Abstract: Transient liquid phase compositions and bonding assemblies are disclosed. In one embodiment, a transient liquid phase composition includes a plurality of particles. Each particle includes a core, an inner shell surrounding the core, the inner shell, and an outer shell surrounding the inner shell. The core is made of a first high melting temperature material, the inner shell is made of a second high melting temperature material, and the outer shell is made of a low melting temperature material. The melting temperature of the low melting temperature material is less than the melting temperature of both the first and second high melting temperature materials.

Abstract: A method of manufacturing a substrate includes applying solder resist ink containing a mixing resin of epoxy-based resin and acrylic-based resin on at least one surface of a substrate body to form a solder resist layer, and irradiating a predetermined portion of the solder resist layer with ultraviolet rays and controlling an amount of irradiation of the ultraviolet rays irradiated to the predetermined of the solder resist layer to form the predetermined portion in transmissivity that transmits light.

Abstract: A semiconductor device in which a first region of a first conductivity type, a second region of a second conductivity type, and a third region of the first conductivity type are laminated in this order from a front surface side of a semiconductor substrate, a trench gate electrode extending to the third region through the first region and the second region is formed, a front surface electrode is formed on the front surface, and an insulating region covering a top surface of the trench gate electrode insulates the front surface electrode and the trench gate electrode is known. The insulating region is formed to stay within a trench. The front surface electrode is formed on the front surface with no step and extends uniformly. Generation of stress concentration on the front surface electrode is suppressed, and strength and reliability of the front surface electrode may be improved.

Abstract: A double-sided bonding process using transient liquid phase (TLP) bonding structure. A first side of an electronic device is processed to partially complete bonding. A second side of the electronic device is processed to complete bonding. The first side completes bonding during the processing of the second side. This reduces the time needed for the bonding process of both sides. This process allows for various TLP bonding parameters while being compatible with conventional fabrication systems.

Abstract: A double-sided bonding process using transient liquid phase (TLP) bonding structure. A first side of an electronic device is processed to partially complete bonding. A second side of the electronic device is processed to complete bonding. The first side completes bonding during the processing of the second side. This reduces the time needed for the bonding process of both sides. This process allows for various TLP bonding parameters while being compatible with conventional fabrication systems.

Abstract: An IGBT manufacturing method is provided. The IGBT has an n-type emitter region, a p-type top body region, an n-type intermediate region, a p-type bottom body region, an n-type drift region, a p-type collector region, trenches penetrating the emitter region, the top body region, the intermediate region and the bottom body region from an upper surface of a semiconductor substrate and reaching the drift region, and gate electrodes formed in the trenches. The method includes forming the trenches on the upper surface of the semiconductor substrate, forming the insulating film in the trenches, forming an electrode layer on the semiconductor substrate and in the trenches after forming the insulating film, planarizing an upper surface of the electrode layer, and implanting n-type impurities to a depth of the intermediate region from the upper surface side of the semiconductor substrate after planarizing the upper surface of the electrode layer.

Abstract: A laminated electrode disposed on a substrate includes a first layer disposed at a top surface and a second layer directly joined to the first layer. A material of the first layer is gold. A material of the second layer is nickel silicide.

Abstract: A semiconductor manufacturing device includes a stage, a plurality of pins, and a driving unit. The stage includes a mounting surface. The mounting surface has a first region for mounting thereon a substrate, and a second region for mounting thereon a focus ring. The second region is provided to surround the first region. A plurality of holes is formed in the stage. The holes extend in a direction that intersects the mounting surface while passing through the boundary between the first region and the second region. The pins are provided in the respective holes. Each of the pins has a first and a second upper end surface. The second. upper end surface is provided above the first upper end surface, and is offset towards the first region with respect to the first upper end surface. The driving unit moves the pins up and down in the aforementioned direction.

Abstract: A transfer apparatus transfers an object to be transferred onto a case. The transfer apparatus includes a transfer arm, an arm shaft, a plurality of electromagnets, and a control unit. The transfer arm has a pick unit on a front end thereof and extends and retracts in a horizontal direction. The object to be transferred is held on the pick unit. The arm shaft supports the transfer arm. The plurality of electromagnets apply an force in upward direction to the transfer arm by generating a magnetic field in the case. The control unit controls the plurality of electromagnets in such a manner that when the transfer arm extends and retracts in the horizontal direction, the force in upward direction applied to the transfer arm increases as a length from the arm shaft to the front end of the transfer arm increases.

Abstract: A substrate processing apparatus which enables the work efficiency of maintenance to be improved. The substrate processing apparatus comprises a plurality of processing chambers 100 for carrying out plasma processing on a wafer to be processed. Each processing chamber 100 has a chamber lid 200 that can be suspended and supported by a crane unit 500. The crane unit 500 comprises an air cylinder 510 and a linear guide 520. The air cylinder 510 holds the chamber lid 200 movably in a vertical direction thereabove. The linear guide 520 holds the chamber lid 200 movably in a horizontal direction.

Abstract: A raw material including a mixture of a natural fiber and a thermoplastic fiber is supplied to a surface of a rotating rotary body. The natural and thermoplastic fibers are scattered toward a carrying surface of a conveyor belt by the rotational force of the rotary body. An air blower may direct pressurized air to the scattered raw material in order to further effect separation of the natural and thermoplastic fibers. Consequently, the natural fibers and the thermoplastic fibers are deposited such that the relative concentration of the natural fibers and the thermoplastic fibers gradually and seamlessly changes or varies across the thickness of depth of the resulting molded fiber material.

Abstract: To provide a fiberboard capable of reducing a load on the environment at all states of producing, using, and abolishing and moreover having a high degree of bending strength and a high bending-strength retention rate at high temperature and high humidity so as to be usable for an automobile interior material or building material and a fiber-board producing method. The fiberboard is formed by mixing natural fiber with polylactic acid resin serving as a binder and has an apparent density of 0.2 g/cm3.

Abstract: A substrate processing apparatus which enables the work efficiency of maintenance to be improved. The substrate processing apparatus comprises a plurality of processing chambers 100 for carrying out plasma processing on a wafer to be processed. Each processing chamber 100 has a chamber lid 200 that can be suspended and supported by a crane unit 500. The crane unit 500 comprises an air cylinder 510 and a linear guide 520. The air cylinder 510 holds the chamber lid 200 movably in a vertical direction thereabove. The linear guide 520 holds the chamber lid 200 movably in a horizontal direction.

Abstract: In the correction of the quantity of light of a light source used in an image reader which irradiates an original document with the light source, receives the reflected light by a CCD and reads the original document image, at the time of a document moving mode in which the document moves, correction of the quantity of irradiation light of the light source is performed by reading a first standard white board which extends over the whole area in the main scanning direction, prior to the initiation of readout of the moving document, and upon initiation of readout of the moving document, a second standard white board arranged outside the document passing area is read by using the same light source, with the read operation of the moving document, and correction of the quantity of irradiation light of the light source is performed based on the reflected light from the second white board.

Abstract: To provide a fiberboard capable of reducing a load on the environment at all states of producing, using, and abolishing and moreover having a high degree of bending strength and a high bending-strength retention rate at high temperature and high humidity so as to be usable for an automobile interior material or building material and a fiber-board producing method. The fiberboard is formed by mixing natural fiber with polylactic acid resin serving as a binder and has an apparent density of 0.2 g/cm3.

Abstract: A raw material (12) comprising a mixture of a natural fiber and a thermoplastic fiber is supplied to the surface of the rotating rotary body (11). The natural and thermoplastic fibers are scattered toward the carrying surface of the conveyor belt (15) by the rotational force of the rotary body (11). An air blower (14) may direct pressurized air to the scattered raw material (14) in order to further effect separation of the natural and thermoplastic fibers. Consequently, the natural fibers and the thermoplastic fibers are deposited such that the relative concentration of the natural fibers and the thermoplastic fibers gradually and seamlessly changes or varies across the thickness or depth of the resulting molded fiber material (50).