a vacuum atmosphere, the apparatus comprising: a first transfer space and a second transfer space in each of which the substrate is transferred; and an intermediate wall portion provided between the first transfer space and the second transfer space along the extension direction, wherein one or more processing spaces are arranged in the first transfer space along the extension direction, and two or more processing spaces are arranged in the second transfer space along the extension direction, and wherein a plurality of exhaust paths and a joined exhaust path where the plurality of exhaust paths are joined are formed in the intermediate wall portion.

Abstract: A wafer-processing apparatus includes: multiple discrete units of reactors disposed on the same plane; a wafer-handling chamber having a polygonal shape having multiple sides corresponding to and being attached to the multiple discrete units, respectively, and one additional side for a load lock chamber; a load lock chamber attached to the one additional side of the wafer-handling chamber; multiple discrete gas boxes for controlling gases corresponding to and being connected to the multiple discrete units, respectively; and multiple discrete electric boxes for controlling electric systems corresponding to and being detachably connected to the multiple discrete units, respectively, wherein the gas boxes and the electric boxes are arranged alternately as viewed from above under the multiple discrete units, and the electric boxes can be pulled out outwardly without being disconnected from the corresponding units so that sides of the gas boxes are accessible.

Abstract: An electric power tool includes a terminal unit and a component. A signal line and a power line are coupled to the terminal unit. The signal line transmits signal. The power line supplies electric power. The terminal unit is mounted to the component. The terminal unit includes a signal terminal coupled to the signal line, and a power supply terminal coupled to the power line. The component includes a component-side signal terminal and a component-side power supply terminal. The component-side signal terminal is electrically conductive to the signal terminal of the mounted terminal unit. The component-side power supply terminal is electrically conductive to the power supply terminal of the mounted terminal unit.

Abstract: There is provided a vacuum processing apparatus for performing a vacuum process by supplying a processing gas onto a substrate arranged in a processing space kept in a vacuum atmosphere, the apparatus comprising: a first transfer space and a second transfer space in each of which the substrate is transferred; and an intermediate wall portion provided between the first transfer space and the second transfer space along the extension direction, wherein one or more processing spaces are arranged in the first transfer space along the extension direction, and two or more processing spaces are arranged in the second transfer space along the extension direction, and wherein a plurality of exhaust paths and a joined exhaust path where the plurality of exhaust paths are joined are formed in the intermediate wall portion.

Abstract: A dual section module with mass flow controllers, for processing wafers, includes: dual process sections integrated together; at least one mass flow controller (MFC) each shared by the dual process sections and provided in a gas line branching into two gas lines, at a branching point, connected to the respective interiors of the dual process sections and arranged symmetrically between the dual process sections; and at least one mass flow controller (MFC) each unshared by the dual process sections and provided in a gas line connected to the interior of each dual process section.

Abstract: An electric power tool includes a terminal unit and a component. A signal line and a power line are coupled to the terminal unit. The signal line transmits signal. The power line supplies electric power. The terminal unit is mounted to the component. The terminal unit includes a signal terminal coupled to the signal line, and a power supply terminal coupled to the power line. The component includes a component-side signal terminal and a component-side power supply terminal. The component-side signal terminal is electrically conductive to the signal terminal of the mounted terminal unit. The component-side power supply terminal is electrically conductive to the power supply terminal of the mounted terminal unit.

Abstract: A film forming apparatus includes a susceptor, and a shower head provided above the susceptor and having a first passage and a second passage independent of the first passage formed therein, wherein the first passage is formed through the shower head by being provided with a first cavity surrounded by a first upper wall and a first lower wall, a first thin hole formed in the first upper wall, and a plurality of second thin holes formed in the first lower wall, the height of the first upper wall in the vertical direction is reduced with increase in distance from the first thin hole, and the second passage is formed in the same manner as the first passage.

Abstract: A method for positioning wafers in dual wafer transport, includes: simultaneously moving first and second wafers placed on first and second end-effectors to positions over lift pins protruding from first and second susceptors, respectively; and correcting the positions of the first and second wafers without moving any of the lift pins relative to the respective susceptors or without moving the lift pins relative to each other, wherein when the first and second wafers are moved to the respective positions, the distance between the first wafer and tips of the lift pins of the first susceptor is substantially smaller than the distance between the second wafer and tips of the lift pins of the second susceptor.

Abstract: A wafer-processing apparatus includes: multiple discrete units of reactors disposed on the same plane; a wafer-handling chamber having a polygonal shape having multiple sides corresponding to and being attached to the multiple discrete units, respectively, and one additional side for a load lock chamber; a load lock chamber attached to the one additional side of the wafer-handling chamber; multiple discrete gas boxes for controlling gases corresponding to and being connected to the multiple discrete units, respectively; and multiple discrete electric boxes for controlling electric systems corresponding to and being detachably connected to the multiple discrete units, respectively, wherein the gas boxes and the electric boxes are arranged alternately as viewed from above under the multiple discrete units, and the electric boxes can be pulled out outwardly without being disconnected from the corresponding units so that sides of the gas boxes are accessible.

Abstract: An anti-slip end-effector for transporting a workpiece, which is configured to be attached to a robotic arm, includes: a workpiece-supporting area for placing a workpiece thereon for transportation; at least one front protrusion disposed at a distal end of the workpiece-supporting area for engaging an edge of the workpiece to restrict movement of the workpiece placed on the workpiece-supporting area beyond the front protrusion; and at least one anti-slip protrusion disposed in the workpiece-supporting area for contacting and supporting the backside of the workpiece, said anti-slip protrusion having a top face having a static friction coefficient of 1.0 or more as measured against the backside of the workpiece, and having a surface roughness of less than 0.4 ?m.

Abstract: A film forming apparatus includes a susceptor, and a shower head provided above the susceptor and having a first passage and a second passage independent of the first passage formed therein, wherein the first passage is formed through the shower head by being provided with a first cavity surrounded by a first upper wall and a first lower wall, a first thin hole formed in the first upper wall, and a plurality of second thin holes formed in the first lower wall, the height of the first upper wall in the vertical direction is reduced with increase in distance from the first thin hole, and the second passage is formed in the same manner as the first passage.

Abstract: A wafer-processing apparatus includes: eight or ten reactors with identical capacity for processing wafers on the same plane, constituting four or five discrete units, each unit having two reactors arranged side by side with their fronts aligned in a line; a wafer-handling chamber including two wafer-handling robot arms each having at least two end-effectors; a load lock chamber; and a sequencer for performing, using the two wafer-handling robot arms, steps of unloading/loading processed/unprocessed wafers from/to any one of the units, and steps of unloading/loading processed/unprocessed wafers from/to all the other respective units in sequence while the wafers are in the one of the units.