Abstract: An arrangement of a mass intake air flow measurement device suitable for integrating a humidity sensing device as well as a temperature sensing device and a pressure sensing device is provided. A second bypass passage 501 bypassing a bypass passage 205 is formed and a humidity sensing device 500 is mounted in the second bypass passage 501. A second bypass passage inlet 502 and a second bypass passage outlet 503 formed in a wall surface of the bypass passage 205 are opened parallel to the direction of flow of air flowing in the bypass passage 205.

Abstract: In relation to a humidity sensor sensitive to water and contamination, a sensor implementation structure that achieves both protection performance against water and contaminants and measurement performance such as humidity responsiveness is provided. A sensor structure has a mass airflow measurement element that measures a mass airflow flowing in an intake pipe, a humidity sensing element that senses humidity of air flowing in the intake pipe, a housing structural component having a connector that carries out input/output to/from outside and a terminal component of the connector, and a bypass passage that is composed by using part of the housing structural component and takes in part of the air that flows in the intake pipe, the mass airflow measurement element being mounted in the bypass passage; wherein space is provided in the housing structural component in the vicinity of the bypass passage, the humidity sensing element is mounted in the space.

Abstract: A sensor structure is provided so that a dynamic pressure effect caused by airflow is avoided as much as possible even when a mass airflow measurement device is integrated with a pressure measurement device, thereby preventing contaminated substances, water droplets, or the like from arriving at a pressure measurement part. In the sensor structure, the mass airflow measurement device is inserted into a sensor insertion port provided in an intake air tube component including an intake air tube and is fixed to the intake air tube, and a pressure measurement device is mounted in a housing structural component of the mass airflow measurement device for measuring the pressure. The pressure measurement device and the inside of the intake air tube are connected by a pressure intake port provided in the housing structural component.

Abstract: In relation to a humidity sensor sensitive to water and contamination, a sensor implementation structure that achieves both protection performance against water and contaminants and measurement performance such as humidity responsiveness is provided. A sensor structure has a mass airflow measurement element that measures a mass airflow flowing in an intake pipe, a humidity sensing element that senses humidity of air flowing in the intake pipe, a housing structural component having a connector that carries out input/output to/from outside and a terminal component of the connector, and a bypass passage that is composed by using part of the housing structural component and takes in part of the air that flows in the intake pipe, the mass airflow measurement element being mounted in the bypass passage; wherein space is provided in the housing structural component in the vicinity of the bypass passage, the humidity sensing element is mounted in the space.

Abstract: The present invention utilizes self-heating of electronic components to improve a humidity sensing part with low environment resistance, such as a condensation problem and the like, and also to enhance the heat radiation efficiency of electronic components. The humidity sensing part is used in an intake tube of an automobile by integrating, for example, with a heating resister type mass air flow measurement device. A humidity sensing element is mounted on an electronic circuit board in a mass air flow measurement device with the temperature thereof starting to increase immediately after a sensor has been actuated. This urges the temperature of the humidity sensing element to start increasing (being heated) immediately after the sensor has been actuated. To urge the humidity sensing element to be further heated, a base plate is composed of two types of materials, resin and metal.

Abstract: An arrangement of a mass intake air flow measurement device suitable for integrating a humidity sensing device as well as a temperature sensing device and a pressure sensing device is provided. A second bypass passage 501 bypassing a bypass passage 205 is formed and a humidity sensing device 500 is mounted in the second bypass passage 501. A second bypass passage inlet 502 and a second bypass passage outlet 503 formed in a wall surface of the bypass passage 205 are opened parallel to the direction of flow of air flowing in the bypass passage 205.

Abstract: An arrangement of a mass intake air flow measurement device suitable for integrating a humidity sensing device as well as a temperature sensing device and a pressure sensing device is provided. A second bypass passage bypassing a bypass passage is formed and a humidity sensing device is mounted in the second bypass passage. A second bypass passage inlet and a second bypass passage outlet formed in a wall surface of the bypass passage are opened parallel to the direction of flow of air flowing in the bypass passage.

Abstract: In an intake air mass flow measurement device, for preventing clogging in a pressure intake tube due to water or the like entering the pressure intake tube in a device measuring a pressure in the intake air tube, the intake air mass flow measurement device includes a mass air flow measurement device for measuring an intake air mass flow in an intake air tube; and a pressure sensing device for sensing pressure in the intake air tube, the pressure sensing device being integrated with the mass air flow measurement device, and an aperture plane opened to the inside of a main air flow passage for detection of the pressure takes in pressure by using a gap generated between a main air flow passage constituting member and an insertion part of the mass air flow measurement device when a measurement part of the mass air flow measurement device is inserted into the main air flow passage. With this construction, it is possible to provide a structure in which water or the like can hardly clog the pressure intake port.

Abstract: The present invention utilizes self-heating of electronic components to improve a humidity sensing part with low environment resistance, such as a condensation problem and the like, and also to enhance the heat radiation efficiency of electronic components. The humidity sensing part is used in an intake tube of an automobile by integrating, for example, with a heating resister type mass air flow measurement device. A humidity sensing element is mounted on an electronic circuit board in a mass air flow measurement device with the temperature thereof starting to increase immediately after a sensor has been actuated. This urges the temperature of the humidity sensing element to start increasing (being heated) immediately after the sensor has been actuated. To urge the humidity sensing element to be further heated, a base plate is composed of two types of materials, resin and metal.

Abstract: In an intake air mass flow measurement device, for preventing clogging in a pressure intake tube due to water or the like entering the pressure intake tube in a device measuring a pressure in the intake air tube, the intake air mass flow measurement device includes a mass air flow measurement device for measuring an intake air mass flow in an intake air tube; and a pressure sensing device for sensing pressure in the intake air tube, the pressure sensing device being integrated with the mass air flow measurement device, and an aperture plane opened to the inside of a main air flow passage for detection of the pressure takes in pressure by using a gap generated between a main air flow passage constituting member and an insertion part of the mass air flow measurement device when a measurement part of the mass air flow measurement device is inserted into the main air flow passage. With this construction, it is possible to provide a structure in which water or the like can hardly clog the pressure intake port.

Abstract: The conductor wire surface for constituting a circuit formed by print or junction on a substrate formed from a composite member of ceramics, resin, and an inorganic member and from a resin member is coated with glass, resin, solder, or silver paste, thus the corrosion resistance can be improved, and a highly reliable electronic device for car use can be provided. Further, the probing portion necessary for adjustment of the resistance and characteristics and the mounting portion for mounting parts are formed in a shape having no corners at 90° or less, for example, in a circular shape, in an elliptical shape, or in a shape that the corners of a tetragon are rounded (R) or chamfered (C).

Abstract: A structure is disclosed in which a conductive material having corrosiveness equal to or higher than that of the materials constituting electronics circuitry is disposed on halfway of the diffusion path of corrosive gases between an entrance place thereof and the electronics circuitry, whereby the conductive material traps the corrosive gases.

Abstract: The conductor wire surface for constituting a circuit formed by print or junction on a substrate formed from a composite member of ceramics, resin, and an inorganic member and from a resin member is coated with glass, resin, solder, or silver paste, thus the corrosion resistance can be improved, and a highly reliable electronic device for car use can be provided. Further, the probing portion necessary for adjustment of the resistance and characteristics and the mounting portion for mounting parts are formed in a shape having no corners at 90° or less, for example, in a circular shape, in an elliptical shape, or in a shape that the corners of a tetragon are rounded (R) or chamfered (C).

Abstract: A structure is disclosed in which a conductive material having corrosiveness equal to or higher than that of the materials constituting electronics circuitry is disposed on halfway of the diffusion path of corrosive gases between an entrance place thereof and the electronics circuitry, whereby the conductive material traps the corrosive gases.