Abstract: The objective of the present invention is to obtain a flow rate measurement device capable of reducing variations in the flow rate detection accuracy by suppressing the inclination of a chip package relative to a circuit board. A flow rate measurement device 20 of the present invention includes a chip package 310 having a flow rate sensor 311 and a passage wall 314 formed therein, and a circuit board 300 on which the chip package 310 is mounted, in which the chip package 310 is mounted such that the flow rate sensor 311 faces a portion of the circuit board 300 and a portion of the passage wall 314 as a resin portion of the chip package 310 contacts the circuit board 300.

Abstract: To provide an airflow amount measuring device capable of accurately measuring a flow amount of air without occurrence of warpage in a thin film portion when an airflow measuring element is mounted on a lead frame to form a resin-sealed package in which the airflow amount measuring element and the lead frame are sealed. A chip package includes a lead frame, an element mounted on the lead frame and having a detection portion, and a structure for sealing the lead frame and the element such that at least the detection portion is exposed. Then, the curvature radius ? of the exposed portion of the element exposed from the sealing resin member is 2.13 or less.

Abstract: To obtain a chip package positioning structure capable of adjusting a tilt and a position of a chip package with respect to the circuit board and reducing mounting variations. The chip package positioning and fixing structure that positions and fixes, to a circuit board 4, a chip package 5 in which a flow rate detection element 53 is sealed with a resin so that a detection portion is at least exposed, in which the chip package includes a solder fixation portion 52 that fixes the chip package to the circuit board by soldering, and a positioning portion 514 that performs positioning to the circuit board, and the positioning portion is provided closer to the flow rate detection element from the solder fixation portion.

Abstract: An object of the present invention is to provide a compact air flow rate measuring device with improved stain resistance. A physical quantity detecting device of the present invention includes: a semiconductor element having a flow rate detection unit 205; a circuit board 207 supporting the semiconductor element; and a conductive cover 202 fixing the circuit board 207, and the semiconductor element is fixed to the circuit board 207 such that the flow rate detection unit 205 faces the cover 202.

Abstract: Provided is a highly reliable thermal flow meter. In a thermal flow meter 20, a flow rate detection element 321 that detects an air flow rate, and a conductive coating film 400 containing a conductive substance and a resin as constituent elements are provided on at least a part of a portion provided in an auxiliary passage 135 on a surface facing a detection surface 322 of the flow rate detection element 321.

Abstract: A physical quantity measurement device is configured to seal a cavity portion on a back surface side of a diaphragm of a thermal air flow rate sensor while improving measurement accuracy. The device may include a lead frame having a mounting surface on which a flow rate sensor which is the thermal air flow rate sensor is mounted, and a flow passage forming member disposed on a back surface opposite to the mounting surface of the lead frame. A ventilation flow path is formed by a first through hole in communication with a cavity portion of the flow rate sensor, a second through hole provided in the lead frame and opened in the mounting surface, and a connection flow path that is defined between the lead frame and the flow passage forming member and connecting the first through hole and the second through hole.

Abstract: An object is to improve measurement accuracy of a thermal air flow meter. A flow-rate measuring device comprising: a sensor assembly having a flow-rate detecting element; a circuit board on which the sensor assembly is mounted; and a housing on which the circuit board is mounted, wherein the sensor assembly is mounted on the circuit board such that a detection portion side of the flow-rate detecting element is closer to the housing, and the sensor assembly includes a contact portion in contact with the housing on the detection portion side.

Abstract: Provided is a highly reliable thermal flow meter. In a thermal flow meter 20, a flow rate detection element 321 that detects an air flow rate, and a conductive coating film 400 containing a conductive substance and a resin as constituent elements are provided on at least a part of a portion provided in an auxiliary passage 135 on a surface facing a detection surface 322 of the flow rate detection element 321.

Abstract: To provide an airflow amount measuring device capable of accurately measuring a flow amount of air without occurrence of warpage in a thin film portion when an airflow measuring element is mounted on a lead frame to form a resin-sealed package in which the airflow amount measuring element and the lead frame are sealed. A chip package includes a lead frame, an element mounted on the lead frame and having a detection portion, and a structure for sealing the lead frame and the element such that at least the detection portion is exposed. Then, the curvature radius ? of the exposed portion of the element exposed from the sealing resin member is 2.13 or less.

Abstract: The objective of the present invention is to obtain a flow rate measurement device capable of reducing variations in the flow rate detection accuracy by suppressing the inclination of a chip package relative to a circuit board. A flow rate measurement device 20 of the present invention includes a chip package 310 having a flow rate sensor 311 and a passage wall 314 formed therein, and a circuit board 300 on which the chip package 310 is mounted, in which the chip package 310 is mounted such that the flow rate sensor 311 faces a portion of the circuit board 300 and a portion of the passage wall 314 as a resin portion of the chip package 310 contacts the circuit board 300.

Abstract: A flow-volume detecting apparatus including a flow-volume detecting unit which measures a flow volume of a measured fluid, a flow-volume state determining unit which determines a flow-volume state of the measured fluid based on an output from the flow-volume detecting unit. The flow-volume detecting apparatus further including a plurality of filters which process a flow-volume signal, and a filter selecting unit which selects a filter that processes the flow-volume signal, wherein the filter selecting unit selects the filter that processes the flow-volume signal according to the flow-volume state determined by the flow-volume state determining unit.

Abstract: A flow-rate sensor is provided with a lead frame, a semiconductor chip that is disposed on one surface of the lead frame, and in which a diaphragm including a void portion on the lead frame side is formed, a flow rate detecting unit that is formed on the one surface including the diaphragm of the semiconductor chip, and resin that includes a flow passage opening portion exposing at least a portion of the flow rate detecting unit formed on the diaphragm, and covers the lead frame and the semiconductor chip. A lower side resin portion of the resin covering another surface side of the lead frame, on an opposite side to the one surface side thereof, has a thinned portion that is thinner than a periphery thereof in a region facing a peripheral edge portion of the diaphragm.

Abstract: To obtain a low-pressure-loss physical quantity detection device that can detect a plurality of physical quantities of intake air. A physical quantity detection device of the present invention that detects a plurality of physical quantities of a measured gas flowing in a main passage, the physical quantity detection device includes: a circuit board on which a sensor that detects the plurality of physical quantities and an electronic component that controls the physical quantities are mountable; a circuit board accommodating unit that accommodates the circuit board; and a sub-passage in which a flow sensor is disposed. The circuit board is accommodated in the circuit board accommodating unit on an upstream side of the sub-passage, and disposed in parallel with the measured gas flowing through the main passage.

Abstract: A compact physical quantity detecting device is provided since it is possible to lower the mounting height of a chip package by accommodating the chip package in a notched board. In the physical quantity detecting device of the present invention, a part in a thickness direction of a support body on which a flow rate detection unit and a processing unit are mounted is accommodated in a notch provided in a printed board.

Abstract: An object is to improve measurement accuracy of a thermal air flow meter. A flow-rate measuring device comprising: a sensor assembly having a flow-rate detecting element; a circuit board on which the sensor assembly is mounted; and a housing on which the circuit board is mounted, wherein the sensor assembly is mounted on the circuit board such that a detection portion side of the flow-rate detecting element is closer to the housing, and the sensor assembly includes a contact portion in contact with the housing on the detection portion side.

Abstract: To obtain a physical quantity detection device that can prevent a thermal influence on a sensor due to downsizing. A physical quantity detection device 20 of the present invention includes a measuring unit 213 protruding from an inner wall of a main passage 22 toward a passage center of the main passage. The physical quantity detection device 20 includes at least one of a flow sensor 205 that detects a flow rate of a measured gas 2, an intake air temperature sensor 203 that detects temperature, a pressure sensor 204 that detects pressure, and a humidity sensor 206 that detects humidity, and the sensors are disposed along a protruding direction of the measuring unit 213.

Abstract: A decrease in the accuracy after switching of the heating state can be reduced. The physical quantity detecting device includes: a flow rate detecting unit configured to include a heating element to measure a flow rate of a fluid to be measured; a heating element control unit configured to switch a control state of the heating element to any one of a heating state and a heating suppression state; and a signal processing unit configured to process a measured value of the flow rate detecting unit. When the heating element control unit switches the control state, the signal processing unit processes an estimated value determined based on a measured value of the flow rate detecting unit before the switching for a predetermined period immediately after the switching.

Abstract: Provided is a physical quantity measurement device capable of preventing a sealing of a cavity portion on a back surface side of a diaphragm of a thermal air flow rate sensor while improving measurement accuracy of the thermal air flow rate sensor as compared with the related art. A physical quantity measurement device 20 includes a lead frame 208f having a mounting surface f1 on which a flow rate sensor 205 which is the thermal air flow rate sensor is mounted, and a flow passage forming member 209 disposed on a back surface f2 opposite to the mounting surface f1 of the lead frame 208f.

Abstract: To obtain a chip package positioning structure capable of adjusting a tilt and a position of a chip package with respect to the circuit board and reducing mounting variations. The chip package positioning and fixing structure that positions and fixes, to a circuit board 4, a chip package 5 in which a flow rate detection element 53 is sealed with a resin so that a detection portion is at least exposed, in which the chip package includes a solder fixation portion 52 that fixes the chip package to the circuit board by soldering, and a positioning portion 514 that performs positioning to the circuit board, and the positioning portion is provided closer to the flow rate detection element from the solder fixation portion.

Abstract: Provided is a thermal-type flowmeter which can prevent a reduction of flow rate accuracy and reliability, and an increase of cost of the thermal-type flowmeter compared to the related art, and can add a function of an electrostatic scattering mechanism. The thermal-type flowmeter of the present invention includes a sub-passage into which part of a measurement target gas flowing in a main passage is taken, a flow rate detection element of a flow measurement unit which is disposed in the sub-passage, a circuit package which supports the flow rate detection element, and a substrate to which the circuit package is fixed. The flow rate detection element includes a detection surface to detect a flow rate of the measurement target gas. The detection surface is disposed to face the circuit substrate.