Patents by Inventor Takehiko Saito

Takehiko Saito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190362906
    Abstract: The present invention provides a lithium secondary battery for an ISS dischargeable at not less than 15 ItA when the temperature is ?30 degrees centigrade and chargeable at not less than 50 ItA. The present invention also provides an electrochemical device in which (1) a pressure of 0.3 kgf/cm2 to 1.
    Type: Application
    Filed: January 11, 2017
    Publication date: November 28, 2019
    Inventors: Takehiko SAWAI, Shinji SAITO, Kazunori URAO
  • Patent number: 10432067
    Abstract: A control circuit controls, based on detection values of Hall-effect sensors, an inverter circuit to activate a rotor. After the activation of the rotor, the control circuit controls the rotational speed of the rotor based on the detection value of the Hall-effect sensor. A sensor pin is arranged in a slot between a forward-wound portion and a reverse-wound portion of a U-phase winding. A sensor pin is arranged in a slot between a forward-wound portion and a reverse-wound portion of a V-phase winding. A sensor pin is located on one side in an axial direction with respect to the reverse-wound portion of the U-phase winding. The sensor pins are located respectively at two first positions.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: October 1, 2019
    Assignees: DENSO CORPORATION, ASMO CO., LTD.
    Inventors: Taishi Iwanaga, Shigeki Uchiyama, Takehide Omura, Takuya Saito, Takehiko Ohshita
  • Publication number: 20190288280
    Abstract: Provided is positive electrode material for a highly safe lithium-ion secondary battery that can charge and discharge a large current while having long service life. Disclosed are composite particles comprising: particles of lithium-containing phosphate; and carbon coating comprising at least one carbon material selected from the group consisting of (i) fibrous carbon material, (ii) chain-like carbon material, and (iii) carbon material produced by linking together fibrous carbon material and chain-like carbon material, wherein each particle is coated with the carbon coating. The fibrous carbon material is preferably a carbon nanotube with an average fiber size of 5 to 200 nm. The chain-like carbon material is preferably carbon black produced by linking, like a chain, primary particles with an average particle size of 10 to 100 nm. The lithium-containing phosphate is preferably LiFePO4, LiMnPO4, LiMnxFe(1-x)PO4, LiCoPO4, or Li3V2(PO4)3.
    Type: Application
    Filed: June 3, 2019
    Publication date: September 19, 2019
    Applicant: DENKA COMPANY LIMITED
    Inventors: Takashi KAWASAKI, Nobuyuki YOSHINO, Hiroshi MURATA, Takehiko SAWAI, Shinji SAITO, Kazunori URAO
  • Patent number: 10403893
    Abstract: A positive electrode material is used to produce a positive electrode of a lithium secondary battery, the positive electrode material being a composite lithium material that includes a first lithium compound and a second lithium compound. For instance, the first lithium compound is in the form of particles and comprises at least one compound selected from a layered lithium compound and a spinel-type lithium compound. Preferably, the second lithium compound comprises at least one compound selected from a lithium-containing phosphate compound and a lithium-containing silicate compound. An amorphous carbon material layer and/or graphene-structured carbon material layer is present on the entire surface of the first lithium compound and the second lithium compound. The second lithium compound forms a thin-film layer on part or the entirety of the carbon material layer present on the surface of the first lithium compound particles.
    Type: Grant
    Filed: August 21, 2014
    Date of Patent: September 3, 2019
    Assignees: HYDRO-QUEBEC, SEI CORPORATION
    Inventors: Takehiko Sawai, Shinji Saito, Kazunori Urao, Kazuma Hanai, Karim Zaghib, Abdelbast Guerfi, Martin Dontigny
  • Publication number: 20190160422
    Abstract: Disclosed herein are acid gas absorbents that afford high acid gas (CO2) absorption amount per unit volume and high absorption speed and can prevent the absorbent components from diffusing. Also disclosed herein is a method and device for removing an acid gas, in which the energy required for separating the acid gas and regenerating the absorbent is reduced, are provided.
    Type: Application
    Filed: November 27, 2018
    Publication date: May 30, 2019
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORPORATION
    Inventors: Shinji Murai, Yukishige Maezawa, Tetsuya Kaseda, Takehiko Muramatsu, Satoshi Saito, Mitsuru Udatsu, Daigo Muraoka, Masatoshi Hodotsuka
  • Patent number: 10231017
    Abstract: Successful communication required between external devices is achieved. A content data processing unit is connected to an external device through a first line. A communication unit is connected to the external device through a second line. The content data processing unit represents, for example, a content data transmitting unit that transmits content data to the external device, or a content data receiving unit that receives the content data from the external device. The communication unit transmits an inquiry signal to the external device through the second line in a state in which the first line is unavailable. For example, in a case where the interface unit is in a standby state, it is possible to inquire a required item to the external device while the state is maintained. Since it is possible to decrease power consumption of the external device as much as possible, it is possible to contribute to saving of energy of the external device.
    Type: Grant
    Filed: October 15, 2013
    Date of Patent: March 12, 2019
    Assignee: SONY CORPORATION
    Inventors: Akihiko Tao, Takehiko Saito
  • Patent number: 9931718
    Abstract: A pair of upper and lower pressure rollers 3, 4 is disposed so that their axes 15, 16 are tilted in a horizontal plane in respective directions opposite to each other with respect to a straight line perpendicular to a welding line of a joint portion J. The pressure rollers 3, 4 are positively driven by corresponding electric motors 63, 64 to thereby roll the joint portion. Thus, steps defined at the joint portion can be smoothed and a step gradient can be reduced to ensure a high degree of joint strength. Thus, it is possible to prevent a step portion from being interfolded into the base material of the meal plates 5, 6.
    Type: Grant
    Filed: July 11, 2008
    Date of Patent: April 3, 2018
    Assignee: PRIMETALS TECHNOLOGIES JAPAN, LTD.
    Inventors: Shinichi Kaga, Noriaki Tominaga, Takehiko Saito, Mitsuru Onose, Yasutsugu Yoshimura, Hirotoshi Tagata, Yujiro Watanabe, Satoru Zenitani, Ikuo Wakamoto
  • Patent number: 9628872
    Abstract: Stereoscopic image information (3D information) can be efficiently transmitted between electronic devices at high speed. Using a capability register (Capability Register) of MHL, the 3D information is transmitted between devices. (1) An MHL sink device transmits a “SET_INT command” immediately after changing the 3D information of the capability register, a 3D_CHG flag of an MHL source device side is set to “1” and the MHL sink device notifies the MHL source device of the 3D information. (2) The MHL source device responds ACK. (3) The MHL source device recognizes that the 3D_CHG flag is set to 1, transmits a “READ_DEVCAP command” in which address information of the 3D information of the capability register is added to the MHL sink device and reads only the 3D information from the capability register. Using a scratchpad register of MHL, the 3D information is transmitted between the devices and detailed 3D control is performed.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: April 18, 2017
    Assignee: SONY CORPORATION
    Inventors: Akihiko Tao, Takehiko Saito
  • Patent number: 9589787
    Abstract: The present invention makes it possible to increase the reliability of a semiconductor device. A manufacturing method of a semiconductor device according to the present invention includes a step of removing a patterned resist film and the step of removing a patterned resist film includes the steps of: (A) introducing at least a gas containing oxygen into a processing room; (B) starting electric discharge for transforming the gas containing oxygen into plasma; and (C) introducing a water vapor or an alcohol vapor into the processing room. On this occasion, the step (C) is applied either simultaneously with or after the step (B).
    Type: Grant
    Filed: January 9, 2015
    Date of Patent: March 7, 2017
    Assignee: Renesas Electronics Corporation
    Inventors: Toru Shinaki, Takehiko Saito, Yoshinori Kondo, Masatoshi Fukushima
  • Publication number: 20160247772
    Abstract: A manufacturing method for semiconductor devices includes the steps of forming an Ni/Au film that includes an Ni film and an Au film formed over the Ni film over a wiring that is coupled to each of a plurality of electrode pads formed over a principal surface of a semiconductor wafer and arranges each of the electrode pads at a different position, grinding a back surface of the semiconductor wafer, performing reduction treatment on a surface of the Ni/Au film, and forming a solder bump over the Ni/Au film. In the reduction treatment, respective processes of flux application, reflow soldering and cleaning are performed and the solder bump is bonded to the Ni/Au film after the reduction treatment has been completed. Thereby, bonding reliability in flip chip bonding of a semiconductor device is improved.
    Type: Application
    Filed: May 5, 2016
    Publication date: August 25, 2016
    Inventors: Takaomi Nishi, Takehiko Saito, Katsuhiro Torii
  • Patent number: 9362241
    Abstract: A manufacturing method for semiconductor devices includes the steps of forming an Ni/Au film that includes an Ni film and an Au film formed over the Ni film over a wiring that is coupled to each of a plurality of electrode pads formed over a principal surface of a semiconductor wafer and arranges each of the electrode pads at a different position, grinding a back surface of the semiconductor wafer, performing reduction treatment on a surface of the Ni/Au film, and forming a solder bump over the Ni/Au film. In the reduction treatment, respective processes of flux application, reflow soldering and cleaning are performed and the solder bump is bonded to the Ni/Au film after the reduction treatment has been completed. Thereby, bonding reliability in flip chip bonding of a semiconductor device is improved.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: June 7, 2016
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Takaomi Nishi, Takehiko Saito, Katsuhiro Torii
  • Patent number: 9352367
    Abstract: Cold rolled material manufacturing equipment includes: an unwinding device for unwinding a hot rolled coil after acid pickling; a joining device, disposed on the exit side of the unwinding device, for joining the tail end of a preceding coil to the leading end of a succeeding coil unwound from the unwinding device; a rolling mill for continuously rolling the coils in one direction; a strip storage device, disposed between the joining device and the rolling mill, for storing a strip to perform continuous rolling during the joining; a strip cutting device for cutting the strip to a desired length; a winding device for winding the rolled coil; a transport device for transporting the coil to the unwinding device so that the coil is rolled a plurality of times; and a rolling speed control device controlling a rolling speed during the joining to a speed lower than a steady rolling speed.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: May 31, 2016
    Assignee: PRIMETALS TECHNOLOGIES JAPAN, LTD.
    Inventors: Shinichi Kaga, Mitsuru Onose, Noriaki Tominaga, Takehiko Saito, Yasutsugu Yoshimura
  • Patent number: 9278406
    Abstract: Mash seam welding is performed to weld metal plates with thicknesses of 2 mm or more to stabilize the strength of a joint portion, reduce uneven parts of the joint portion, and ensure high strength and reliability of the joint portion. First, two metal plates, clamped with first and second clamping devices, are placed to overlap each other at their end portions. The overlapping portions (L) of the metal plates are pressed together with a pair of upper and lower electrode wheels while welding currents flow to continuously weld the overlapping portions (L) and join the metal plates. The pressing forces applied to the electrode wheels are controlled so that upper and lower welding forces acting upon the overlapping portions are equal to each other during the time when the overlapping portions are continuously welded.
    Type: Grant
    Filed: September 24, 2010
    Date of Patent: March 8, 2016
    Assignee: PRIMETALS TECHNOLOGIES JAPAN, INC.
    Inventors: Shinichi Kaga, Mitsuru Onose, Noriaki Tominaga, Takehiko Saito, Yasutsugu Yoshimura, Hirotomo Tagata, Keiichi Sato
  • Publication number: 20160064343
    Abstract: A manufacturing method for semiconductor devices includes the steps of forming an Ni/Au film that includes an Ni film and an Au film formed over the Ni film over a wiring that is coupled to each of a plurality of electrode pads formed over a principal surface of a semiconductor wafer and arranges each of the electrode pads at a different position, grinding a back surface of the semiconductor wafer, performing reduction treatment on a surface of the Ni/Au film, and forming a solder bump over the Ni/Au film. In the reduction treatment, respective processes of flux application, reflow soldering and cleaning are performed and the solder bump is bonded to the Ni/Au film after the reduction treatment has been completed. Thereby, bonding reliability in flip chip bonding of a semiconductor device is improved.
    Type: Application
    Filed: August 18, 2015
    Publication date: March 3, 2016
    Inventors: Takaomi Nishi, Takehiko Saito, Katsuhiro Torii
  • Publication number: 20150367391
    Abstract: Cold rolled material manufacturing equipment comprises: an unwinding device for unwinding a hot rolled coil after acid pickling; joining means, disposed on the exit side of the unwinding device, for joining the tail end of a preceding coil to the leading end of a succeeding coil unwound from the unwinding device; a rolling mill for continuously rolling the coils in one direction; a strip storage device, disposed between the joining means and the rolling mill, for storing a strip to perform continuous rolling during the joining; a strip cutting device for cutting the strip to a desired length; a winding device for winding the rolled coil; transport means for transporting the coil to the unwinding device so that the coil is rolled a plurality of times; and a rolling speed control device for controlling a rolling speed during the joining to a lower speed than a steady rolling speed.
    Type: Application
    Filed: September 2, 2015
    Publication date: December 24, 2015
    Applicant: PRIMETALS TECHNOLOGIES JAPAN, LTD.
    Inventors: SHINICHI KAGA, MITSURU ONOSE, NORIAKI TOMINAGA, TAKEHIKO SAITO, YASUTSUGU YOSHIMURA
  • Patent number: 9174816
    Abstract: A sheet storage apparatus includes a sheet discharge path having a sheet discharge outlet; a stack tray disposed on a downstream side of the sheet discharge outlet; a support device disposed between the sheet discharge outlet and the stack tray to load at least a part of a sheet; a sheet end regulation device for regulating a position of at least one end edge of the sheet supported by the support device; and an aligning transport device disposed in the support device to carry the sheet toward the sheet end regulation device. The aligning transport device includes a friction transport body and a transport body travel device, and the friction transport body has a rotating member rolling along the top surface of the sheet supported by the support device, and the rotating member rotates in a direction crossing the travel direction.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: November 3, 2015
    Assignee: NISCA CORPORATION
    Inventors: Takehiko Saito, Satoshi Yamanushi, Tatsuzo Aoyagi, Yuichi Ichinose, Yusuke Saito
  • Patent number: 9156070
    Abstract: Cold rolled material manufacturing equipment comprises: an unwinding device for unwinding a hot rolled coil after acid pickling; joining means, disposed on the exit side of the unwinding device, for joining the tail end of a preceding coil to the leading end of a succeeding coil unwound from the unwinding device; a rolling mill for continuously rolling the coils in one direction; a strip storage device, disposed between the joining means and the rolling mill, for storing a strip to perform continuous rolling during the joining; a strip cutting device for cutting the strip to a desired length; a winding device for winding the rolled coil; transport means for transporting the coil to the unwinding device so that the coil is rolled a plurality of times; and a rolling speed control device for controlling a rolling speed during the joining to a lower speed than a steady rolling speed.
    Type: Grant
    Filed: November 20, 2006
    Date of Patent: October 13, 2015
    Assignee: PRIMETALS TECHNOLOGIES JAPAN, LTD.
    Inventors: Shinichi Kaga, Mitsuru Onose, Noriaki Tominaga, Takehiko Saito, Yasutsugu Yoshimura
  • Publication number: 20150249862
    Abstract: Successful communication required between external devices is achieved. A content data processing unit is connected to an external device through a first line. A communication unit is connected to the external device through a second line. The content data processing unit represents, for example, a content data transmitting unit that transmits content data to the external device, or a content data receiving unit that receives the content data from the external device. The communication unit transmits an inquiry signal to the external device through the second line in a state in which the first line is unavailable. For example, in a case where the interface unit is in a standby state, it is possible to inquire a required item to the external device while the state is maintained. Since it is possible to decrease power consumption of the external device as much as possible, it is possible to contribute to saving of energy of the external device.
    Type: Application
    Filed: October 15, 2013
    Publication date: September 3, 2015
    Inventors: Akihiko Tao, Takehiko Saito
  • Publication number: 20150214106
    Abstract: The present invention makes it possible to increase the reliability of a semiconductor device. A manufacturing method of a semiconductor device according to the present invention includes a step of removing a patterned resist film and the step of removing a patterned resist film includes the steps of: (A) introducing at least a gas containing oxygen into a processing room; (B) starting electric discharge for transforming the gas containing oxygen into plasma; and (C) introducing a water vapor or an alcohol vapor into the processing room. On this occasion, the step (C) is applied either simultaneously with or after the step (B).
    Type: Application
    Filed: January 9, 2015
    Publication date: July 30, 2015
    Applicant: RENESAS ELECTRONICS CORPORATION
    Inventors: Toru SHINAKI, Takehiko SAITO, Yoshinori KONDO, Masatoshi FUKUSHIMA
  • Patent number: 8960837
    Abstract: A recording apparatus includes a transport roller that transports a sheet by a predetermined transportation amount along a transportation path, a printing unit that records an image on the sheet being transported in synchronization with driving of the transport roller, a position detecting mechanism that detects whether an installation position is vertical installation or horizontal installation, and a transportation amount correcting unit that corrects a transportation amount depending on the detection result of the position detecting mechanism.
    Type: Grant
    Filed: April 17, 2014
    Date of Patent: February 24, 2015
    Assignee: Seiko Epson Corporation
    Inventors: Takehiko Saito, Sanshiro Takeshita