Abstract: According to one embodiment, a gas processing equipment includes an oxygen remover 2 that removes oxygen contained in exhaust gas G, and a gas processing device 3 that processes pretreated exhaust gas G (P), from which the oxygen has been removed by the oxygen remover 2, with a carbon dioxide absorbent solvent S as a treatment agent.

Abstract: A method for producing an electrode material for a lithium-ion secondary battery. The method includes the following steps: (a) mixing components of a basic ingredient or active substance of electrode material and a conductive carbon material to obtain a conductive carbon material-composited material; (b) mixing the conductive carbon material-composited material and a surface layer-forming material; an (c) burning the mixture obtained at step (b) to obtain the electrode material. Also, a lithium-ion secondary battery including an electrode which includes the material.

Abstract: A method for producing an electrode material for a lithium-ion secondary battery. The method includes the following steps: (a) mixing components of a basic ingredient or active substance of electrode material and a conductive carbon material to obtain a conductive carbon material-composited material; (b) mixing the conductive carbon material-composited material and a surface layer-forming material; an (c) burning the mixture obtained at step (b) to obtain the electrode material. Also, a lithium-ion secondary battery including an electrode which includes the material.

Abstract: Successful communication required between external devices is achieved. A content data processing unit is connected to an external device through a first line. A communication unit is connected to the external device through a second line. The content data processing unit represents, for example, a content data transmitting unit that transmits content data to the external device, or a content data receiving unit that receives the content data from the external device. The communication unit transmits an inquiry signal to the external device through the second line in a state in which the first line is unavailable. For example, in a case where the interface unit is in a standby state, it is possible to inquire a required item to the external device while the state is maintained. Since it is possible to decrease power consumption of the external device as much as possible, it is possible to contribute to saving of energy of the external device.

Abstract: A pair of upper and lower pressure rollers 3, 4 is disposed so that their axes 15, 16 are tilted in a horizontal plane in respective directions opposite to each other with respect to a straight line perpendicular to a welding line of a joint portion J. The pressure rollers 3, 4 are positively driven by corresponding electric motors 63, 64 to thereby roll the joint portion. Thus, steps defined at the joint portion can be smoothed and a step gradient can be reduced to ensure a high degree of joint strength. Thus, it is possible to prevent a step portion from being interfolded into the base material of the meal plates 5, 6.

Abstract: Stereoscopic image information (3D information) can be efficiently transmitted between electronic devices at high speed. Using a capability register (Capability Register) of MHL, the 3D information is transmitted between devices. (1) An MHL sink device transmits a “SET_INT command” immediately after changing the 3D information of the capability register, a 3D_CHG flag of an MHL source device side is set to “1” and the MHL sink device notifies the MHL source device of the 3D information. (2) The MHL source device responds ACK. (3) The MHL source device recognizes that the 3D_CHG flag is set to 1, transmits a “READ_DEVCAP command” in which address information of the 3D information of the capability register is added to the MHL sink device and reads only the 3D information from the capability register. Using a scratchpad register of MHL, the 3D information is transmitted between the devices and detailed 3D control is performed.

Abstract: The present invention makes it possible to increase the reliability of a semiconductor device. A manufacturing method of a semiconductor device according to the present invention includes a step of removing a patterned resist film and the step of removing a patterned resist film includes the steps of: (A) introducing at least a gas containing oxygen into a processing room; (B) starting electric discharge for transforming the gas containing oxygen into plasma; and (C) introducing a water vapor or an alcohol vapor into the processing room. On this occasion, the step (C) is applied either simultaneously with or after the step (B).

Abstract: A manufacturing method for semiconductor devices includes the steps of forming an Ni/Au film that includes an Ni film and an Au film formed over the Ni film over a wiring that is coupled to each of a plurality of electrode pads formed over a principal surface of a semiconductor wafer and arranges each of the electrode pads at a different position, grinding a back surface of the semiconductor wafer, performing reduction treatment on a surface of the Ni/Au film, and forming a solder bump over the Ni/Au film. In the reduction treatment, respective processes of flux application, reflow soldering and cleaning are performed and the solder bump is bonded to the Ni/Au film after the reduction treatment has been completed. Thereby, bonding reliability in flip chip bonding of a semiconductor device is improved.

Abstract: A manufacturing method for semiconductor devices includes the steps of forming an Ni/Au film that includes an Ni film and an Au film formed over the Ni film over a wiring that is coupled to each of a plurality of electrode pads formed over a principal surface of a semiconductor wafer and arranges each of the electrode pads at a different position, grinding a back surface of the semiconductor wafer, performing reduction treatment on a surface of the Ni/Au film, and forming a solder bump over the Ni/Au film. In the reduction treatment, respective processes of flux application, reflow soldering and cleaning are performed and the solder bump is bonded to the Ni/Au film after the reduction treatment has been completed. Thereby, bonding reliability in flip chip bonding of a semiconductor device is improved.

Abstract: Cold rolled material manufacturing equipment includes: an unwinding device for unwinding a hot rolled coil after acid pickling; a joining device, disposed on the exit side of the unwinding device, for joining the tail end of a preceding coil to the leading end of a succeeding coil unwound from the unwinding device; a rolling mill for continuously rolling the coils in one direction; a strip storage device, disposed between the joining device and the rolling mill, for storing a strip to perform continuous rolling during the joining; a strip cutting device for cutting the strip to a desired length; a winding device for winding the rolled coil; a transport device for transporting the coil to the unwinding device so that the coil is rolled a plurality of times; and a rolling speed control device controlling a rolling speed during the joining to a speed lower than a steady rolling speed.

Abstract: Mash seam welding is performed to weld metal plates with thicknesses of 2 mm or more to stabilize the strength of a joint portion, reduce uneven parts of the joint portion, and ensure high strength and reliability of the joint portion. First, two metal plates, clamped with first and second clamping devices, are placed to overlap each other at their end portions. The overlapping portions (L) of the metal plates are pressed together with a pair of upper and lower electrode wheels while welding currents flow to continuously weld the overlapping portions (L) and join the metal plates. The pressing forces applied to the electrode wheels are controlled so that upper and lower welding forces acting upon the overlapping portions are equal to each other during the time when the overlapping portions are continuously welded.

Abstract: A manufacturing method for semiconductor devices includes the steps of forming an Ni/Au film that includes an Ni film and an Au film formed over the Ni film over a wiring that is coupled to each of a plurality of electrode pads formed over a principal surface of a semiconductor wafer and arranges each of the electrode pads at a different position, grinding a back surface of the semiconductor wafer, performing reduction treatment on a surface of the Ni/Au film, and forming a solder bump over the Ni/Au film. In the reduction treatment, respective processes of flux application, reflow soldering and cleaning are performed and the solder bump is bonded to the Ni/Au film after the reduction treatment has been completed. Thereby, bonding reliability in flip chip bonding of a semiconductor device is improved.

Abstract: Cold rolled material manufacturing equipment comprises: an unwinding device for unwinding a hot rolled coil after acid pickling; joining means, disposed on the exit side of the unwinding device, for joining the tail end of a preceding coil to the leading end of a succeeding coil unwound from the unwinding device; a rolling mill for continuously rolling the coils in one direction; a strip storage device, disposed between the joining means and the rolling mill, for storing a strip to perform continuous rolling during the joining; a strip cutting device for cutting the strip to a desired length; a winding device for winding the rolled coil; transport means for transporting the coil to the unwinding device so that the coil is rolled a plurality of times; and a rolling speed control device for controlling a rolling speed during the joining to a lower speed than a steady rolling speed.

Abstract: A sheet storage apparatus includes a sheet discharge path having a sheet discharge outlet; a stack tray disposed on a downstream side of the sheet discharge outlet; a support device disposed between the sheet discharge outlet and the stack tray to load at least a part of a sheet; a sheet end regulation device for regulating a position of at least one end edge of the sheet supported by the support device; and an aligning transport device disposed in the support device to carry the sheet toward the sheet end regulation device. The aligning transport device includes a friction transport body and a transport body travel device, and the friction transport body has a rotating member rolling along the top surface of the sheet supported by the support device, and the rotating member rotates in a direction crossing the travel direction.

Abstract: Cold rolled material manufacturing equipment comprises: an unwinding device for unwinding a hot rolled coil after acid pickling; joining means, disposed on the exit side of the unwinding device, for joining the tail end of a preceding coil to the leading end of a succeeding coil unwound from the unwinding device; a rolling mill for continuously rolling the coils in one direction; a strip storage device, disposed between the joining means and the rolling mill, for storing a strip to perform continuous rolling during the joining; a strip cutting device for cutting the strip to a desired length; a winding device for winding the rolled coil; transport means for transporting the coil to the unwinding device so that the coil is rolled a plurality of times; and a rolling speed control device for controlling a rolling speed during the joining to a lower speed than a steady rolling speed.

Abstract: Successful communication required between external devices is achieved. A content data processing unit is connected to an external device through a first line. A communication unit is connected to the external device through a second line. The content data processing unit represents, for example, a content data transmitting unit that transmits content data to the external device, or a content data receiving unit that receives the content data from the external device. The communication unit transmits an inquiry signal to the external device through the second line in a state in which the first line is unavailable. For example, in a case where the interface unit is in a standby state, it is possible to inquire a required item to the external device while the state is maintained. Since it is possible to decrease power consumption of the external device as much as possible, it is possible to contribute to saving of energy of the external device.

Abstract: The present invention makes it possible to increase the reliability of a semiconductor device. A manufacturing method of a semiconductor device according to the present invention includes a step of removing a patterned resist film and the step of removing a patterned resist film includes the steps of: (A) introducing at least a gas containing oxygen into a processing room; (B) starting electric discharge for transforming the gas containing oxygen into plasma; and (C) introducing a water vapor or an alcohol vapor into the processing room. On this occasion, the step (C) is applied either simultaneously with or after the step (B).

Abstract: A recording apparatus includes a transport roller that transports a sheet by a predetermined transportation amount along a transportation path, a printing unit that records an image on the sheet being transported in synchronization with driving of the transport roller, a position detecting mechanism that detects whether an installation position is vertical installation or horizontal installation, and a transportation amount correcting unit that corrects a transportation amount depending on the detection result of the position detecting mechanism.

Abstract: A paper mount surface is disposed while being inclined in the sheet discharge direction or sheet-discharge orthogonal direction, and first and second support members that support the sheet rear and portion in the sheet discharge direction and rear end portion are disposed to be able to shift between actuation positions inside the tray and retract positions. Then, after collecting sheets on both support members, the support member positioned in the direction orthogonal to the inclined direction of the paper mount surface is first retracted from above the tray, and next, the support member positioned in the inclined direction is retracted to the waiting position.

Abstract: A recording apparatus includes a transport roller that transports a sheet by a predetermined transportation amount along a transportation path, a printing unit that records an image on the sheet being transported in synchronization with driving of the transport roller, a position detecting mechanism that detects whether an installation position is vertical installation or horizontal installation, and a transportation amount correcting unit that corrects a transportation amount depending on the detection result of the position detecting mechanism.